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Should We Include Cyberdefense Functionalities in Electrical Power System Protections?: A Proposed Approach 我们是否应该在电力系统保护中加入网络防御功能？建议的方法
IF 6.3 2区 工程技术
IEEE Industrial Electronics Magazine Pub Date : 2024-07-01 DOI: 10.1109/mie.2024.3416907
Giovanni Battista Gaggero, Afroz Mokarim, Paola Girdinio, Mario Marchese
{"title":"Should We Include Cyberdefense Functionalities in Electrical Power System Protections?: A Proposed Approach","authors":"Giovanni Battista Gaggero, Afroz Mokarim, Paola Girdinio, Mario Marchese","doi":"10.1109/mie.2024.3416907","DOIUrl":"https://doi.org/10.1109/mie.2024.3416907","url":null,"abstract":"","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"116 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141489136","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Joint Error Detection and Correction for Safety Communication: Reducing the Alarm Rate of Transmitted Safety Messages 安全通信的联合错误检测和纠正：降低安全信息传输的报警率
IF 6.3 2区 工程技术
IEEE Industrial Electronics Magazine Pub Date : 2024-07-01 DOI: 10.1109/mie.2024.3416901
Ming Zhan, Zhibo Pang, Jiangwu Zhang, Shiqing Zhang, Kan Yu
{"title":"Joint Error Detection and Correction for Safety Communication: Reducing the Alarm Rate of Transmitted Safety Messages","authors":"Ming Zhan, Zhibo Pang, Jiangwu Zhang, Shiqing Zhang, Kan Yu","doi":"10.1109/mie.2024.3416901","DOIUrl":"https://doi.org/10.1109/mie.2024.3416901","url":null,"abstract":"","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"30 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141489427","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Cloud–Fog Automation: Heterogenous Applications Over New-Generation Infrastructure of Virtualized Computing and Converged Networks 云雾自动化：虚拟化计算和融合网络新一代基础设施上的异质应用
IF 6.3 2区 工程技术
IEEE Industrial Electronics Magazine Pub Date : 2024-06-17 DOI: 10.1109/mie.2024.3407051
Honghao LYU, Jing Yan, Jialin Zhang, Zhibo Pang, Geng Yang, Alf J. Isaksson
{"title":"Cloud–Fog Automation: Heterogenous Applications Over New-Generation Infrastructure of Virtualized Computing and Converged Networks","authors":"Honghao LYU, Jing Yan, Jialin Zhang, Zhibo Pang, Geng Yang, Alf J. Isaksson","doi":"10.1109/mie.2024.3407051","DOIUrl":"https://doi.org/10.1109/mie.2024.3407051","url":null,"abstract":"","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"22 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-06-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141931886","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Scalable Cloud–Edge Collaborative Approach for Intelligent Low-Code Fault Diagnosis: Successful Applications of Agile Migration Deployment in Heterogeneous Fault Diagnosis Scenarios 智能低代码故障诊断的可扩展云端协作方法：敏捷迁移部署在异构故障诊断场景中的成功应用
IF 6.3 2区 工程技术
IEEE Industrial Electronics Magazine Pub Date : 2024-05-06 DOI: 10.1109/mie.2024.3391943
Luo Fang, Jiafu Wan, Hu Cai, Shiyong Wang, Zhibo Pang, Mejdl Safran, Salman A. AlQahtani
{"title":"A Scalable Cloud–Edge Collaborative Approach for Intelligent Low-Code Fault Diagnosis: Successful Applications of Agile Migration Deployment in Heterogeneous Fault Diagnosis Scenarios","authors":"Luo Fang, Jiafu Wan, Hu Cai, Shiyong Wang, Zhibo Pang, Mejdl Safran, Salman A. AlQahtani","doi":"10.1109/mie.2024.3391943","DOIUrl":"https://doi.org/10.1109/mie.2024.3391943","url":null,"abstract":"","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"26 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-05-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140845524","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Industry 5.0: Research Areas and Challenges With Artificial Intelligence and Human Acceptance 工业 5.0：人工智能与人类接受程度的研究领域和挑战
IF 6.3 2区 工程技术
IEEE Industrial Electronics Magazine Pub Date : 2024-04-25 DOI: 10.1109/mie.2024.3387068
George Dimitrakopoulos, Pal Varga, Thomas Gutt, Germar Schneider, Hans Ehm, Alfred Hoess, Markus Tauber, Konstantina Karathanasopoulou, Anna Lackner, Jerker Delsing
