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2019 42nd International Spring Seminar on Electronics Technology (ISSE)最新文献

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Reliability of Glued Joints on Flexible Substrates During Accelerated Current Ageing 柔性基板上胶合接头在加速电流老化过程中的可靠性
2019 42nd International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2019-05-01 DOI: 10.1109/ISSE.2019.8810273
M. Hirman, J. Navrátil, F. Steiner, A. Hamácek
{"title":"Reliability of Glued Joints on Flexible Substrates During Accelerated Current Ageing","authors":"M. Hirman, J. Navrátil, F. Steiner, A. Hamácek","doi":"10.1109/ISSE.2019.8810273","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810273","url":null,"abstract":"This paper deals with reliability of joints glued by non-conductive adhesives (NCA) on flexible substrates during electrical current ageing. Also the comparison of NCA joints ageing with ECA joints ageing is presented in this paper. Two types of adhesives were used for the experiment-non-conductive UV curable acrylic adhesive Loctite AA3926 (NCA) and electrically conductive two part epoxy adhesive MG 8331S (ECA). The purpose of the experiment was to verify the reliability of NCA joints during the electrical current accelerated ageing. The electrical resistance of UV NCA joints on flexible DuPont Pyralux substrate before, during and after electrical current load was better than resistance of ECA joints and UV NCA can be recommended.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"39 1","pages":"1-7"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76673149","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Loss Factor and Non-Linearity of Volt-Ampere Characteristic of Capacitors from Metalized PP Film 金属化PP薄膜电容器伏安特性的损耗因子和非线性
2019 42nd International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2019-05-01 DOI: 10.1109/ISSE.2019.8810267
P. Mach, M. Horák
{"title":"Loss Factor and Non-Linearity of Volt-Ampere Characteristic of Capacitors from Metalized PP Film","authors":"P. Mach, M. Horák","doi":"10.1109/ISSE.2019.8810267","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810267","url":null,"abstract":"Capacitors made of polypropylene film metalized on one or both surfaces are examined for a long time. The loss factor of these capacitors is very low and its changes during the climatic aging are low. Therefore, there are examined new ways how to inspect the changes of quality of these capacitors. One possible way is measurement of non-linearity of Voltage-current characteristic of these capacitors. This parameter is evaluated according to the value of the third harmonics component that occurs on the capacitor when it is supplied with a sinusoidal current. The capacitors from five different manufacturers have been temperature aged for 5,316 hours and values of the loss factor and non-linearity have been measured continuously throughout the aging period. It has been found that for some types of capacitors the courses are similar, whereas for other type differs significantly. The reason is using of different types of PP film and technology of capacitors manufacturing.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"13 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90535805","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Impact of Atmospheric Discharges on Thick-Films Electrodes 大气放电对厚膜电极的影响
2019 42nd International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2019-05-01 DOI: 10.1109/ISSE.2019.8810275
Tomasz Matusiak, A. Dąbrowski, L. Golonka
{"title":"Impact of Atmospheric Discharges on Thick-Films Electrodes","authors":"Tomasz Matusiak, A. Dąbrowski, L. Golonka","doi":"10.1109/ISSE.2019.8810275","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810275","url":null,"abstract":"In this article, we present the results of work on the effect of Atmospheric Pressure Glow Discharge (APGD)on the reliability of various screen printed electrodes depostied on Low Temperature Co-fired Ceramics (LTCC)and alumina substrate (96% Al2O3). Influence of electrodes material and their thickness has been checked with AC-driven discharge at ambient air.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"20 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80604894","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Application of Stretchable Membrane with Ferrite Flaky Fillers in Inductive Displacement Sensor 铁氧体片状填料可拉伸膜在电感式位移传感器中的应用
2019 42nd International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2019-05-01 DOI: 10.1109/ISSE.2019.8810260
N. Blaz, M. Kisić, L. Zivanov, Č. Žlebič, S. Aleksic, M. Damnjanović
{"title":"Application of Stretchable Membrane with Ferrite Flaky Fillers in Inductive Displacement Sensor","authors":"N. Blaz, M. Kisić, L. Zivanov, Č. Žlebič, S. Aleksic, M. Damnjanović","doi":"10.1109/ISSE.2019.8810260","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810260","url":null,"abstract":"In this paper implementation of composite membrane with LTCC (Low Temperature Co-fired Ceramic)ferrite flaky fillers in realization of inductive displacement sensor is presented. Membrane was realized by placing a silicone layer in mold, followed by adding ferrite flaky fillers in active area of membrane. Final step in membrane realization was addition of top layer of silicone. Sensor was realized by employing 3D printing technology and it was made of four main parts: bottom part with spiral inductor, spacer in the middle and stretchable membranes covered with top part.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"334 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86290927","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Impact of Warpage Effects on Quality and Reliability of Solder Joints 翘曲效应对焊点质量和可靠性的影响
