IEEE Transactions on Biomedical Circuits and Systems最新文献

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System-on-Chip Considerations for Heterogeneous Integration of CMOS and Fluidic Bio-Interfaces. 片上系统对CMOS和流体生物接口异质集成的考虑。
IF 5.1 2区 医学
IEEE Transactions on Biomedical Circuits and Systems Pub Date : 1900-01-01 DOI: 10.1109/TBCAS.2016.2522402
Timir Datta-Chaudhuri, E. Smela, P. Abshire
{"title":"System-on-Chip Considerations for Heterogeneous Integration of CMOS and Fluidic Bio-Interfaces.","authors":"Timir Datta-Chaudhuri, E. Smela, P. Abshire","doi":"10.1109/TBCAS.2016.2522402","DOIUrl":"https://doi.org/10.1109/TBCAS.2016.2522402","url":null,"abstract":"CMOS chips are increasingly used for direct sensing and interfacing with fluidic and biological systems. While many biosensing systems have successfully combined CMOS chips for readout and signal processing with passive sensing arrays, systems that co-locate sensing with active circuits on a single chip offer significant advantages in size and performance but increase the complexity of multi-domain design and heterogeneous integration. This emerging class of lab-on-CMOS systems also poses distinct and vexing technical challenges that arise from the disparate requirements of biosensors and integrated circuits (ICs). Modeling these systems must address not only circuit design, but also the behavior of biological components on the surface of the IC and any physical structures. Existing tools do not support the cross-domain simulation of heterogeneous lab-on-CMOS systems, so we recommend a two-step modeling approach: using circuit simulation to inform physics-based simulation, and vice versa. We review the primary lab-on-CMOS implementation challenges and discuss practical approaches to overcome them. Issues include new versions of classical challenges in system-on-chip integration, such as thermal effects, floor-planning, and signal coupling, as well as new challenges that are specifically attributable to biological and fluidic domains, such as electrochemical effects, non-standard packaging, surface treatments, sterilization, microfabrication of surface structures, and microfluidic integration. We describe these concerns as they arise in lab-on-CMOS systems and discuss solutions that have been experimentally demonstrated.","PeriodicalId":13151,"journal":{"name":"IEEE Transactions on Biomedical Circuits and Systems","volume":"10 6 1","pages":"1129-1142"},"PeriodicalIF":5.1,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TBCAS.2016.2522402","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62965834","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"医学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
A Mixed-Signal VLSI System for Producing Temporally Adapting Intraspinal Microstimulation Patterns for Locomotion. 一种产生时间适应的脊柱内微刺激模式的混合信号VLSI系统。
IF 5.1 2区 医学
IEEE Transactions on Biomedical Circuits and Systems Pub Date : 1900-01-01 DOI: 10.1109/TBCAS.2015.2501419
K. Mazurek, B. J. Holinski, D. Everaert, V. Mushahwar, R. Etienne-Cummings
{"title":"A Mixed-Signal VLSI System for Producing Temporally Adapting Intraspinal Microstimulation Patterns for Locomotion.","authors":"K. Mazurek, B. J. Holinski, D. Everaert, V. Mushahwar, R. Etienne-Cummings","doi":"10.1109/TBCAS.2015.2501419","DOIUrl":"https://doi.org/10.1109/TBCAS.2015.2501419","url":null,"abstract":"Neural pathways can be artificially activated through the use of electrical stimulation. For individuals with a spinal cord injury, intraspinal microstimulation, using electrical currents on the order of 125 μ A, can produce muscle contractions and joint torques in the lower extremities suitable for restoring walking. The work presented here demonstrates an integrated circuit implementing a state-based control strategy where sensory feedback and intrinsic feed forward control shape the stimulation waveforms produced on-chip. Fabricated in a 0.5 μ m process, the device was successfully used in vivo to produce walking movements in a model of spinal cord injury. This work represents progress towards an implantable solution to be used for restoring walking in individuals with spinal cord injuries.","PeriodicalId":13151,"journal":{"name":"IEEE Transactions on Biomedical Circuits and Systems","volume":"10 4 1","pages":"902-11"},"PeriodicalIF":5.1,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TBCAS.2015.2501419","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62965383","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"医学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
High density, high radiance μLED matrix for optogenetic retinal prostheses and planar neural stimulation 用于光遗传视网膜假体和平面神经刺激的高密度、高亮度μLED基质
IF 5.1 2区 医学
IEEE Transactions on Biomedical Circuits and Systems Pub Date : 1900-01-01 DOI: 10.1109/TBCAS.2016.2623949
A. Soltan, B. McGovern, E. Drakakis, M. Neil, P. Maaskant, M. Akhter, J. Lee, P. Degenaar
{"title":"High density, high radiance μLED matrix for optogenetic retinal prostheses and planar neural stimulation","authors":"A. Soltan, B. McGovern, E. Drakakis, M. Neil, P. Maaskant, M. Akhter, J. Lee, P. Degenaar","doi":"10.1109/TBCAS.2016.2623949","DOIUrl":"https://doi.org/10.1109/TBCAS.2016.2623949","url":null,"abstract":"Optical neuron stimulation arrays are important for both in-vitro biology and retinal prosthetic biomedical applications. Hence, in this work, we present an 8100 pixel high radiance photonic stimulator. The chip module vertically combines custom made gallium nitride μLEDs with a CMOS application specific integrated circuit. This is designed with active pixels to ensure random access and to allow continuous illumination of all required pixels. The μLEDs have been assembled on the chip using a solder ball flip-chip bonding technique which has allowed for reliable and repeatable manufacture. We have evaluated the performance of the matrix by measuring the different factors including the static, dynamic power consumption, the illumination, and the current consumption by each LED. We show that the power consumption is within a range suitable for portable use. Finally, the thermal behavior of the matrix is monitored and the matrix proved to be thermally stable.","PeriodicalId":13151,"journal":{"name":"IEEE Transactions on Biomedical Circuits and Systems","volume":"11 1","pages":"347-359"},"PeriodicalIF":5.1,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TBCAS.2016.2623949","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62966201","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"医学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 27
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