Chip Pub Date : 2022-12-01 DOI: 10.1016/j.chip.2022.100029

Bing-Cheng Pan , Hong-Xuan Liu , Hao-Chen Xu , Yi-Shu Huang , Huan Li , Ze-Jie Yu , Liu Liu , Yao-Cheng Shi , Dao-Xin Dai

{"title":"Ultra-compact lithium niobate microcavity electro-optic modulator beyond 110 GHz","authors":"Bing-Cheng Pan , Hong-Xuan Liu , Hao-Chen Xu , Yi-Shu Huang , Huan Li , Ze-Jie Yu , Liu Liu , Yao-Cheng Shi , Dao-Xin Dai","doi":"10.1016/j.chip.2022.100029","DOIUrl":"10.1016/j.chip.2022.100029","url":null,"abstract":"<div><p><strong>A lithium-niobate-on-insulator (LNOI) electro-optic (EO) modulator based on a 2 × 2 FP-cavity was designed and realized with an ultra-compact footprint and an ultra-high bandwidth. A comprehensive analysis on the present LNOI FP-cavity modulator was conducted to reveal the dependence of modulation bandwidth and modulation efficiency on the cavity Q-factor and the operation wavelength detuning to the resonance. In particular, the 2 × 2 FP cavity was designed to achieve an optimal Q factor by reducing the reflectivity of reflectors and the cavity length, thus reducing the photon lifetime in the cavity . An ultra-short effective cavity length of only∼ 50 µm was achieved for the designed LNOI FP-cavity modulator, with itsfootprint being as compact as ∼ 4 × 500 µm</strong><span><sup>2</sup></span><strong>. It was demonstrated theoretically that the modulation bandwidth could be improved significantly to be over 200 GHz by utilizing the peaking enhancement effect. The fabricated device exhibited an excess loss of ∼ 1 dB and an extinction ratio of ∼ 20 dB in experiments, while the measured 3-dB bandwidth was higher than 110 GHz (beyond the maximal range of the facilities in experiments). Up till now, to our best knowledge, this has been the first LNOI microcavity modulator with a bandwidth higher than 110 GHz. Finally, high-quality eye-diagrams of 100 Gbps on-off keying (OOK) and 140 Gbps 4-pulse amplitude modulation (PAM4) signals were demonstrated experimentally, and the energy consumption for the OOK signals was as low as 4.5 fJ/bit.</strong></p></div>","PeriodicalId":100244,"journal":{"name":"Chip","volume":"1 4","pages":"Article 100029"},"PeriodicalIF":0.0,"publicationDate":"2022-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2709472322000272/pdfft?md5=fd866f2c0d3dcc0ec01ab8afa54a6fca&pid=1-s2.0-S2709472322000272-main.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79604506","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 9

Foldable-circuit-enabled miniaturized multifunctional sensor for smart digital dust 可折叠电路的微型多功能智能数字粉尘传感器

Chip Pub Date : 2022-12-01 DOI: 10.1016/j.chip.2022.100034

Chun-Yu You , Bo-Fan Hu , Bo-Rui Xu , Zi-Yu Zhang , Bin-Min Wu , Gao-Shan Huang , En-Ming Song , Yong-Feng Mei

{"title":"Foldable-circuit-enabled miniaturized multifunctional sensor for smart digital dust","authors":"Chun-Yu You , Bo-Fan Hu , Bo-Rui Xu , Zi-Yu Zhang , Bin-Min Wu , Gao-Shan Huang , En-Ming Song , Yong-Feng Mei","doi":"10.1016/j.chip.2022.100034","DOIUrl":"10.1016/j.chip.2022.100034","url":null,"abstract":"<div><p>Smart dust, which refers to miniaturized, multifunctional sensor motes, would open up data acquisition opportunities for Internet of Things (IoT) and Environmental protection applications. However, critical obstacles remain challenging in the integration of high-density sensors, further miniaturization of device platforms, and reduction of cost. Here, we demonstrate the concept of smart digital dust to address these problems, the results of which combine the benefit of (<em>i</em>) maturity of complementary metal-oxide semiconductor (CMOS) processing approaches and (<em>ii</em>) unique form factors of emerging flexible electronics. As a prototype for smart digital dust, we present a millimeter-scale multifunctional optoelectronic sensor platform consisting of high-performance optoelectronic sensor cores and commercially available integrated-circuit components. The smart material-assisted optoelectronic sensing mechanism enables real-time, high-sensitivity hydrogen, temperature, and relative humidity (RH) sensing based on a single chip with ultralow power consumption. Such a microsystem presented here introduces a viable solution to the multifunctional sensing need of IoT and could serve as a building block for the rapidly evolving future framework of smart dust.</p></div>","PeriodicalId":100244,"journal":{"name":"Chip","volume":"1 4","pages":"Article 100034"},"PeriodicalIF":0.0,"publicationDate":"2022-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2709472322000326/pdfft?md5=ac12683a4f5e2e78eee9ad875b5b611a&pid=1-s2.0-S2709472322000326-main.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83778031","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Terahertz metadevices for silicon plasmonics 硅等离子体的太赫兹元器件

