IAS '95. Conference Record of the 1995 IEEE Industry Applications Conference Thirtieth IAS Annual Meeting最新文献_第4页

A study of atomicity and consistency in MMS servers MMS服务器的原子性和一致性研究

IAS '95. Conference Record of the 1995 IEEE Industry Applications Conference Thirtieth IAS Annual Meeting Pub Date : 1995-10-08 DOI: 10.1109/IAS.1995.530509

S. Messina, P. Pleinevaux

{"title":"A study of atomicity and consistency in MMS servers","authors":"S. Messina, P. Pleinevaux","doi":"10.1109/IAS.1995.530509","DOIUrl":"https://doi.org/10.1109/IAS.1995.530509","url":null,"abstract":"Manufacturing message specification (MMS) is an application-layer protocol designed for the remote control and monitoring of industrial devices. MMS defines services for the manipulation of objects such as variables, domains, programs stored in MMS servers. Consistency is essential to the correct operation of these servers, in particular when the process controlled by the servers can lead to accidents or catastrophes. Concurrent access to shared objects, failures of the servers or cancellation of requests are examples of causes that can compromise the consistency of the set of objects in an MMS server. Atomicity and isolation, as components of the transaction paradigm, can help to support consistency of a set of objects. The purpose of this paper is to study atomicity of MMS services for two classes of objects: variables and domains. This study considers consistency at the server level only and shows that the designers of MMS were aware of the consistency problem but that no systematic approach was defined to prevent inconsistencies. The authors point out several places in the MMS standard where misconceptions or gaps appear in the specification of atomic services.","PeriodicalId":117576,"journal":{"name":"IAS '95. Conference Record of the 1995 IEEE Industry Applications Conference Thirtieth IAS Annual Meeting","volume":"95 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134314103","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Metal matrix composite power modules: improvements in reliability and package integration 金属基复合电源模块:提高可靠性和封装集成度

IAS '95. Conference Record of the 1995 IEEE Industry Applications Conference Thirtieth IAS Annual Meeting Pub Date : 1995-10-08 DOI: 10.1109/IAS.1995.530396

G. Romero, J. Fusaro, J. L. Martinez

{"title":"Metal matrix composite power modules: improvements in reliability and package integration","authors":"G. Romero, J. Fusaro, J. L. Martinez","doi":"10.1109/IAS.1995.530396","DOIUrl":"https://doi.org/10.1109/IAS.1995.530396","url":null,"abstract":"This paper compares metal matrix composite (MMC) baseplate power modules to standard copper baseplate power modules with respect to high current applications. The comparison is made both from a reliability and a package integration perspective. Reliability continues to be a key concern in applications where motor drives are subjected to thermal cycling. Modules with copper baseplates exhibit poor mechanical reliability since the thermal mismatches are high between the baseplate and the other materials in the package. Package integration of the power stage with the rest of the package is difficult with copper based modules since the only geometry that can be economically produced is stamped two dimensional baseplates. MMC materials are combinations of metals and ceramics with variable properties. A silicon carbide/aluminum composite (a moldable material with controlled thermal expansion coefficient) offers elegant solutions to the reliability and package integration concerns of standard modules. This study, conducted at Motorola's Hybrid Power Module Operation, examines the benefits that can be realized in both of these areas by using MMC baseplates in high current power modules. Measurement and finite element methods are used to study reliability. Additionally, design concepts for integrated packaging and integrated power systems are also explored.","PeriodicalId":117576,"journal":{"name":"IAS '95. Conference Record of the 1995 IEEE Industry Applications Conference Thirtieth IAS Annual Meeting","volume":"82 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131599141","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 13

Intelligent model reference adaptive control applied to motion control 智能模型参考自适应控制在运动控制中的应用

IAS '95. Conference Record of the 1995 IEEE Industry Applications Conference Thirtieth IAS Annual Meeting Pub Date : 1995-10-08 DOI: 10.1109/IAS.1995.530496

Thomas J. Rehm, Peter B. Schmidt

引用次数: 6

Active voltage balancement of series connected IGBTs 串联igbt的有源电压平衡

IAS '95. Conference Record of the 1995 IEEE Industry Applications Conference Thirtieth IAS Annual Meeting Pub Date : 1995-10-08 DOI: 10.1109/IAS.1995.530654

Alfio Consoli, Salvatore Musumeci, Giovanna Oriti, Antonio Testa

引用次数: 60

Sensor-based navigation control and calibration of a wafer-handling mobile robot 基于传感器的晶圆搬运移动机器人导航控制与标定

IAS '95. Conference Record of the 1995 IEEE Industry Applications Conference Thirtieth IAS Annual Meeting Pub Date : 1995-10-08 DOI: 10.1109/IAS.1995.530545

Dong-Il Kim, Jin-Ki Kim, Hak-Kyung Sung, Sungkwun Kim

{"title":"Sensor-based navigation control and calibration of a wafer-handling mobile robot","authors":"Dong-Il Kim, Jin-Ki Kim, Hak-Kyung Sung, Sungkwun Kim","doi":"10.1109/IAS.1995.530545","DOIUrl":"https://doi.org/10.1109/IAS.1995.530545","url":null,"abstract":"In this paper, the authors propose a mobile robot composed of a free-ranging automated guided vehicle and a manipulator with six degrees of freedom, which is mounted on the vehicle. In navigation in the semiconductor manufacturing line, the mobile robot utilizes a predefined map representing the route to move in the working area with clean class 1. The map and the information about the task to be performed is transmitted to the main controller of the mobile robot through R/F communication. In navigation, the mobile robot uses a fuzzy control algorithm based on data from the sonar sensors attached to both right and left sides of the vehicle to maintain a positioning accuracy within /spl plusmn/1 cm. The mobile robot automatically calibrates the setting position of the manipulator to calculate the exact destination point where the given task should be carried out. Then, the manipulator loads the equipment with wafer-carriers or unloads wafer-carriers from the equipment in the semiconductor manufacturing line. By the proposed navigation algorithm based on fuzzy control and the calibration algorithm of the manipulator, the mobile robot efficiently carries out a given task in a semiconductor manufacturing line.","PeriodicalId":117576,"journal":{"name":"IAS '95. Conference Record of the 1995 IEEE Industry Applications Conference Thirtieth IAS Annual Meeting","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131737855","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Conductive modification of injection molded thermoplastics: electrical properties and electrostatic paintability 注射成型热塑性塑料的导电改性:电性能和静电涂漆性

