{"title":"An EMC System Design Approach That Ensures MIL-E-6051 Safety Margins Are Incorporated","authors":"J. Somech","doi":"10.1109/ISEMC.1992.626050","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626050","url":null,"abstract":"This paper presents a comprehensive approach to Electromagnetic Compatibility (EMC) at the system level when it is required to demonstrate MIL-E-60S1 safety margins, briefly and are then used to derive the requirements for all subsystems down to each unit. The discussion is broken into two parts: intersystem and intrasystem compatibility. In both cases an apportionment method that ensures adequate system level margin is developed. A design example is worked out at the end to give a feel for the approach that is presented. System EMC requirements are discussed Introduction Electromagnetic Compatibility (EMC) of a complex system is extremely important and is a key ingredient to the success of a large Military or Aerospace program which is required to procure equipment that meet MIL-E-6051 specification. This specification states that all units in a system are required to demonstrate a 6 dB margin and all ordance a 20 dB margin. These are the margins that have to be designed and tested into a system in order to assure electromagnetic compatibility at the system level. The standard approach in most cases is to procure equipment that are certified to MIL-STD-461/462 and perform a limited EMC test while integrating them together. This unfotunately does not guarantee a 6 dB safety margin nor does it guarantee overall compatibility between the different subsystems, for the simple reason that the total number of boxes and their layout is not taken into account. It is also difficult to perform a system EMC test due to all the complex interactions between different subsystems and their interconnecting cables. The approach discussed below is a general one and applies to all programs, large or small, military or not. Before beginning the discussion, few definitions are given. unit: a stand alone component assembly: a collection of units that opperate together subsystem? several assemblies and units mounted system: a complete, self powered (in this case) entity: unit, assembly, subsystem or system together functionally independent equipment CH3169-0/92/0000-0012 $3.00 01992 IEEE 66 starting point of the EMC System Design is the system definition phase, during which the Electromagnetic Environment (EME) in which the system is intended to operate is characterized. The EME is defined based on the proximity of local transmitters, the presence of sensitive receivers, national or international frequency band constraints. This defines then the Intersystem Requirements which are to be met contractualy. Following the system definition phase, the system partitioning phase starts. It is during this phase that the system is divided into several subsystems that will perform the different functions. Intrasystem Compatibility, then, must be achieved in order that all subsystems will function harmoniously together. Figure 1 below shows a block diagram of the System Design Concept. Definition MIL-E-6051","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"62 1","pages":"68-71"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74221028","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"EMC Education At North Dakota State University","authors":"R. Nelson","doi":"10.1109/ISEMC.1992.626069","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626069","url":null,"abstract":"Efforts are being made at North Dakota State University (NDSU) to help students understand the importance of considering EMC in the design of electronic circuits and systems. These efforts include trying to introduce EMC concepts in “standard” undergraduate and graduate courses, as well as developing a dedicated EMC course entitled “Designing for Electromagnetic Compatibility”. The new course was first offered during the 1991 spring quarter and has both a lecture and measurements component. Unique aspects of the course have been made possible by regional industries. This paper describes the new course as well as other efforts being made to enhance EMC education at NDSU.","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"61 1","pages":"164-167"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86869265","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
S. Daijavad, W. Pence, B. Rubin, H. Heeb, S. Ponnapalli, A. Ruehli
{"title":"Methodology for evaluating practical EMI design guidelines using EM analysis programs","authors":"S. Daijavad, W. Pence, B. Rubin, H. Heeb, S. Ponnapalli, A. Ruehli","doi":"10.1109/ISEMC.1992.626044","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626044","url":null,"abstract":"Most companies oflering products that mus t pass FCC or’ other regulatory agency specifications have compiled EMI design guidelines which are practiced b y their engineers. I n this paper, we take one such practical E M I design guideline and, through extensive use of a state-of-the-art electromagnetic analysis code, investigate its range of applicability, and show its lamitations. The emphasis is placed on the methodology, rather than the guideline itself, so that a framework is established under which other EMI design guidelines can be similarly “revisited”.","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"83 1","pages":"30-34"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"91130306","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Finite Element Analysis Of The Electromagnetic Radiation From A VLSI Package Heatsink","authors":"D. N. Ladd, G. Costache","doi":"10.1109/ISEMC.1992.626059","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626059","url":null,"abstract":"The finite element method is applied to study the electromagnetic radiation from a VLSI package heatsink. A heatsink fastened to the IC package can be effective in eliminating performance degrading thermal effects, however its presence will also alter the pattern of the electromagnetic radiation. This paper does not deal with any thermal considerations, but looks only at the influence of various heatsink configurations on the radiated electromagnetic field. The finite element algorithm solves the magnetic field distribution about an axisymmetric model of an integrated circuit mounted onto a heatsink. The configurations are simplified and an equivalent induced noise voltage source is used to excite the antenna consisting of the chip and the heatsink. A radiation boundary condition allows the mesh to be truncated close to the heatsink. Results presented show how the configurations can either reduce or increase the radiated emissions.","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"5 