2019 20th International Conference on Electronic Packaging Technology(ICEPT)最新文献_第7页

Research on BCB/Cu thin film multilayer interconnection technology based on LTCC substrate for Microsystem Integration 微系统集成中基于LTCC衬底的BCB/Cu薄膜多层互连技术研究

2019 20th International Conference on Electronic Packaging Technology(ICEPT) Pub Date : 2019-08-01 DOI: 10.1109/ICEPT47577.2019.245776

Jing Chen, Lei Ding, Weipeng Ren, Tao Chen, Lichun Wang, Tao Zhao

引用次数: 1

Enhanced antioxidant and size controllable Cu@Ag core-shell nanoparticles conductive inks for flexible printed electronics 增强抗氧化和尺寸可控Cu@Ag核壳纳米颗粒导电油墨柔性印刷电子

2019 20th International Conference on Electronic Packaging Technology(ICEPT) Pub Date : 2019-08-01 DOI: 10.1109/ICEPT47577.2019.245354

Wenwu Zhang, Yichen Cao, Lin Zhang, H. Ji, Mingyu Li

{"title":"Enhanced antioxidant and size controllable Cu@Ag core-shell nanoparticles conductive inks for flexible printed electronics","authors":"Wenwu Zhang, Yichen Cao, Lin Zhang, H. Ji, Mingyu Li","doi":"10.1109/ICEPT47577.2019.245354","DOIUrl":"https://doi.org/10.1109/ICEPT47577.2019.245354","url":null,"abstract":"Cost-effective Cu nanoparticles (NPs) for flexible electronics at low temperature sintering and in atmosphere conditions is difficult in response to their poor antioxidation. In this paper, a novel Cu@Ag core-shell nanoparticle with high antioxidant and size controllable characteristic using chemical reduction method was synthesized, and the corresponding conductive pastes by low temperature sintering was successfully applied to flexible printed electronics. The distinct thicknesses of Ag shell with the different [Cu]/[Ag] molar ratios were obtained. In contrast to sintering of conductive thin film of different thicknesses of Ag shell at low temperature, it is obvious that thicker Ag shell was beneficial for sintering densification and enhancing antioxidant, the corresponding resistivity significantly declined from 34.85μΩ•cm to 15.31μΩ•cm at 240°C. Besides, this air stable Cu@Ag NPs with excellent oxidation resistance were saved beyond 30 days and hardly oxidized during the process of sintering below 270°C. Finally, the flexible conductive thin film exhibited good bending-resistance with different bending radius and cycles under low sintering temperature, which has a promising potential to be applied for flexible printed electronics.","PeriodicalId":6676,"journal":{"name":"2019 20th International Conference on Electronic Packaging Technology(ICEPT)","volume":"18 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75349981","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

ICEPT 2019 Cover Page ICEPT 2019封面

2019 20th International Conference on Electronic Packaging Technology(ICEPT) Pub Date : 2019-08-01 DOI: 10.1109/icept47577.2019.9081085

引用次数: 0

A SiC Based Integrated Micropillar Array Wick Thin Plate Heat Pipe Investigation 基于SiC的集成微柱阵列芯薄板热管研究

2019 20th International Conference on Electronic Packaging Technology(ICEPT) Pub Date : 2019-08-01 DOI: 10.1109/ICEPT47577.2019.245730

Xinru Li, Huiyu Yu, Zhenyu Wang

{"title":"A SiC Based Integrated Micropillar Array Wick Thin Plate Heat Pipe Investigation","authors":"Xinru Li, Huiyu Yu, Zhenyu Wang","doi":"10.1109/ICEPT47577.2019.245730","DOIUrl":"https://doi.org/10.1109/ICEPT47577.2019.245730","url":null,"abstract":"Compared with other heat dissipation systems, flat plate heat pipe (FPHP) can be manufactured in a thin plate shape, which is useful for microelectronics cooling system. Considering the SiC substrate has the same high thermal conductivity and the matched thermal expansion as the SiC-based devices, a SiC micropillar wick thin flat plate heat pipe (FPHP) architecture is proposed here for heat dissipation of SiC power devices. To compensate the requirements of bonding strength and etching uniformity, the hexagon micropillar wick architecture was fabricated inside the FPHPs. Meanwhile, the identical Si-Glass FPHPs were fabricated for comparison. The accurate and comprehensive analysis and comparison of SiC-Glass FPHP and Si-Glass FPHP were conducted utilizing the infrared (IR), Raman and high-speed camera equipment. During experiments, the maximum boiling zone of liquid inside SiC-Glass FPHP was much larger than that of Si one due to the specific heat capacity difference. The SiC-Glass FPHP CHF was close to 120 W/cm2, with a maximum 11 mm diameter boiling range. The Si-Glass one was only 55 W/cm2, with a maximum 6 mm diameter nucleate boiling range. Apparently, the SiC-Glass FPHP had a higher thermal dissipation efficiency than Si one.","PeriodicalId":6676,"journal":{"name":"2019 20th International Conference on Electronic Packaging Technology(ICEPT)","volume":"60 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76590129","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Image classification and analysis during the additive manufacturing process based on deep convolutional neural networks 基于深度卷积神经网络的增材制造过程图像分类与分析

2019 20th International Conference on Electronic Packaging Technology(ICEPT) Pub Date : 2019-08-01 DOI: 10.1109/ICEPT47577.2019.245264

Feng Han, Jingling Zou, Y. Ai, Chunlin Xu, Sheng Liu, Sheng Liu

引用次数: 3

Study on Thermal Conductivity of Micro-arc Alumina Substrate for High Power LED 大功率LED微弧氧化铝基板导热性能研究