Chip Pub Date : 2022-12-01 DOI: 10.1016/j.chip.2022.100030

Yuan Liang , Hao Yu , Hong Wang , Hao Chi Zhang , Tie Jun Cui

{"title":"Terahertz metadevices for silicon plasmonics","authors":"Yuan Liang , Hao Yu , Hong Wang , Hao Chi Zhang , Tie Jun Cui","doi":"10.1016/j.chip.2022.100030","DOIUrl":"10.1016/j.chip.2022.100030","url":null,"abstract":"<div><p>Metamaterial devices (metadevices) have been developed in progress aiming to generate extraordinary performance over traditional devices in the (sub-)terahertz (THz) domain, and their planar integration with complementary-metal-oxide-semiconductor (CMOS) circuits pave a new way to build miniature silicon plasmonics that overcomes existing challenges in chip-to-chip communication. In an effort towards low-power, crosstalk-tolerance, and high-speed data link for future exascale data centers, this article reviews the recent progress on two metamaterials, namely, the spoof surface plasmon polaritons (SPPs), and the split-ring resonator (SRR), as well as their implementations in silicon, focusing primarily on their fundamental theories, design methods, and implementations for future THz communications. Owing to their respective dispersion characteristic at THz, these two metadevices are highly expected to play an important role in miniature integrated circuits and systems toward compact size, dense integration, and outstanding performance. A design example of a fully integrated sub-THz CMOS silicon plasmonic system integrating these two metadevices is provided to demonstrate a dual-channel crosstalk-tolerance and energy-efficient on-off keying (OOK) communication system. Future directions and potential applications for THz metadevices are discussed.</p></div>","PeriodicalId":100244,"journal":{"name":"Chip","volume":"1 4","pages":"Article 100030"},"PeriodicalIF":0.0,"publicationDate":"2022-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2709472322000284/pdfft?md5=36d37d767112466e41c086969f69624c&pid=1-s2.0-S2709472322000284-main.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79844952","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Feasibility of chipscale integration of single-photon switched digital loop buffer 单光子开关数字环路缓冲器芯片级集成的可行性

Chip Pub Date : 2022-12-01 DOI: 10.1016/j.chip.2022.100028

Xiaoxi Wang , Shayan Mookherjea

引用次数: 2

Photodetectors based on two-dimensional MoS2 and its assembled heterostructures 基于二硫化钼及其组装异质结构的光电探测器

