2012 IEEE 62nd Electronic Components and Technology Conference最新文献

Parasitic electrical and electromagnetic effects 寄生电和电磁效应

2012 IEEE 62nd Electronic Components and Technology Conference Pub Date : 2018-10-03 DOI: 10.1007/978-1-4899-6934-7_8

S. Sangwine

引用次数: 0

Passive electronic components 无源电子元件

2012 IEEE 62nd Electronic Components and Technology Conference Pub Date : 2018-10-03 DOI: 10.1007/978-1-4899-6934-7_5

S. Sangwine

引用次数: 3

Safety 安全

2012 IEEE 62nd Electronic Components and Technology Conference Pub Date : 2018-10-03 DOI: 10.1201/b13603-11

S. Sangwine

引用次数: 0

Interconnection technology 互连技术

2012 IEEE 62nd Electronic Components and Technology Conference Pub Date : 2018-10-03 DOI: 10.1007/978-1-4899-6934-7_2

S. Sangwine

引用次数: 0

Heat management 热管理

2012 IEEE 62nd Electronic Components and Technology Conference Pub Date : 2018-10-03 DOI: 10.1201/b13603-7

S. Sangwine

引用次数: 0

Instruments and measurement 仪器及测量

2012 IEEE 62nd Electronic Components and Technology Conference Pub Date : 2018-10-03 DOI: 10.1007/978-1-4899-6934-7_6

S. Sangwine

引用次数: 0

Power sources and power supplies 电源和电源

2012 IEEE 62nd Electronic Components and Technology Conference Pub Date : 2018-10-03 DOI: 10.1007/978-1-4899-6934-7_4

S. Sangwine

引用次数: 0

Environmental factors and testing 环境因素及测试

2012 IEEE 62nd Electronic Components and Technology Conference Pub Date : 2018-10-03 DOI: 10.1007/978-1-4899-6934-7_10

S. Sangwine

引用次数: 0

Reliability and maintainability 可靠性和可维护性

2012 IEEE 62nd Electronic Components and Technology Conference Pub Date : 2018-10-03 DOI: 10.1007/978-1-4899-6934-7_9

S. Sangwine

引用次数: 0

Demonstration of TCNCP flip chip reliability with 30μm pitch Cu bump and substrate with thin Ni and thick Au surface finish 采用30μm间距的Cu凸点和表面光洁度较薄的Ni和较厚的Au衬底的TCNCP倒装芯片可靠性验证

2012 IEEE 62nd Electronic Components and Technology Conference Pub Date : 2014-05-27 DOI: 10.1109/ECTC.2014.6897512

Zhang Weihong, Hong Shengping, Yang Xiaolong, Zhou Feng, Lu Hailun, Sheng Haijun, Z. Tong-long

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引用次数: 0