2019 42nd International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2019-05-01 DOI: 10.1109/ISSE.2019.8810270
Oliver Albrecht, H. Wohlrabe, K. Meier
{"title":"Impact of Warpage Effects on Quality and Reliability of Solder Joints","authors":"Oliver Albrecht, H. Wohlrabe, K. Meier","doi":"10.1109/ISSE.2019.8810270","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810270","url":null,"abstract":"Printed circuit boards (PCB)and SMD packages are made from different materials which coefficients of thermal expansion can differ much. Hence, under thermal load, e.g. board assembly or at field conditions, PCB and package deformation and deviation from the initial state often occur as warpage. During board assembly this warpage can cause failures such as open solder joints and/or shorts of solder joints. In this paper, the use the of shadow moire technique will be introduced for capturing the warpage under thermal loads. Measurement results of single substrates and a selected BGA package will be shown. Furthermore, a design process for PCBs to be applied for investigation of the influence of assembly process parameter will be described. It is assumed that the applied variations and their influence on the assembly quality are linked by the equilibrium of mechanical forces between PCB, BGA and solder joint. Additionally, it is assumed that mechanical stress - especially in out-of-plane direction-may occur in the solder joints. These thoughts apply for soldering process as well as temperature cycling conditions. A finite element model was implemented to analyze the stress for the selected BGA under defined conditions and to investigate warpage impacts on reliability. Finally, a novel approach to measure the electrical functionality will be introduced addressing BGAs under test which come with a high number of connections.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"21 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88120967","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Stress Characterization of Ceramic Substrates by Laser Speckle Photometry 激光散斑光度法表征陶瓷衬底的应力
2019 42nd International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2019-05-01 DOI: 10.1109/ISSE.2019.8810271
Lili Chen, U. Cikalova, S. Muench, M. Roellig, B. Bendjus
{"title":"Stress Characterization of Ceramic Substrates by Laser Speckle Photometry","authors":"Lili Chen, U. Cikalova, S. Muench, M. Roellig, B. Bendjus","doi":"10.1109/ISSE.2019.8810271","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810271","url":null,"abstract":"Direct copper bonding (DCB) substrate consisting of an Al2O3-ceramic layer in between two thick copper layers is one of the most powerful ceramic substrates for electronic applications. During the manufacturing process or under the service loading, high thermal or mechanical stress would be occurred. Extreme stress concentration might increase and in consequence copper structure rip off the ceramic substrates by cracking and conchoidal fractures. To avoid the crack initiation and guarantee a good quality state of ceramic substrates, the residual stress condition should be monitored. In this paper, an optical non-destructive testing method - Laser Speckle Photometry (LSP) will be demonstrated to determine mechanical stresses in ceramic substrates. The static speckle pattern is generated on the sample surface by illumination of a laser source, and sample is loaded by a 3-point-bending device to introduce surface strain, which activates a time resolved speckle signal. By recording and analyzing the quasi static speckle pattern, the speckle signal can be related to applied external mechanical signal. The resulting measurement signal was calibrated by stresses, calculated via a finite-element-model FEM. The potential of LSP for non-destructive characterization and monitoring of stress condition will be shown in details.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"45 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81006213","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Influence of Temperature Shocks on Climatic Aging of Conductive Adhesive Joints 温度冲击对导电胶接头气候老化的影响
2019 42nd International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2019-05-01 DOI: 10.1109/ISSE.2019.8810175
Ferdinand Závora, P. Mach
{"title":"Influence of Temperature Shocks on Climatic Aging of Conductive Adhesive Joints","authors":"Ferdinand Závora, P. Mach","doi":"10.1109/ISSE.2019.8810175","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810175","url":null,"abstract":"Adhesive joints made of two types of electrically conductive adhesives with epoxy matrix and silver filler were prepared by adhesive assembly of 0R0 resistors of the type 1206 on test boards that made four-point measurement of the joints resistance possible. The adhesives were applied by stencil printing. The joints were first exposed by 10 or 40 temperature shocks −40/+80 ° C. The exposure time of the samples at each temperature was 15 minutes; the time of the temperature change did not exceed 10 seconds. Then the joints were climatic treated at 80 °C and 80% relative humidity for 168 and 336 hours, respectively. It was inspected how the exposition of the joins by the temperature shocks will influence their resistance and and subsequently changing their resistance to climatic treatment. It was found that application of temperature shocks improved electrical conductivity of the joints formed of one adhesive and did not change properties of the joints made of the second one. An influence of the temperature shocks on the course of the climatic treatment of the joints was not found.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"33 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81315850","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