Chip Pub Date : 2022-09-01 DOI: 10.1016/j.chip.2022.100017

Tao Hu , Rui Zhang , Jin-Ping Li , Jian-Yun Cao , Feng Qiu

{"title":"Photodetectors based on two-dimensional MoS2 and its assembled heterostructures","authors":"Tao Hu , Rui Zhang , Jin-Ping Li , Jian-Yun Cao , Feng Qiu","doi":"10.1016/j.chip.2022.100017","DOIUrl":"10.1016/j.chip.2022.100017","url":null,"abstract":"<div><p>Photodetectors are finding various potential applications in sensing and detection, information communication, light-emitting diode, optical modulators, ultrafast laser, etc. Molybdenum disulfide (MoS<sub>2</sub>) has sparked great interest given its unique crystal phase, flexible preparation, structural stability, and regulable photoelectronic features. Therefore, the MoS<sub>2</sub>-based photodetector is demonstrated to be an excellent device fabrication platform to explore underlying sensitive detection, broadband optical detection, high-speed response, low-power consumption, two-dimensional integrated circuit, and its synergetic mechanism, which is also proved to be an excellent candidate for next-generation optoelectronics. This review summarizes the structural, optical, and transport features of MoS<sub>2</sub>. Then the working mechanisms and figures of merit are explored for the MoS<sub>2</sub> detector. Further, the detector modulation strategies are introduced in detail about layer-number engineering and chemical doping engineering. Afterward, the recent heterostructure assembling strategies (MoS<sub>2</sub>/nD, n=0,1,2,3) of detector architectures are classified based on flexible van der Waals assembling. Finally, the future direction of MoS<sub>2</sub> photodetectors is discussed, which can be delivered as a feasible guideline in two-dimensional photodetector and integrated circuit fields.</p></div>","PeriodicalId":100244,"journal":{"name":"Chip","volume":"1 3","pages":"Article 100017"},"PeriodicalIF":0.0,"publicationDate":"2022-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2709472322000156/pdfft?md5=fdac603297c89569dafa98c15063a3cb&pid=1-s2.0-S2709472322000156-main.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87310515","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 16

Hybrid superconducting photonic-phononic chip for quantum information processing 用于量子信息处理的超导光子-声子混合芯片

Chip Pub Date : 2022-09-01 DOI: 10.1016/j.chip.2022.100016

Xin-Biao Xu , Wei-Ting Wang , Lu-Yan Sun , Chang-Ling Zou

{"title":"Hybrid superconducting photonic-phononic chip for quantum information processing","authors":"Xin-Biao Xu , Wei-Ting Wang , Lu-Yan Sun , Chang-Ling Zou","doi":"10.1016/j.chip.2022.100016","DOIUrl":"10.1016/j.chip.2022.100016","url":null,"abstract":"<div><p>The integration of qubits with long coherence times and functional quantum devices on a single chip, and thus the realization of an all-solid-state quantum computing chip, is an important goal in current experimental research on quantum information processing. Among various quantum platforms, a series of significant progresses have been made in photonic quantum chips and superconducting quantum chips, while both the number of qubits and the complexity of quantum circuits have been increasing. Although these two chip platforms have respective unique advantages and potentials, their shortcomings have been gradually revealed and need to be solved. By introducing phonon-integrated devices, it is possible to combine all unsuspended phononic, photonic, and superconducting quantum devices organically on the same chip to achieve coherent coupling among them. Here, we provide a prospect and a short review on the integrated photonic, superconducting, and hybrid quantum chips for quantum information processing.</p></div>","PeriodicalId":100244,"journal":{"name":"Chip","volume":"1 3","pages":"Article 100016"},"PeriodicalIF":0.0,"publicationDate":"2022-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2709472322000144/pdfft?md5=ebef7f2164cec618429109350a086db5&pid=1-s2.0-S2709472322000144-main.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89861005","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Sensitive MoS2 photodetector cell with high air-stability for multifunctional in-sensor computing 灵敏的MoS2光电探测器电池，具有高空气稳定性，用于多功能传感器内计算

Chip Pub Date : 2022-09-01 DOI: 10.1016/j.chip.2022.100023

Dong-Hui Zhao , Zheng-Hao Gu , Tian-Yu Wang , Xiao-Jiao Guo , Xi-Xi Jiang , Min Zhang , Hao Zhu , Lin Chen , Qing-Qing Sun , David Wei Zhang

