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2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)最新文献

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Thermal Stability of Bulk Heterojunction Photovoltaics Revealed by Electrical Scanning Probe Microscopy 电扫描探针显微镜研究体异质结光伏材料的热稳定性
2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO) Pub Date : 2018-08-01 DOI: 10.1109/3M-NANO.2018.8552218
Denghua Li, Zhemin Li, Shiwei Xu, Deng-hua Li, Yanlian Yang, Han Yan
{"title":"Thermal Stability of Bulk Heterojunction Photovoltaics Revealed by Electrical Scanning Probe Microscopy","authors":"Denghua Li, Zhemin Li, Shiwei Xu, Deng-hua Li, Yanlian Yang, Han Yan","doi":"10.1109/3M-NANO.2018.8552218","DOIUrl":"https://doi.org/10.1109/3M-NANO.2018.8552218","url":null,"abstract":"Thermal stability is very important for real application of bulk heterojunction (BHJ) solar cells. In this work, we report the thermal stability and degradation behavior of the BHJ solar cells. The evolution of the local structures and in situ charge separation and transport were revealed by electrical scanning probe microscopy (ESPM). The BHJ solar cells are composed of a 2D conjugated thienyl-substituted BDT with substituted TT (PBDTTT-C-T) or conventional semicrystalline poly(3-hexylthiophene) (P3HT) as the electron donors and [6,6]-phenyl C61-butyric acid methyl ester (PCBM) or indene-C60 bisadduct (ICBA) as the acceptors. Among these four material pair-wise combinations, the PBDTTT-C-T/ICBA combination show highest thermal stability (the PCE declined by 10.77%) while the P3HT/PCBM combination shown worst (declined by 42.82%). Morphological and charge information with nanoscale resolution were provided. The hole transport and mobility of the P3HT-based BHJ blend films declined significantly after the aging treatment. However, for the PBDTTT-C-T-based BHJ system, the hole current was even enhanced. Physical evolution processes were proposed to depict the thermal aging effects within the active layer. This work provides new insights into the rational design of thermally stable photovoltaic systems by considering mesoscopic heterogeneity.","PeriodicalId":6583,"journal":{"name":"2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)","volume":"327 1","pages":"390-396"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89692592","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
3M-NANO 2018 Cover Page 3M-NANO 2018封面
2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO) Pub Date : 2018-08-01 DOI: 10.1109/3m-nano.2018.8552169
{"title":"3M-NANO 2018 Cover Page","authors":"","doi":"10.1109/3m-nano.2018.8552169","DOIUrl":"https://doi.org/10.1109/3m-nano.2018.8552169","url":null,"abstract":"","PeriodicalId":6583,"journal":{"name":"2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)","volume":"12 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84635521","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
An Experimental Study of Ultrasonic Assisted Micro-Holes Drilling 超声辅助微孔钻孔的实验研究
2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO) Pub Date : 2018-08-01 DOI: 10.1109/3M-NANO.2018.8552163
Huadong Yu, G. Chen, Jinkai Xu, Jingdong Wang, Zhanjiang Yu, Xiliang Tang
{"title":"An Experimental Study of Ultrasonic Assisted Micro-Holes Drilling","authors":"Huadong Yu, G. Chen, Jinkai Xu, Jingdong Wang, Zhanjiang Yu, Xiliang Tang","doi":"10.1109/3M-NANO.2018.8552163","DOIUrl":"https://doi.org/10.1109/3M-NANO.2018.8552163","url":null,"abstract":"The ultrasonic vibration has increasing implementation in metal machining as an assisted method. It adds high frequency vibration with low amplitude to the workpiece or the cutting tool and it has been verified to have the great potential on cutting force reduction, surface quality improvement, tool wear decrease and so on. This paper applied the ultrasonic vibration to the micro-holes drilling of 30CrNiMo8. In order to identify the performance of the combination, an ultrasonic machine tool with the vibration in the feed direction was designed and assembled. The spindle speed and feed rate and were taken as the controlled variables and a series of experiments were carried out. The results indicated that the ultrasonic assisted micro-holes drilling transformed the drilling process and the mechanism of the chip formation, which noticeably suppressed the exit burrs and ensured the dimensional accuracy and the surface roughness of the micro-holes.","PeriodicalId":6583,"journal":{"name":"2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)","volume":"35 1","pages":"245-248"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83590586","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Analysis of Light-mass and High-strength Veins of Hind Wing from Asian Ladybird Beetle 亚洲瓢虫后翅轻质量高强度脉的分析
2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO) Pub Date : 2018-08-01 DOI: 10.1109/3M-NANO.2018.8552182
Jiyu Sun, Z. Song, Chunxiang Pan, Zhuo Liu
