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2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)最新文献

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Time Domain Double-Loaded Electromagnetic Field Probe Applied to Unmanned Air Vehicles 时域双载荷电磁场探头在无人机上的应用
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/EMCSI.2018.8495447
M. Pous, S. Fernández, M. Añón, M. Cabello, L. Angulo, Ferran Silva
{"title":"Time Domain Double-Loaded Electromagnetic Field Probe Applied to Unmanned Air Vehicles","authors":"M. Pous, S. Fernández, M. Añón, M. Cabello, L. Angulo, Ferran Silva","doi":"10.1109/EMCSI.2018.8495447","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495447","url":null,"abstract":"In this study, measurements inside the fuselage of an unmanned air vehicle (UAV) are conducted using a novel double-loaded loop probe. The characterization and evaluation of electromagnetic interference (EMI) within VAVs is a main research topic and requires state-of-the-art measurement methodologies. The developed probe is capable of obtaining accurate measurements as commercial reference E-Field broadband probes, introducing new advantages based on the reduction of the probe's electronics and the availability of the full time-domain data. Allowing to compute simultaneously the electric and the magnetic field and to measure high-amplitude electromagnetic pulses. The laser-probe works together with multi-channel full-time domain system computing the electromagnetic fields using an oscilloscope. Regarding the double-loaded loop probe characterization and validation, it has been carried out by comparing the results with different validation methods, like Feature Selective Validation Method and the Integrated Error against Logarithmic Frequency.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":"95 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122788606","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Electromagnetic Characterization of Absorbers 吸收剂的电磁特性
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/EMCSI.2018.8495367
P. Dixon
{"title":"Electromagnetic Characterization of Absorbers","authors":"P. Dixon","doi":"10.1109/EMCSI.2018.8495367","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495367","url":null,"abstract":"","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":"341 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122996202","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Terminal Ground Filter between Cable and Chassis for Reduction of Conducted Emissions at a Home Appliance 用于减少家用电器传导辐射的电缆和机箱之间的终端接地滤波器
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/EMCSI.2018.8495422
Sangyeong Jeong, Jingook Kim, Young-Hwan Baek, Wonwoo Lee, Gwigeun Park
{"title":"A Terminal Ground Filter between Cable and Chassis for Reduction of Conducted Emissions at a Home Appliance","authors":"Sangyeong Jeong, Jingook Kim, Young-Hwan Baek, Wonwoo Lee, Gwigeun Park","doi":"10.1109/EMCSI.2018.8495422","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495422","url":null,"abstract":"A CM noise reduction method by adding a terminal ground filter between the cable ground and chassis is proposed. The noise reduction performance of the terminal ground filter is estimated with a simplified circuit model. The proposed filter is implemented in a small PCB, and applied to a 3.3kW power system of an air conditioner. The reduction of the CM CE noises by applying the terminal ground filter is experimentally validated.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124664464","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Current EMC Testing for Communications Networking Devices and future testing of IEDs in Transmission and Distribution Facilities 通信网络设备的当前EMC测试和输配电设施中ied的未来测试
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/EMCSI.2018.8495350
J. Ramie
{"title":"Current EMC Testing for Communications Networking Devices and future testing of IEDs in Transmission and Distribution Facilities","authors":"J. Ramie","doi":"10.1109/EMCSI.2018.8495350","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495350","url":null,"abstract":"This article consists only of a collection of slides from the author's conference presentation.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":"174 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127008090","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Professional Consulting 专业的咨询
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/emcsi.2018.8495176
Patrick G. André
{"title":"Professional Consulting","authors":"Patrick G. André","doi":"10.1109/emcsi.2018.8495176","DOIUrl":"https://doi.org/10.1109/emcsi.2018.8495176","url":null,"abstract":"This article consists only of a collection of slides from the author's conference presentation.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129288118","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
An FDA Perspective on Medical Device EMC and Wireless WED-PM-4 FDA对医疗器械EMC和无线wd - pm -4的看法