{"title":"Sensitive MoS2 photodetector cell with high air-stability for multifunctional in-sensor computing","authors":"Dong-Hui Zhao , Zheng-Hao Gu , Tian-Yu Wang , Xiao-Jiao Guo , Xi-Xi Jiang , Min Zhang , Hao Zhu , Lin Chen , Qing-Qing Sun , David Wei Zhang","doi":"10.1016/j.chip.2022.100023","DOIUrl":"10.1016/j.chip.2022.100023","url":null,"abstract":"<div><p>With the development of artificial intelligence and the Internet of Things, the number of sensory nodes is growing rapidly, leading to the exchange of large quantities of redundant data between sensors and computing units. In-sensor computing schemes, which integrate sensing and processing, have provided a promising route to addressing the sensing/processing bottleneck by reducing power consumption, time delay and hardware redundancy. In this study, an in-sensor computing architecture involving a photoelectronic cell based on a wafer-scale two-dimensional MoS<sub>2</sub> thin film was demonstrated. The MoS<sub>2</sub> photodetector cell used a top-gate device structure with indium tin oxide (ITO) as the transparent gate electrode, which exhibited high air-stability and a high photoresponsivity (<em>R</em>) up to 555.8 A W<sup>–1</sup> at an illumination power density (<em>P</em><sub>in</sub>) of 16.0 µW cm<sup>–2</sup> (<em>λ</em> = 500 nm). Additionally, a MoS<sub>2</sub> photodetector array with uniform photoresponsive characteristics was achieved. Furthermore, logic gates, including inverter, NAND, and NOR, were achieved based on MoS<sub>2</sub> photodetector cells. Such multifunctional and robust in-sensor computing was ascribed to the uniform wafer-scale MoS<sub>2</sub> film grown by atomic layer deposition (ALD) and the unique device structure. Because the detection of optical signals and logic operations were achieved through MoS<sub>2</sub> photodetector cells with area efficiency, the proposed in-sensor computing device paves the way for potential applications in high-performance, integrated sensing and processing systems.</p></div>","PeriodicalId":100244,"journal":{"name":"Chip","volume":"1 3","pages":"Article 100023"},"PeriodicalIF":0.0,"publicationDate":"2022-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2709472322000211/pdfft?md5=3e7ef961c3287c5bf266016512406081&pid=1-s2.0-S2709472322000211-main.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88567109","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

A tassel-type multilayer flexible probe for invasive neural recording 一种用于有创神经记录的流苏型多层柔性探针

Chip Pub Date : 2022-09-01 DOI: 10.1016/j.chip.2022.100024

Zi-Peng Ye , Jing Qi , Yi-Ling Ni , Zhi-Yong Wu , Xiao Xiao , Shi-Sheng Xiong

{"title":"A tassel-type multilayer flexible probe for invasive neural recording","authors":"Zi-Peng Ye , Jing Qi , Yi-Ling Ni , Zhi-Yong Wu , Xiao Xiao , Shi-Sheng Xiong","doi":"10.1016/j.chip.2022.100024","DOIUrl":"10.1016/j.chip.2022.100024","url":null,"abstract":"<div><p>Invasive neural probes are one of the most critical components in the intracortical neural signal recording system. However, they can cause brain damage and tissue response during and after implantation. Thus, neural probes with high flexibility, biocompatibility, and simple implantation methods are required in brain research. Here we present a novel approach to fabricating a multilayer flexible tassel-type neural probe using low-cost maskless laser direct-write lithography, combined with straightforward release and assembly methods to prepare a whole implantation system. The probe has 32 recording electrodes with an area of 8 × 8 µm<sup>2</sup>, arranged into two rows of different depths and 16 separated shanks, aiming at the neural signal recording in an extensive range. Polyimide and gold are used as the insulating and conductive layers, respectively. With the help of a polyethylene glycol (PEG) coating, the tassel structure was mechanically enhanced for successful implantation, and our morphology characterization showed that the diameter of the coated probe was less than 50 µm. Mechanical property tests also proved that it had the necessary stiffness for brain implantation. Afterwards, electrochemical tests were carried out, which showed that the probe had a rather low impedance after a simple gold electroplating. Finally, in vivo experiments demonstrated our probe can be successfully used in neural recording.</p></div>","PeriodicalId":100244,"journal":{"name":"Chip","volume":"1 3","pages":"Article 100024"},"PeriodicalIF":0.0,"publicationDate":"2022-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2709472322000223/pdfft?md5=2675d6c1647c05599d96cb42f06bedca&pid=1-s2.0-S2709472322000223-main.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85516164","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

The development of laser-produced plasma EUV light source 激光等离子体极紫外光源的研制

Chip Pub Date : 2022-09-01 DOI: 10.1016/j.chip.2022.100019

De-Kun Yang , Du Wang , Qiu-Shi Huang , Yi Song , Jian Wu , Wen-Xue Li , Zhan-Shan Wang , Xia-Hui Tang , Hong-Xing Xu , Sheng Liu , Cheng-Qun Gui