{"title":"Analysis of Light-mass and High-strength Veins of Hind Wing from Asian Ladybird Beetle","authors":"Jiyu Sun, Z. Song, Chunxiang Pan, Zhuo Liu","doi":"10.1109/3M-NANO.2018.8552182","DOIUrl":"https://doi.org/10.1109/3M-NANO.2018.8552182","url":null,"abstract":"The deployable hind wings of Coleoptera are highly specialized for their flight. The veins of Asian ladybird beetle (Harmonia axyridis) hind wings play a role in its flight. This paper investigates the structural morphology of veins of hind wing in H. axyridis. Additionally, considering the blood in veins, the total mass, and mass distribution of hind wings are studied. The results shown that the variation trend of mass result of the left and right hind wings are almost consistent with the difference of body weight, and the polynomial fit of the mass of left wings (m1), the mass of right wings (m2) and the body mass of H. axyridis (M) are polynomial functions, and the trends of two polynomial functions are similar. The tensile test results are proved that the hind wing of H. axyridis is a high toughness composites due to the veins’ network structure. The light-mass and high-strength vein of deployable hind wings of H. axyridis will be helpful to design biomimetic deployable micro air vehicle (MAV).","PeriodicalId":6583,"journal":{"name":"2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)","volume":"22 1","pages":"142-145"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85497585","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Calculation and Optimization of the Cover Model of an Engine Valve Chamber 某发动机气门室盖板模型的计算与优化
2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO) Pub Date : 2018-08-01 DOI: 10.1109/3M-NANO.2018.8552217
W. Cheng, Q. Yu, Jinkai Xu, Huadong Yu, Yonghua Wang
{"title":"Calculation and Optimization of the Cover Model of an Engine Valve Chamber","authors":"W. Cheng, Q. Yu, Jinkai Xu, Huadong Yu, Yonghua Wang","doi":"10.1109/3M-NANO.2018.8552217","DOIUrl":"https://doi.org/10.1109/3M-NANO.2018.8552217","url":null,"abstract":"At the beginning of the design of a certain type of engine, the dynamic analysis of the left and right valve chamber assembly of the engine is carried out by means of finite element method, and the modal calculation is carried out. The overall stiffness of the cover of the left and right valve chamber is evaluated. The modal frequency and mode of the hood cover are obtained. According to the calculation results, the scheme of the valve chamber cover is optimized. The modal analysis is carried out on the improved normal hood cover, and the final optimal scheme is obtained, which provides a reference for the followup design of the hood chamber cover of the engine. According to it. Compared with the original scheme, the improved scheme of the left valve chamber cover frequency is 1676Hz, which is 6.28% higher than that of the original scheme 1577Hz; the first order mode frequency 1729Hz in the assembly state of the right valve chamber cover is 14.88% higher than that of the original scheme.","PeriodicalId":6583,"journal":{"name":"2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)","volume":"156 1","pages":"228-231"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83370849","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Patterning Cr Film by Passing Electric Current through a Traversing Pointy Stylus: Introduction to Electrolithography and Its Prospects 电流通过横贯尖笔的铬膜图案化:电光刻技术简介及展望
2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO) Pub Date : 2018-08-01 DOI: 10.1109/3M-NANO.2018.8552166
Praveen Kumar, R. Pratap, S. Talukder, Sumit Kumar, Vijayendra Shastri, Raman Maurya, Mruthyunjaya Swamy K B
{"title":"Patterning Cr Film by Passing Electric Current through a Traversing Pointy Stylus: Introduction to Electrolithography and Its Prospects","authors":"Praveen Kumar, R. Pratap, S. Talukder, Sumit Kumar, Vijayendra Shastri, Raman Maurya, Mruthyunjaya Swamy K B","doi":"10.1109/3M-NANO.2018.8552166","DOIUrl":"https://doi.org/10.1109/3M-NANO.2018.8552166","url":null,"abstract":"Here, we introduce electrolithography, which is a recently developed lithography technique. Upon passage of electric current through a pointy cathode electrode placed on Cr film leads to formation and liquefaction of a Cr compound, which then flows away from the cathode in a radially symmetric fashion, thereby removing the Cr layer. If the pointy electrode, akin to a stylus, is traversed along a path, a trench will be patterned in the Cr film, which can then be transferred to other materials. Firstly, we describe the process of electrolithography and then we discuss the effects of the force applied on the stylus and the polymer layer placed in between substrate and Cr film on this lithography process. Finally, we discuss future prospects of electrolithography.","PeriodicalId":6583,"journal":{"name":"2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)","volume":"19 1","pages":"181-185"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88790318","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
A Label-Free Electrochemical Biosensor Based on Ligand-Receptor Interaction 基于配体-受体相互作用的无标记电化学生物传感器
2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO) Pub Date : 2018-08-01 DOI: 10.1109/3M-NANO.2018.8552168
Xiyuan Liu, Ru Zhang, C. Rejeeth, Sohel Rana, D. Gurav, Kun Qian
