The Process Parameter Simulation of Press-fit Pin in a Power Module

In this paper, a 3D finite element analysis (FEA) model is developed to simulate the process of inserting the press-fit pin in PCB board. In the package assembly process, the bottom of pin base is attached on DBC by laser soldering process. In the process of inserting press-fit pin in PCB board, the pin base will support the pin pillar and push pin head into the hole of PCB board. Contact pairs between pin bottom and pin pillar, between pin head and PCB hole, between pin side and hole of module case, between pin pillar and DBC top are defined. The risk of laser tooling displacement and pin tilt are studied through simulation. The impact of PCB offset on the two failure modes is also studied. The simulation results agreed with the actual test trends.