IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society最新文献_第7页

Real-Time Simulation of a Fast Charger Using a Low-Cost FPGA Platform 基于低成本FPGA平台的快速充电器实时仿真

IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society Pub Date : 2022-10-17 DOI: 10.1109/IECON49645.2022.9968433

Karim Meddah, H. Chalangar, T. O. Bachir

引用次数: 2

On-line Capacity Estimation of Li-ion battery Using Semi-parametric Transfer Learning 基于半参数迁移学习的锂离子电池容量在线估计

IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society Pub Date : 2022-10-17 DOI: 10.1109/IECON49645.2022.9969047

A. Mondal, A. Routray, Sreeraj Puravankara

引用次数: 0

Integration of Energy Storage Systems within Modular Multilevel Converters for Medium-Voltage Distribution Networks 中压配电网模块化多电平变流器内储能系统的集成

IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society Pub Date : 2022-10-17 DOI: 10.1109/IECON49645.2022.9968995

P. Meloni, A. Serpi

引用次数: 0

Design of a Torsion Torque Estimator that Includes a Backlash Model for a Load-Side Angle Control System that Consists of a Motor, a Reduction Gear, a Spring, and Motor/Load-Side Encoders 一个扭转扭矩估计器的设计，包括一个负载侧角度控制系统，由电机，减速器，弹簧和电机/负载侧编码器的一个间隙模型

IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society Pub Date : 2022-10-17 DOI: 10.1109/IECON49645.2022.9968682

Yuto Ikeda, D. Yashiro, K. Yubai, S. Komada

引用次数: 0

Machine Learning-Based Agoraphilic Navigation Algorithm 基于机器学习的广场导航算法

IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society Pub Date : 2022-10-17 DOI: 10.1109/IECON49645.2022.9968327

H. Hewawasam, M. Ibrahim, G. Kahandawa

{"title":"Machine Learning-Based Agoraphilic Navigation Algorithm","authors":"H. Hewawasam, M. Ibrahim, G. Kahandawa","doi":"10.1109/IECON49645.2022.9968327","DOIUrl":"https://doi.org/10.1109/IECON49645.2022.9968327","url":null,"abstract":"This paper presents a novel machine learning-based Agoraphilic (free space attraction) navigation algorithm. The proposed algorithm is capable of undertaking local path planning for mobile robots in unknown dynamic environments with a moving goal. The inability to track and reach a moving goal is one of the common weaknesses of most existing navigation algorithms operating in dynamic environments. High uncertainty involved in dynamic environments is also another major challenge. The novel machine learning-based approach helps the proposed algorithm to successfully overcome these challenges. This paper also introduces the integrated modular-based architecture for free-space attraction-based algorithms. This allows the algorithm to incorporate ten different modules with miscellaneous algorithms to perform sub-tasks such as tracking, prediction, map generation, machine learning-based free space attraction force generation and robot motion command generation. The new modular-based architecture integrates those sub-modules to create the robot’s driving force. This driving force is the single attractive force to pull the robot towards the moving goal via current free space leading to future free space passages. The proposed algorithm was experimentally tested under a dynamic environment. The experiment was focused on testing the behaviour of the algorithm under the challenge of reaching a moving goal. Furthermore, the test results demonstrate that the Agoraphilic algorithm is successful in reaching a moving goal in an unknown dynamically cluttered environment.","PeriodicalId":125740,"journal":{"name":"IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society","volume":"95 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130818384","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Experimental Evaluation of High-Precision System Clock Synchronization with BeiDou for Wide-Area Industrial Internet-of-Things 广域工业物联网中北斗高精度系统时钟同步的实验评估

IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society Pub Date : 2022-10-17 DOI: 10.1109/IECON49645.2022.9968427

Fan Yang, Jinsong Wang, Yuemin Ding, Lantao Xing

{"title":"Experimental Evaluation of High-Precision System Clock Synchronization with BeiDou for Wide-Area Industrial Internet-of-Things","authors":"Fan Yang, Jinsong Wang, Yuemin Ding, Lantao Xing","doi":"10.1109/IECON49645.2022.9968427","DOIUrl":"https://doi.org/10.1109/IECON49645.2022.9968427","url":null,"abstract":"High-precision clock synchronization is required for many industrial Internet of Things (IIoTs) supporting real-time monitoring and control for applications, such as the smart grid. For high-precision clock synchronization in IIoTs, several approaches can be used, such as the IEEE 1588 protocol, the Network Time Protocol (NTP), and the Global Navigation Satellite System (GNSS) based methods. Among them, the GNSS-based methods are more appropriate for IIoTs distributed in wide areas. It has been reported that nanosecond-level time synchronization can be achieved by GNSS receivers. However, the end-to-end accuracy of the system clocks in the application processor is a different story. In this study, an experimental testbed has been built using the open-source Linux system, the BeiDou receiver, and the open-source Raspberry Pi 4 hardware. The Pulse-Per-Second (PPS) signals from the BeiDou receiver are used as the reference to synchronize the system clocks. With a one-second synchronization interval, experiments indicate that the system clock achieves an accuracy of 1 µs with a success rate of 92.7% and 2 µs with a success rate of 99.7%. While increasing the synchronization interval, the system clock relies more on the local crystal oscillator, and the timing error increases to 100 µs in 500 seconds.","PeriodicalId":125740,"journal":{"name":"IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131019476","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Design of Transformerless Microinverter using a High Gain DC-DC Converter and PUC Inverter 采用高增益DC-DC变换器和PUC逆变器的无变压器微型逆变器的设计

IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society Pub Date : 2022-10-17 DOI: 10.1109/IECON49645.2022.9968659

Ahmed Abu-Humaid, L. Ben‐Brahim, A. Gastli, M. Djemai

{"title":"Design of Transformerless Microinverter using a High Gain DC-DC Converter and PUC Inverter","authors":"Ahmed Abu-Humaid, L. Ben‐Brahim, A. Gastli, M. Djemai","doi":"10.1109/IECON49645.2022.9968659","DOIUrl":"https://doi.org/10.1109/IECON49645.2022.9968659","url":null,"abstract":"Transformerless inverters offer several advantages such as system compactness, lower cost, and lower overall power loss. However, for PV applications, there is a need for a frontal high-gain step-up DC-DC converter to use the transformerless inverter as a grid-tied micro-inverter (μ-inverter). In this paper, a single switching device high gain boost DC-DC converter based on Quadratic Boost Converter (QBC) is used along a 7-level packed-U-cells (PUC) inverter to realize the transformerless μ-inverter. The MPPT uses Perturbs & Observes (P&O) algorithm to control the front-end QBC to extract the maximum power from the PV array. Finite-set model predictive control (FS-MPC) technique is used to control the grid-tied single-phase seven-level PUC inverter using a weighted cost function. In the ideal case, the PUC inverter should deliver the extracted PV power into the grid. This is accomplished automatically by keeping the voltage level of the dc-link capacitor constant. From a control point of view, this means that the front-end QBC and PUC inverter controls are decoupled as they are separated via the dc-link capacitor which must absorb the single-phase oscillating power. A simulation was carried out to validate the performance of the proposed controllers. A grid current THD less than 5% is achieved and a stable operation under various operating conditions is validated with the proposed system. Hardware implementation is under construction and experimental results will be shown in the final paper.","PeriodicalId":125740,"journal":{"name":"IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131057849","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Digital Twin Approach for Remote Monitoring of Microgrids 微电网远程监测的数字孪生方法

IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society Pub Date : 2022-10-17 DOI: 10.1109/IECON49645.2022.9969080

M. Aquib, M. Chandorkar, S. Doolla

{"title":"Digital Twin Approach for Remote Monitoring of Microgrids","authors":"M. Aquib, M. Chandorkar, S. Doolla","doi":"10.1109/IECON49645.2022.9969080","DOIUrl":"https://doi.org/10.1109/IECON49645.2022.9969080","url":null,"abstract":"Monitoring of remote microgrids helps in providing better service to the consumers. Prior idea of location/nature of fault and/or device malfunction saves a lot of time for the maintenance engineer during outrages. Thus, the off-site monitoring of microgrids ensures the proper operation as well as efficient work execution during clearance of fault as it gives an idea for the visiting engineer about the location of fault and malfunctioning devices. In this paper, a digital twin based scheme is presented for monitoring the power flow of remote microgrid. Digital twin is a real-time, physics based simulation integrated with the real physical system and provides the estimate of different characteristics in real-time. A physics based digital twin of the remote microgrid (wherein DGs are controlled with conventional droop scheme) is modeled using simulation and the power flow of the microgrid is monitored using digital twin model. The scheme is validated on a real-time simulation platform (RTSP) for different type of loads. Different cores of the RTSP are used for implementing the physical microgrid system and digital twin based monitoring scheme.","PeriodicalId":125740,"journal":{"name":"IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131198008","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects 灌封剂对焊料互连热疲劳性能的影响

IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society Pub Date : 2022-10-17 DOI: 10.1109/IECON49645.2022.9968578

Leiming Du, Xiujuan Zhao, P. Watté, R. Poelma, W. Driel, G. Zhang

{"title":"Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects","authors":"Leiming Du, Xiujuan Zhao, P. Watté, R. Poelma, W. Driel, G. Zhang","doi":"10.1109/IECON49645.2022.9968578","DOIUrl":"https://doi.org/10.1109/IECON49645.2022.9968578","url":null,"abstract":"The objective of this article is to investigate the thermal-fatigue properties of a commercially available lead-free solder alloy (SnBiAgCu) under the use of different types of potting compounds. Solder alloys with lower silver content are expected to substitute the conventional solder alloys SAC305 (Sn-3.0Ag-0.5Cu). First, the tensile behavior and creep behavior of the SnBiAgCu solder alloys were studied at three temperatures (25℃, 75℃, 125℃). Results show that this type of solder alloys presented higher tensile strength and creep deformation endurance than conventional SAC305 solder alloys. Second, a dynamic mechanical analysis was performed to get the storage modulus and glass transition temperature of three types of potting compounds, which were used in the thermal-fatigue simulation. Third, the experimentally determined material data was used for the averaged strain energy density increment calculated by the finite element method. This simulation approach was selected as damage metrics to evaluate solder interconnect reliability under different combinations of materials. It is found that the application of potting compounds will increase strain energy density significantly when compared with the strain energy density calculated without potting compound, which means that potting compounds will deteriorate the thermal-fatigue reliability of solder interconnects. These accurate data-driven simulation models can in the future form the basis for compact digital twins for predicting useful remaining lifetime.","PeriodicalId":125740,"journal":{"name":"IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society","volume":"19 6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132937745","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Mutilevel Bipolar Back-to-Back HVDC Transmission System Based on the Dual Inverter Converter Structure with Model Predictive Control 基于模型预测控制的双逆变变换器结构的多级双极背靠背高压直流输电系统

IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society Pub Date : 2022-10-17 DOI: 10.1109/IECON49645.2022.9968963

J. Monteiro, V. Pires, J. F. Silva, S. Pinto

引用次数: 2