{"title":"The development of laser-produced plasma EUV light source","authors":"De-Kun Yang , Du Wang , Qiu-Shi Huang , Yi Song , Jian Wu , Wen-Xue Li , Zhan-Shan Wang , Xia-Hui Tang , Hong-Xing Xu , Sheng Liu , Cheng-Qun Gui","doi":"10.1016/j.chip.2022.100019","DOIUrl":"10.1016/j.chip.2022.100019","url":null,"abstract":"<div><p>Extreme ultraviolet lithography (EUVL) has been demonstrated to meet the industrial requirements of new-generation semiconductor fabrication. The development of high-power EUV sources is a long-term critical challenge to the implementation of EUVL in high-volume manufacturing (HVM), together with other technologies such as photoresist and mask. Historically, both theoretical studies and experiments have clearly indicated that the CO<sub>2</sub> laser-produced plasma (LPP) system is a promising solution for EUVL source, able to realize high conversion efficiency (CE) and output power. Currently, ASML's NXE:3400B EUV scanner configuring CO<sub>2</sub> LPP source system has been installed and operated at chipmaker customers. Meanwhile, other research teams have made different progresses in the development of LPP EUV sources. However, in their technologies, some critical areas need to be further improved to meet the requirements of 5 nm node and below. Critically needed improvements include higher laser power, stable droplet generation system and longer collector lifetime. In this paper, we describe the performance characteristics of the laser system, droplet generator and mirror collector for different EUV sources, and also the new development results.</p></div>","PeriodicalId":100244,"journal":{"name":"Chip","volume":"1 3","pages":"Article 100019"},"PeriodicalIF":0.0,"publicationDate":"2022-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S270947232200017X/pdfft?md5=b843d53a882992bbff208925b17f073e&pid=1-s2.0-S270947232200017X-main.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85788521","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Waveguide-coupled deterministic quantum light sources and post-growth engineering methods for integrated quantum photonics 波导耦合确定性量子光源与集成量子光子学的后生长工程方法

Chip Pub Date : 2022-09-01 DOI: 10.1016/j.chip.2022.100018

Xu-Dong Wang , Yi-Fan Zhu , Ting-Ting Jin , Wei-Wen Ou , Xin Ou , Jia-Xiang Zhang

{"title":"Waveguide-coupled deterministic quantum light sources and post-growth engineering methods for integrated quantum photonics","authors":"Xu-Dong Wang , Yi-Fan Zhu , Ting-Ting Jin , Wei-Wen Ou , Xin Ou , Jia-Xiang Zhang","doi":"10.1016/j.chip.2022.100018","DOIUrl":"10.1016/j.chip.2022.100018","url":null,"abstract":"<div><p>Integrated photonic quantum circuits (IPQCs) have attracted increasing attention in recent years due to their widespread applications in quantum information science. While the most envisioned quantum technologies such as quantum communications, quantum computer and quantum simulations have placed a strict constraint on the scalability of chip-integrated quantum light sources. By introducing size-confined nanostructures or crystal imperfections, low-dimensional semiconductors have been broadly explored as chip-scale deterministic single-photon sources (SPSs). Thus far a variety of chip-integrated deterministic SPSs have been investigated across both monolithic and hybrid photonic platforms, including molecules, quantum dots, color centers and two-dimensional materials. With the rapid development of the chip-scale generation of single photons with deterministic quantum emitters, the field of IPQCs has raised new challenges and opportunities. In this paper, we highlight recent progress in the development of waveguide-coupled deterministic SPSs towards scalable IPQCs, and review the post-growth tuning techniques that are specifically developed to engineer the optical properties of these WG-coupled SPSs. Future prospects on stringent requirement for the quantum engineering toolbox in the burgeoning field of integrated photonics are also discussed.</p></div>","PeriodicalId":100244,"journal":{"name":"Chip","volume":"1 3","pages":"Article 100018"},"PeriodicalIF":0.0,"publicationDate":"2022-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2709472322000168/pdfft?md5=1c902eeb90c42d7cf5a845897160aa7d&pid=1-s2.0-S2709472322000168-main.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83931467","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

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