3D Micro-Transformers Fabricated Inside Ferrite-Dielectric LTCC Substrate 在铁氧体-介电LTCC衬底内制造三维微变压器
2019 42nd International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2019-05-01 DOI: 10.1109/ISSE.2019.8810165
A. Maric, L. Zivanov
{"title":"3D Micro-Transformers Fabricated Inside Ferrite-Dielectric LTCC Substrate","authors":"A. Maric, L. Zivanov","doi":"10.1109/ISSE.2019.8810165","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810165","url":null,"abstract":"Presented findings referee to continuance of research of ceramic passive components (inductors and transformers). Paper presents design, fabrication and characterization results of three 3D micro-transformers fabricated inside combined ferrite-dielectric LTCC (Low Temperature Co-fired Ceramics)stack. Basic designed geometry consists of centrally connected three turn square overlapping windings (primary and secondary)placed on different tape layers of the formed LTCC stack. Transformers windings are placed on outer dielectric tapes and number of ferrite tapes in between is varied. Characterization is performed in lower RF range and results of transformer windings inductance and Q-factor are presented. It is shown that inductance and Q-factor values of primary winding do not vary much with increase of thickness of ferrite layer. However, increase of the same characteristics value of secondary winding is noticeable as number of in-between tapes increases (44% inductance and 25% Q-factor value of the secondary winding).","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"13 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75097884","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Research of the Photocapacitor Effect in A2B6 Monocrystals A2B6单晶中光电电容效应的研究
2019 42nd International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2019-05-01 DOI: 10.1109/ISSE.2019.8810269
O. Oliinyk, O. Tsybulskyi, Viktor Sergiychuk, B. Tsyganok
{"title":"Research of the Photocapacitor Effect in A2B6 Monocrystals","authors":"O. Oliinyk, O. Tsybulskyi, Viktor Sergiychuk, B. Tsyganok","doi":"10.1109/ISSE.2019.8810269","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810269","url":null,"abstract":"This paper is devoted to the research of the photocapacitor effect in A2B6 semiconductor crystals - CdS and CdTe monocrystals with needle structure. Unlike existing thin film monocrystals and bulk materials manufactured from CdS/CdTe, the monocrystals mentioned above have high photoconductivity (Rdark/Rlight = 104 and higher)and low lifetime of charge carriers (less than 1 ms). This feature allowed creating a variable depletion capacitance in the metal-semiconductor contact, its value can be reduced almost to the zero by generating photoelectrons near the contact region. The experimental results of the transmission of rectangular pulses through structures CdS-Indium and CdTe-Indium have been obtained. Irradiation intensity limits has been found, after which the depletion capacitance becomes insignificantly small compared to the diffusion capacity inside the photoconductive crystals.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"189 1","pages":"1-2"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77653531","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Electronic Sensor System for Monitoring the Temperature Status of Rolling Stock in Motion 监测运动中机车车辆温度状态的电子传感器系统
2019 42nd International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2019-05-01 DOI: 10.1109/ISSE.2019.8810185
A. Stoynova, N. Nenov, B. Bonev, Desislava Yosifova
{"title":"Electronic Sensor System for Monitoring the Temperature Status of Rolling Stock in Motion","authors":"A. Stoynova, N. Nenov, B. Bonev, Desislava Yosifova","doi":"10.1109/ISSE.2019.8810185","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810185","url":null,"abstract":"This work is an important step in the building of a Checkpoint System - national system for monitoring and control of rolling stock during motion, for the needs of the railway infrastructure in Bulgaria. Implementation of the system ensures a high level of safety of train movements and prevention of railway incidents. A basic function of the whole system is the identification of unacceptable overheating of rolling stocks' components mainly wheel bearing assemblies and brake sets, and/or other components of a rail vehicle. The chosen approach involves the use of non-contact infrared temperature sensors. It can be used also thermal imaging cameras instead of individual temperature sensors, which increase the possibilities of the temperature status monitoring of the railway rolling stock. A concept, model and kit of a real-time system for thermal imaging have been developed and presented in the present paper. In order to optimize the efficiency of the overall system, a techno-economic analysis has been made.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"53 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75953227","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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