2019 IEEE MTT-S International Microwave Symposium (IMS)最新文献_第10页

Impedance Sensing Integrated Directly into a Power Amplifier Output Matching Network 阻抗传感直接集成到功率放大器输出匹配网络

2019 IEEE MTT-S International Microwave Symposium (IMS) Pub Date : 2019-06-01 DOI: 10.1109/mwsym.2019.8700868

D. Donahue, P. D. de Falco, T. Barton

引用次数: 5

Millimeter-Wave SIW Filter Based on the Stepped-Impedance Face-to-Face E-Shaped DGSs 基于阶跃阻抗面对面e形dgs的毫米波SIW滤波器

2019 IEEE MTT-S International Microwave Symposium (IMS) Pub Date : 2019-06-01 DOI: 10.1109/mwsym.2019.8700813

G. Wen, Jian Li, Fuzhen Xie, Huiru Wang, Yongjun Huang

引用次数: 0

X-Band MMIC Balanced Frequency Doubler based on Graphene Diodes 基于石墨烯二极管的x波段MMIC平衡倍频器

2019 IEEE MTT-S International Microwave Symposium (IMS) Pub Date : 2019-06-01 DOI: 10.1109/mwsym.2019.8700987

A. Hamed, M. Saeed, Zhenxing Wang, M. Shaygan, D. Neumaier, R. Negra

引用次数: 6

Coupling Electromagnetic Waves to Spin Waves: A Compact Model for Frequency Selective Limiters 耦合电磁波与自旋波:频率选择限制器的紧凑模型

2019 IEEE MTT-S International Microwave Symposium (IMS) Pub Date : 2019-06-01 DOI: 10.1109/mwsym.2019.8700730

H. Cui, Z. Yao, Y. Wang

引用次数: 1

Single-Input Single-Output Digital Predistortion of Multi-user RF Beamforming Arrays 多用户射频波束形成阵列的单输入单输出数字预失真

2019 IEEE MTT-S International Microwave Symposium (IMS) Pub Date : 2019-06-01 DOI: 10.1109/mwsym.2019.8700932

E. Ng, A. Ayed, P. Mitran, S. Boumaiza

引用次数: 10

Design, Analysis and Evaluation of a Broadband High-Power Amplifier for Ka-Band Frequencies 一种ka波段宽带大功率放大器的设计、分析与评价

2019 IEEE MTT-S International Microwave Symposium (IMS) Pub Date : 2019-06-01 DOI: 10.1109/mwsym.2019.8700951

P. Neininger, L. John, P. Brückner, C. Friesicke, R. Quay, T. Zwick

引用次数: 17

Achieving Fully Autonomous System-on-Package Designs: An Embedded-on-Package 5G Energy Harvester within 3D Printed Multilayer Flexible Packaging Structures 实现完全自主的系统-封装设计:3D打印多层柔性封装结构中的嵌入式-封装5G能量采集器

2019 IEEE MTT-S International Microwave Symposium (IMS) Pub Date : 2019-06-01 DOI: 10.1109/mwsym.2019.8700931

Tong-Hong Lin, S. Daskalakis, A. Georgiadis, M. Tentzeris

{"title":"Achieving Fully Autonomous System-on-Package Designs: An Embedded-on-Package 5G Energy Harvester within 3D Printed Multilayer Flexible Packaging Structures","authors":"Tong-Hong Lin, S. Daskalakis, A. Georgiadis, M. Tentzeris","doi":"10.1109/mwsym.2019.8700931","DOIUrl":"https://doi.org/10.1109/mwsym.2019.8700931","url":null,"abstract":"A novel multilayer flexible packaging fabrication process using only additively manufacturing techniques including inkjet and 3 dimensional (3D) printing is proposed. The 3D printed ramp structures and inkjet printed transmission lines on top of that are suitable for mm-wave inter-layer connections because lower parasitics are induced to the system. Moreover, a system-on-package (SoP) design for backscattering radio-frequency identification (RFID) is proposed. It has to be stressed, that an RF energy harvester operated at 26 GHz which is embedded inside the packaging using additively manufacturing techniques is proposed for the first time. The output voltage of the harvested energy at a distance of 20 cm away from the source is 0.9 V with transmitted equivalent isotropically radiated power (EIRP) equal to 59 dBm. The harvested energy is large enough to power the TS3001 timer for backscattering and can support all energy requirements of the entire SoP design so that the SoP design is fully autonomous and no external board or components are required. The system size can be shrunk to package level and thus paving the way for a multitude of novel miniaturized autonomous modules for wearable, IoT, and 5G applications.","PeriodicalId":6720,"journal":{"name":"2019 IEEE MTT-S International Microwave Symposium (IMS)","volume":"30 1","pages":"1375-1378"},"PeriodicalIF":0.0,"publicationDate":"2019-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81543809","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 27