1","pages":"120-123"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90321294","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Shielding Quality Of Cables And Connectors: Some Basics For Beller Understanding Of Test Methods","authors":"B. Szentkuti","doi":"10.1109/ISEMC.1992.626098","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626098","url":null,"abstract":"In wide frequency ran es the electromagnetic coupling through a cable shieldmay be well simulated with a longitudinal1 homo eneous set-up (transfined: (surface) transfer impedance Z, b / m ) and capacitive coupling impedance Z, (Q/m). They are not dependent on the test set-up, in contrary to the \"shielding attenuation\". The coupling transfer function (T) throu h the shield nuation into ZT and ZF, at any frequency where ZT and Z, may be defined. The shielding quality (and intrinsic shield parameters) may be tested also with \"field methods\", some of them not having a basic upper frequency limit of application. The concepts used for coaxial cables may be a p p lied to multi-wire cables and to connectors and cable asmission line). The intrinsic CO L 9 le shie d ammeters are dei s given. It allows to convert the test data or s f ielding atteGlossary of Important Terms 1 and 2 = outer and inner circuit, see fig. 2 n and f = near and far end (seen from generator) Subscripts only used if distinction i s necessary (surface) transfer impedance (of a cable ihield) ' transfer impedance [of a connector) capacitive coupling impedance (of a cable shield) capacitive coupling impedance (of a connector] through capacitance (of a cable shield) i d T 1 3 characteristic impedances of the transmission lines formed by circuits (1 ) and (2) , see fig. 2 max IZ,+ZTl length of cable section under test shield diameter coupling (transfer) function shielding attenuation As = 20 log IT I summing function, argument I-f 4 7 7 2","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"191 1","pages":"294-301"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88473453","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Electromagnetic Leakage From Shielded Cables By Pigtail Effect","authors":"Han Fang","doi":"10.1109/ISEMC.1992.626094","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626094","url":null,"abstract":"In this paper, theoretical analyses and exper. imental results are carried out on the electromagnetic leak. age from shielded cables caused by pigtail effect. Calcula. tions of the leakage are presented on the basis of transmis. sion line theory and antenna theory, and are in excellent agreement with the experiment. Finally, certain protective methods and techniques are introduced, which exhibit at least 30 dB suppressions against the pigtail effect.","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"1 1","pages":"278-282"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76583502","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Backplane Connector Radiated Emission And Shielding Effectiveness","authors":"L.K.C. Wong","doi":"10.1109/ISEMC.1992.626106","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626106","url":null,"abstract":"Effective use of connector technology is a critical component in the design approach to electromagnetic interference control. “Pin-and-box” type of connectors used on backplanes are significant radiators of RF energy at system clock speeds of over 100 MHz. Experimental data obtained from a high bandwidth TEM cell and from the anechoic chamber measurement are used to show the effectiveness of different ground pin shielding patterns. Shielding effectiveness of an experimental backplane connector shield is also presented.","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"100 1","pages":"346-351"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74258840","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Causality and Maxwell's equations","authors":"E. Marx","doi":"10.1109/ISEMC.1992.626155","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626155","url":null,"abstract":"Causality is addressed in the context of the principles of electromagnetism for nonsinusoidal fields. Topics include Maxwell's equations, integral equations for scattering, stepping-in-time algorithms, dispersive media, and Green's functions.","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"59 1","pages":"503-507"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89425111","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Comparison between transfer impedance and shielding effectiveness testing","authors":"M. Kunkel, G. Kunkel","doi":"10.1109/ISEMC.1992.626066","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626066","url":null,"abstract":"Transfer impedance and shielding effectiveness testing was performed on a set of joint surfaces over the frequency range of 10 MHz to 1 GlrIz. The joint surfaces consisted of a set of plates and were: (1) a 6% inch outside diameter ring with a 4!/4 inch inside diameter; and (2) a 51/2 inch diameter disk. The plates were manufactured from !44 inch thick 6061-T6 aluminum and tin plated. The electromagnetic bonding was obtained using .040 inch thick zinc plated steel washers sandwiched between the plates and held in place with 6-32 screws on a 51/4 inch diameter ring. The number of screws and washers used were 2, 4 and 8 where the screws and washers were evenly spaced during each test.","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"38 1","pages":"149-153"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80655810","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A model for possible effects of electromagnetic fields on the occurrence of cancer","authors":"L. Hoeft","doi":"10.1109/ISEMC.1992.626091","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626091","url":null,"abstract":"A model has been developed for explaining the possible effects of electromagnetic fields on the occurrence of cancer.' This model postulates that electromagnetic fields increase the cell division rate and therefore the occurrence of natural or spontaneous cancers, e.g. those produced by radiation or chemicals. The increased cell division rate may occur because the biological system is able to perceive the presence of the electromagnetic field but is probably not able to identify it, at least not at low field strengths. The unidentified stimulus produces a physiological stress that increases the cell division rate. This model is consistent with most observations and can be used to make predictions.","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"20 1","pages":"266-268"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85386861","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}