{"title":"A Label-Free Electrochemical Biosensor Based on Ligand-Receptor Interaction","authors":"Xiyuan Liu, Ru Zhang, C. Rejeeth, Sohel Rana, D. Gurav, Kun Qian","doi":"10.1109/3M-NANO.2018.8552168","DOIUrl":"https://doi.org/10.1109/3M-NANO.2018.8552168","url":null,"abstract":"We demonstrated a label-free electrochemical biosensor for detection of cell surface receptor (CSR) based on ligand-receptor interaction between its corresponding bioactive substance (BS) and the cell membrane receptor. The biosensor was fabricated through layer-by-layer (LBL) deposition method using chitosan (Chi) and bioactive substance conjugated multi-walled carbon nanotubes (MWCNTs-BS). Our optimized CSR detection approach using the designer biosensor yielded a linear detection range wildly from 1 ng/mL to 10,000 ng/mL, achieving the limit of detection (LOD) of 0.106 ng/mL.","PeriodicalId":6583,"journal":{"name":"2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)","volume":"100 1","pages":"341-344"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80377525","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Crosstalk Analysis and Optimization of Gaussian Networks-on-Chip 片上高斯网络的串扰分析与优化
2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO) Pub Date : 2018-08-01 DOI: 10.1109/3M-NANO.2018.8552224
Yingxue Du, Yiyuan Xie
{"title":"Crosstalk Analysis and Optimization of Gaussian Networks-on-Chip","authors":"Yingxue Du, Yiyuan Xie","doi":"10.1109/3M-NANO.2018.8552224","DOIUrl":"https://doi.org/10.1109/3M-NANO.2018.8552224","url":null,"abstract":"Gaussian-based optical networks-on-chips (ONoCs) have significant topological advantages over mesh and torus networks in terms of network diameter and average jump distance. However, the crosstalk noise that accumulates in the network can cause severe performance degradation and limit the scalability of the network. Therefore, this paper analyzes the three aspects of basic optical elements, optical router and network, and proposes a Gaussian-based ONoCs worst-case crosstalk noise and signal-to-noise ratio (SNR) analysis model. In addition, we use Cygnus and crossbar optical routers for numerical simulations to verify the feasibility of the proposed analytical model. In order to improve the availability of Gaussian networks, we propose an optimization method to improve network performance that can effectively avoid the worst case.","PeriodicalId":6583,"journal":{"name":"2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)","volume":"50 1","pages":"321-325"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84164563","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Nanofabrication Techniques Used for Suppressing Multipactor in Space Applications 在空间应用中用于抑制多因子的纳米制造技术
2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO) Pub Date : 2018-08-01 DOI: 10.1109/3M-NANO.2018.8552197
Jing Yang, W. Cui, Guibai Xie, Y. Bao, M. Ye, Qiangqiang Song
{"title":"Nanofabrication Techniques Used for Suppressing Multipactor in Space Applications","authors":"Jing Yang, W. Cui, Guibai Xie, Y. Bao, M. Ye, Qiangqiang Song","doi":"10.1109/3M-NANO.2018.8552197","DOIUrl":"https://doi.org/10.1109/3M-NANO.2018.8552197","url":null,"abstract":"A significant trouble in high power microwave (HPM) systems is multipactor discharge – an avalanche of electrons resulting from the secondary electron emission (SEE). It would cause serious problems and limits the attainable power. Nano fabrication techniques, such as sputtering, photolithography, etching and Graphene, are adopted to reduce the secondary electron yield (SEY) of a material to improve multipactor discharge threshold. It is clearly demonstrated that these fabrications can suppress the SEY efficiently. The influence of surface characteristic on SEY is discussed to find that increase porosity and aspect ratio will reduce SEY. These results provided a criterion to determine nanofabrication techniques for multipactor suppression.","PeriodicalId":6583,"journal":{"name":"2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)","volume":"18 1","pages":"241-244"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75486553","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
A Method of Studying the Effect of Stress and Thermal-stress Coupling on the Thermal Conductivity of the Film 一种研究应力和热应力耦合对薄膜导热性影响的方法
2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO) Pub Date : 2018-08-01 DOI: 10.1109/3M-NANO.2018.8552200
Zhibin Li, Hairong Wang, Huiying Zhao, Hanqing Gu, Jiuhong Wang, Yizhen Ding
{"title":"A Method of Studying the Effect of Stress and Thermal-stress Coupling on the Thermal Conductivity of the Film","authors":"Zhibin Li, Hairong Wang, Huiying Zhao, Hanqing Gu, Jiuhong Wang, Yizhen Ding","doi":"10.1109/3M-NANO.2018.8552200","DOIUrl":"https://doi.org/10.1109/3M-NANO.2018.8552200","url":null,"abstract":"This paper designs a film stress device which can apply stress to the film attached to a substrate, and describes the detailed structure of the film stress device, the strain of the central region of the film can be equal, the film strain calculation method and the derivation process are given, it can adjust the strain of the film by controlling the feed displacement of the device. The testing system is designed by combining the film stress device with the 3ω method, it can be used to study the effect of stress and thermal-stress coupling on the thermal conductivity of the film, the 3ω thermal conductivity method is analyzed.","PeriodicalId":6583,"journal":{"name":"2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)","volume":"45 1","pages":"268-271"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73746207","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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