Enabling Reconfigurable All-Liquid Microcircuits via Laplace Barriers to Control Liquid Metal 通过拉普拉斯势垒实现可重构全液体微电路以控制液态金属

2019 IEEE MTT-S International Microwave Symposium (IMS) Pub Date : 2019-06-01 DOI: 10.1109/mwsym.2019.8700919

A. Watson, Kareem S. Elassy, T. Leary, M. A. Rahman, A. Ohta, W. Shiroma, C. Tabor

{"title":"Enabling Reconfigurable All-Liquid Microcircuits via Laplace Barriers to Control Liquid Metal","authors":"A. Watson, Kareem S. Elassy, T. Leary, M. A. Rahman, A. Ohta, W. Shiroma, C. Tabor","doi":"10.1109/mwsym.2019.8700919","DOIUrl":"https://doi.org/10.1109/mwsym.2019.8700919","url":null,"abstract":"Liquid metals such as gallium alloys have a unique potential to enable fully reconfigurable RF electronics. One of the major concerns for liquid-metal electronics is their interaction with solid-metal contacts, which results in unwanted changes to electrical performance and delamination of solid-metal contacts due to atomic diffusion of gallium at the liquid/solid interface. In this paper, we present a solution to this problem through way of liquid-metal/liquid-metal RF connections by implementing La-place barriers, which control fluid flow and position via pressure-sensitive thresholds to facilitate physical movement of the fluids within the channels. We demonstrate RF switching within the channel systems by fabricating, testing, and modeling a reconfigurable RF microstrip transmission line with integrated Laplace barriers which operates between 0.5–5 GHz. This approach opens the potential for future all-liquid reconfigurable RF electronic circuits where physical connections between solid and liquid metals are minimized or possibly eliminated altogether.","PeriodicalId":6720,"journal":{"name":"2019 IEEE MTT-S International Microwave Symposium (IMS)","volume":"7 1","pages":"188-191"},"PeriodicalIF":0.0,"publicationDate":"2019-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84330702","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Single Conversion Stepped-Frequency Continuous-Wave Radar Using Self-Injection-Locking Technology 采用自注入锁定技术的单转换步进频率连续波雷达

2019 IEEE MTT-S International Microwave Symposium (IMS) Pub Date : 2019-06-01 DOI: 10.1109/mwsym.2019.8700815

Wei-Chih Su, Mu-Cyun Tang, Rezki El Arif, T. Horng, Fu-Kang Wang

引用次数: 6

A 10W Fully-Integrated LDMOS MMIC Doherty in LGA Package for 2.7GHz Small Cell Application 用于2.7GHz小型小区应用的10W全集成LDMOS MMIC Doherty LGA封装

2019 IEEE MTT-S International Microwave Symposium (IMS) Pub Date : 2019-06-01 DOI: 10.1109/mwsym.2019.8700870

Liang Lin, Lin Yang, Shuangshuang Zheng, Jiangyan Peng

{"title":"A 10W Fully-Integrated LDMOS MMIC Doherty in LGA Package for 2.7GHz Small Cell Application","authors":"Liang Lin, Lin Yang, Shuangshuang Zheng, Jiangyan Peng","doi":"10.1109/mwsym.2019.8700870","DOIUrl":"https://doi.org/10.1109/mwsym.2019.8700870","url":null,"abstract":"A two-stage integrated Doherty power amplifier (PA) was designed on latest LDMOS MMIC die and fully integrated with input splitter, output match and combiner as a module with 50ohm in-out characteristics for 2.7GHz LTE small cell application (an industry first). The two stage PA MMIC was fabricated with a size of 3× 2.7 mm2 and was mounted on a Printed Circuit Board (PCB) laminate in 7 × 7 mm2 LGA package. An asymmetric integrated Doherty configuration was adopted with the uneven input power splitting network for better Efficiency. To improve linearity, the third-order intermodulation distortion (IMD3) was simulated and optimized by enhancing VBW (video bandwidth). The output combiner for integrated Doherty is simulated and designed carefully using novel capacitor cancellation method to get good bandwidth and Eff. Using a six-carrier LTE signal with a PAPR of 9 dB and a channel bandwidth of 20 MHz at 2.6 GHz, the full PA (an industry first) exhibited a power gain of 27 dB, 10W peak power, a power-added efficiency (PAE) of 41%, and an ACLR of -31dBc at an average output power of 31 dBm. It was lowered to -51dBc after a digital pre-distortion process.","PeriodicalId":6720,"journal":{"name":"2019 IEEE MTT-S International Microwave Symposium (IMS)","volume":"39 1","pages":"1434-1437"},"PeriodicalIF":0.0,"publicationDate":"2019-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84947482","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3