IAS '95. Conference Record of the 1995 IEEE Industry Applications Conference Thirtieth IAS Annual Meeting Pub Date : 1995-10-08 DOI: 10.1109/IAS.1995.530482

J. Helms, E. Blais, M. Cheung, J. Schroeder, T. Derengowski

{"title":"Conductive modification of injection molded thermoplastics: electrical properties and electrostatic paintability","authors":"J. Helms, E. Blais, M. Cheung, J. Schroeder, T. Derengowski","doi":"10.1109/IAS.1995.530482","DOIUrl":"https://doi.org/10.1109/IAS.1995.530482","url":null,"abstract":"Conductively modified thermoplastic substrates have been developed using low levels of conductive carbon fillers, <6 weight percent, without sacrificing the favorable mechanical and rheological properties exhibited by these materials for the automotive market. The bulk electrical properties of these materials exhibit traditional percolation behavior when the samples are compression molded. Conductively modified injection molded materials exhibit a high surface resistivity, typically greater than 10/sup 16/ ohm cm, which is compensated by a relatively low resistivity interior, less than 10/sup 8/ ohm cm. The threshold for electrostatic paintability has been identified based on core resistivity measurements and electrostatic dissipation results. This core resistivity must be less that 10/sup 9/ ohm cm for charge dissipation to occur and for any significant increase in paint film builds to be observed. The surface to core resistivity transformation is intimately related to the material cooling rate and thus the distance of the sampled area to the injection molding tool surface. Using these conductively modified materials, high solids paint coating film, builds and transfer efficiency have been increased in excess of 100 percent relative to unmodified samples. The use of conductively modified thermoplastic substrates in the electrostatic painting process can eliminate the need for conducting primers when adhesion between the base coat and substrate surface is maintained.","PeriodicalId":117576,"journal":{"name":"IAS '95. Conference Record of the 1995 IEEE Industry Applications Conference Thirtieth IAS Annual Meeting","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128943303","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

The characterization of a clean room assembly process 洁净室装配过程的特性描述

IAS '95. Conference Record of the 1995 IEEE Industry Applications Conference Thirtieth IAS Annual Meeting Pub Date : 1995-10-08 DOI: 10.1109/IAS.1995.530514

F. Mrad

{"title":"The characterization of a clean room assembly process","authors":"F. Mrad","doi":"10.1109/IAS.1995.530514","DOIUrl":"https://doi.org/10.1109/IAS.1995.530514","url":null,"abstract":"This paper presents the findings of a cross-functional team that was in charge of putting in place the design guidelines for the future assembly line of the small form factor hard disk drives (HDD). Keeping in mind that the factors affecting the characterization of an assembly process depend greatly on the nature of the product, the market forecast for the product, the production geographical location and many other local and special constraints. However, we believe that a similar approach to the one reported in this paper can yield an acceptable set of measurements that can help the product development teams present more manufacturable products. The core of our work was based on a quality function deployment (QFD) approach that included the construction of a house of quality. In addition to the findings of the team, we describe the progressive stages that had to take place from gathering the factory customers' wants and needs to organizing the cross functional team. We started with internal customers' needs for the ideal HDD manufacturing process. Our internal customers represented manufacturing operators, process engineers, product developers and managers for all three groups. With a large group of participants from dependent functions that included cleaning, testing, assembly, product technology, manufacturing engineering and others, we derived the clean room assembly process characteristics that are measurable and controllable to address our internal customers' needs.","PeriodicalId":117576,"journal":{"name":"IAS '95. Conference Record of the 1995 IEEE Industry Applications Conference Thirtieth IAS Annual Meeting","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130783866","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 10

Optimized design and 3D finite element analysis of a rotary actuator 旋转驱动器的优化设计及三维有限元分析

IAS '95. Conference Record of the 1995 IEEE Industry Applications Conference Thirtieth IAS Annual Meeting Pub Date : 1995-10-08 DOI: 10.1109/IAS.1995.530340

R. A. McCann, J. Suriano

引用次数: 1

Two novel schemes suitable for static switching of 3 phase delta connected capacitor banks with minimum surge current 两种适用于最小浪涌电流的三相三角形连接电容器组静态开关的新方案

IAS '95. Conference Record of the 1995 IEEE Industry Applications Conference Thirtieth IAS Annual Meeting Pub Date : 1995-10-08 DOI: 10.1109/IAS.1995.530655

S. Nandi, P. Biswas, V. Nandakumar, R. Hegde

引用次数: 7

Synchronous rectifier as a test circuit for high-frequency power MOSFET model verification 以同步整流器作为测试电路，对高频功率MOSFET进行模型验证

IAS '95. Conference Record of the 1995 IEEE Industry Applications Conference Thirtieth IAS Annual Meeting Pub Date : 1995-10-08 DOI: 10.1109/IAS.1995.530424

K. Fischer, K. Shenai

引用次数: 1