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/EMCSI.2018.8495328
J. Silberberg
{"title":"An FDA Perspective on Medical Device EMC and Wireless WED-PM-4","authors":"J. Silberberg","doi":"10.1109/EMCSI.2018.8495328","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495328","url":null,"abstract":"Jeffrey L. Silberberg, MSEE","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125448849","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
RF-Power Induced Clock Jitter Degradation and Its Modeling in High-Speed I/O Interfaces 高速I/O接口中射频功率引起的时钟抖动退化及其建模
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/EMCSI.2018.8495172
S. Gaskill, Hao-han Hsu, Chung-hao Chen
{"title":"RF-Power Induced Clock Jitter Degradation and Its Modeling in High-Speed I/O Interfaces","authors":"S. Gaskill, Hao-han Hsu, Chung-hao Chen","doi":"10.1109/EMCSI.2018.8495172","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495172","url":null,"abstract":"This paper investigates jitter degradation of highspeed I/O when RF power sources, such as smartphone, are in proximity to the I/O link. The jitter is increased by as high as ~200% when a 500-mW LTE antenna is 3 cm away from the transmission line at 831 MHz and may cause failure of the high-speed link. An analytic model is developed to capture the jitter behavior at various RF amplitudes and clock slew-rates. A good agreement among the model, simulation, and measurement is obtained at various frequencies and with a measured LTE signal. This study may help to predict the jitter degradation due to adjacent RF power and may be more critical to I/O interfaces with higher speed.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133349541","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
EMC fundamentals MO-PM-1-3 Filters EMC基本原理MO-PM-1-3滤波器
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/EMCSI.2018.8495314
F. Leferink
{"title":"EMC fundamentals MO-PM-1-3 Filters","authors":"F. Leferink","doi":"10.1109/EMCSI.2018.8495314","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495314","url":null,"abstract":"This article consists only of a collection of slides from the author's conference presentation.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133820170","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Numerical Modeling Application of ICNIRP Guidelines to Automobile Occupant Protection ICNIRP准则在汽车乘员保护中的数值模拟应用
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/EMCSI.2018.8495334
Scott Piper, Laura L. Ball, M. Mandziuk
{"title":"Numerical Modeling Application of ICNIRP Guidelines to Automobile Occupant Protection","authors":"Scott Piper, Laura L. Ball, M. Mandziuk","doi":"10.1109/EMCSI.2018.8495334","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495334","url":null,"abstract":"The automobiles of today offer smaller architectures and electric motor driven propulsion systems to offer fuel efficiencies and reduced air pollution. These vehicles, at times, integrate major electrical components into the vehicle structure placing these components near vehicle occupants. With this practice, there is the concern of exposing occupants to the magnetic field generated by these nearby electrical components due to the high current. The International Commission on Non-Ionizing Radiation Protection (ICNIRP) established guidelines for general public exposure to electric and magnetic fields which offers guidance on potential health effects when humans are exposed to Non-Ionizing Radiation. In this paper, the application of these guidelines in an automotive setting will be discussed along with some of the challenges involved with applying this guidance. Some conditions at the basis of the ICNIRP guidelines do not align with the automotive environment, such as close proximity of current-carrying wires resulting in localized fields and maximum coupling to the exposed individual. This, along with some of the conservative assumptions made in the establishment of the Reference Levels, can pose a challenge when attempting to define magnetic field emission limits inside the vehicle.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115183199","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Quality Criteria for Electromagnetic Wave Absorbers 电磁波吸收器的质量标准
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Pub Date : 2018-07-01 DOI: 10.1109/EMCSI.2018.8495446
K. Rozanov, M. Koledintseva
{"title":"Quality Criteria for Electromagnetic Wave Absorbers","authors":"K. Rozanov, M. Koledintseva","doi":"10.1109/EMCSI.2018.8495446","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495446","url":null,"abstract":"Formulation for Electromagnetic Wave Absorber Performance","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":"162 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115593808","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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