2019 20th International Conference on Electronic Packaging Technology(ICEPT) Pub Date : 2019-08-01 DOI: 10.1109/ICEPT47577.2019.245198

Lei Jiu, Mingqiang Pan, Jun Sheng

{"title":"Study on Thermal Conductivity of Micro-arc Alumina Substrate for High Power LED","authors":"Lei Jiu, Mingqiang Pan, Jun Sheng","doi":"10.1109/ICEPT47577.2019.245198","DOIUrl":"https://doi.org/10.1109/ICEPT47577.2019.245198","url":null,"abstract":"Substrate heat dissipation is the main way of heat dissipation of LED chip, and improving its heat dissipation performance is the key to solving the heat dissipation of high-power LED. In this paper, 10-40μm oxide film was grown in situ on the surface of 2024 aluminum alloy as the insulating layer of insulating metal substrate (IMS) by micro-arc oxidation. 3W LED lamp beads are used as heat sources to be packaged on the traditional heat-dissipating substrate and micro-arc alumina substrate. The temperature difference and thermal resistance on both sides of the packaging substrate when the LED lamp works normally are measured by temperature measuring device. The heat dissipation performance of different packaging substrate and the heat conduction effect of micro-arc alumina substrate with oxide film thickness of 10-40μm are studied under the condition of satisfying the unity and standardization of the experimental conditions. Experiments show that:(1) Under the constant current of 600 mA, the temperature difference of the micro-arc alumina substrate is reduced by 511 °C compared with the conventional heat-dissipating substrate, and the thermal resistance of the substrate is reduced by 40%-60%; (2) The thermal resistance of the micro-arc alumina substrate decreases with the decrease of the thickness of the micro-arc oxide film layer. When the film layer is 10μm, the thermal resistance of the substrate is reduced by 10%-40% compared with other thicknesses.","PeriodicalId":6676,"journal":{"name":"2019 20th International Conference on Electronic Packaging Technology(ICEPT)","volume":"31 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73561163","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

The Process Parameter Simulation of Press-fit Pin in a Power Module 电源模块压合销工艺参数仿真

2019 20th International Conference on Electronic Packaging Technology(ICEPT) Pub Date : 2019-08-01 DOI: 10.1109/ICEPT47577.2019.245190

E. Yang, R. Qian, Alex Yao, Yong Liu

引用次数: 1

Study on photoelectrical properties of Nb-MoS2, theoretically and experimentally Nb-MoS2光电特性的理论与实验研究

2019 20th International Conference on Electronic Packaging Technology(ICEPT) Pub Date : 2019-08-01 DOI: 10.1109/ICEPT47577.2019.245182

Z. Qu, Huiru Yang, Jihe Du, Pan Gao, Zeheng Zhao, H. Ye, Guoqi Zhang

引用次数: 0

Study on High Density Fine pitch PCBA Cleaning Process Optimization Based on Ceramic Board and Flexible Plate 基于陶瓷板和柔性板的高密度细间距PCBA清洗工艺优化研究

2019 20th International Conference on Electronic Packaging Technology(ICEPT) Pub Date : 2019-08-01 DOI: 10.1109/ICEPT47577.2019.245201

Jianqiang Li, L. Ji, Wenhe Wang, Z. Pang, Haifeng Zhang, Dongmei Liu

引用次数: 0

Ultrasound-assisted soldering process performance of Sn-Ag-Ti(Ce, Ga) active solders on thin film ZnO substrate Sn-Ag-Ti(Ce, Ga)活性钎料在ZnO薄膜衬底上的超声辅助焊接工艺性能

2019 20th International Conference on Electronic Packaging Technology(ICEPT) Pub Date : 2019-08-01 DOI: 10.1109/ICEPT47577.2019.245215

Tao Sun, Min-bo Zhou, Ze-Jun Zhang, Xin-Ping Zhang

{"title":"Ultrasound-assisted soldering process performance of Sn-Ag-Ti(Ce, Ga) active solders on thin film ZnO substrate","authors":"Tao Sun, Min-bo Zhou, Ze-Jun Zhang, Xin-Ping Zhang","doi":"10.1109/ICEPT47577.2019.245215","DOIUrl":"https://doi.org/10.1109/ICEPT47577.2019.245215","url":null,"abstract":"ZnO has been widely used in electronic industries as semiconductor and photovoltaic materials. In this study, directly soldering ZnO thin film (ZnO-TF) coated on solar glass was achieved with ultrasound-assisted soldering iron using Sn3.5Ag4Ti(Ce, Ga) active solder at 250 °C in air. Results show that the active solder can rapidly wet and spread on ZnO-TF with ultrasonic assistance. No distinct intermetallic compound layer can be detected at the interface. With certain ultrasonic parameters, the average shear strength of solder/film joints reaches 23.9 MPa. Shear fracture occurs at the interface of joints and partial solder remains on the surface of the ZnO-TF, meaning that there is a firm bonding between the active solder and the ZnO-TF. Element analysis on fracture surfaces reveals that Ti content in the remnant solder on the ZnO-TF is higher than that in the solder matrix. Combined analyses based on adhesion theory and thermodynamic calculation manifest that Ti tends to adsorb at the ZnO film and the redox reaction between Ti and ZnO takes place during ultrasound-assisted soldering process.","PeriodicalId":6676,"journal":{"name":"2019 20th International Conference on Electronic Packaging Technology(ICEPT)","volume":"2 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"72928922","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1