{"title":"Industry 5.0: Research Areas and Challenges With Artificial Intelligence and Human Acceptance","authors":"George Dimitrakopoulos, Pal Varga, Thomas Gutt, Germar Schneider, Hans Ehm, Alfred Hoess, Markus Tauber, Konstantina Karathanasopoulou, Anna Lackner, Jerker Delsing","doi":"10.1109/mie.2024.3387068","DOIUrl":"https://doi.org/10.1109/mie.2024.3387068","url":null,"abstract":"","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"44 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-04-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140648696","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Blockchain-Enabled Circular Economy: Collaborative Responsibility in Solar Panel Recycling 区块链驱动的循环经济：太阳能电池板回收中的协作责任
IF 6.3 2区 工程技术
IEEE Industrial Electronics Magazine Pub Date : 2024-04-02 DOI: 10.1109/mie.2024.3378422
Mohammad Jabed Morshed Chowdhury, Naveed Ul Hassan, Wayes Tushar, Dusit Niyato, Tapan K. Saha, H. Vincent Poor, Chau Yuen
{"title":"A Blockchain-Enabled Circular Economy: Collaborative Responsibility in Solar Panel Recycling","authors":"Mohammad Jabed Morshed Chowdhury, Naveed Ul Hassan, Wayes Tushar, Dusit Niyato, Tapan K. Saha, H. Vincent Poor, Chau Yuen","doi":"10.1109/mie.2024.3378422","DOIUrl":"https://doi.org/10.1109/mie.2024.3378422","url":null,"abstract":"","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"2012 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-04-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140343218","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Brain Modeling for Microgrid Control and Protection: State of the Art, Challenges, and Future Trends 用于微电网控制和保护的大脑建模：技术现状、挑战和未来趋势
IF 6.3 2区 工程技术
IEEE Industrial Electronics Magazine Pub Date : 2024-03-21 DOI: 10.1109/mie.2024.3374234
Jorge Armando De La Cruz Saavedra, Sen Tan, Diptish Saha, Najmeh Bazmohammadi, Juan C. Vasquez, Josep M. Guerrero
{"title":"Brain Modeling for Microgrid Control and Protection: State of the Art, Challenges, and Future Trends","authors":"Jorge Armando De La Cruz Saavedra, Sen Tan, Diptish Saha, Najmeh Bazmohammadi, Juan C. Vasquez, Josep M. Guerrero","doi":"10.1109/mie.2024.3374234","DOIUrl":"https://doi.org/10.1109/mie.2024.3374234","url":null,"abstract":"","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"130 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-03-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140188903","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Industry Forum at IES ONCON 2023 [News in Industry Activities] IES ONCON 2023 上的行业论坛 [行业活动新闻］
IF 6.3 2区 工程技术
IEEE Industrial Electronics Magazine Pub Date : 2024-03-20 DOI: 10.1109/mie.2024.3358019
Victor Huang
{"title":"Industry Forum at IES ONCON 2023 [News in Industry Activities]","authors":"Victor Huang","doi":"10.1109/mie.2024.3358019","DOIUrl":"https://doi.org/10.1109/mie.2024.3358019","url":null,"abstract":"","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"150 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140182591","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE App IEEE 应用程序
IF 6.3 2区 工程技术
IEEE Industrial Electronics Magazine Pub Date : 2024-03-20 DOI: 10.1109/mie.2024.3368669
{"title":"IEEE App","authors":"","doi":"10.1109/mie.2024.3368669","DOIUrl":"https://doi.org/10.1109/mie.2024.3368669","url":null,"abstract":"","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"24 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140182618","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Collabratec IEEE Collabratec
IF 6.3 2区 工程技术
IEEE Industrial Electronics Magazine Pub Date : 2024-03-20 DOI: 10.1109/mie.2024.3368671
{"title":"IEEE Collabratec","authors":"","doi":"10.1109/mie.2024.3368671","DOIUrl":"https://doi.org/10.1109/mie.2024.3368671","url":null,"abstract":"","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"27 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140182651","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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