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A Scalable Cloud–Edge Collaborative Approach for Intelligent Low-Code Fault Diagnosis: Successful Applications of Agile Migration Deployment in Heterogeneous Fault Diagnosis Scenarios 智能低代码故障诊断的可扩展云端协作方法：敏捷迁移部署在异构故障诊断场景中的成功应用
IF 6.3 2区 工程技术
IEEE Industrial Electronics Magazine Pub Date : 2024-05-06 DOI: 10.1109/mie.2024.3391943
Luo Fang, Jiafu Wan, Hu Cai, Shiyong Wang, Zhibo Pang, Mejdl Safran, Salman A. AlQahtani
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引用次数: 0
Industry 5.0: Research Areas and Challenges With Artificial Intelligence and Human Acceptance 工业 5.0：人工智能与人类接受程度的研究领域和挑战
IF 6.3 2区 工程技术
IEEE Industrial Electronics Magazine Pub Date : 2024-04-25 DOI: 10.1109/mie.2024.3387068
George Dimitrakopoulos, Pal Varga, Thomas Gutt, Germar Schneider, Hans Ehm, Alfred Hoess, Markus Tauber, Konstantina Karathanasopoulou, Anna Lackner, Jerker Delsing
{"title":"Industry 5.0: Research Areas and Challenges With Artificial Intelligence and Human Acceptance","authors":"George Dimitrakopoulos, Pal Varga, Thomas Gutt, Germar Schneider, Hans Ehm, Alfred Hoess, Markus Tauber, Konstantina Karathanasopoulou, Anna Lackner, Jerker Delsing","doi":"10.1109/mie.2024.3387068","DOIUrl":"https://doi.org/10.1109/mie.2024.3387068","url":null,"abstract":"","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"44 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-04-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140648696","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Blockchain-Enabled Circular Economy: Collaborative Responsibility in Solar Panel Recycling 区块链驱动的循环经济：太阳能电池板回收中的协作责任
IF 6.3 2区 工程技术
IEEE Industrial Electronics Magazine Pub Date : 2024-04-02 DOI: 10.1109/mie.2024.3378422
Mohammad Jabed Morshed Chowdhury, Naveed Ul Hassan, Wayes Tushar, Dusit Niyato, Tapan K. Saha, H. Vincent Poor, Chau Yuen
{"title":"A Blockchain-Enabled Circular Economy: Collaborative Responsibility in Solar Panel Recycling","authors":"Mohammad Jabed Morshed Chowdhury, Naveed Ul Hassan, Wayes Tushar, Dusit Niyato, Tapan K. Saha, H. Vincent Poor, Chau Yuen","doi":"10.1109/mie.2024.3378422","DOIUrl":"https://doi.org/10.1109/mie.2024.3378422","url":null,"abstract":"","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"2012 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-04-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140343218","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Brain Modeling for Microgrid Control and Protection: State of the Art, Challenges, and Future Trends 用于微电网控制和保护的大脑建模：技术现状、挑战和未来趋势
IF 6.3 2区 工程技术
IEEE Industrial Electronics Magazine Pub Date : 2024-03-21 DOI: 10.1109/mie.2024.3374234
Jorge Armando De La Cruz Saavedra, Sen Tan, Diptish Saha, Najmeh Bazmohammadi, Juan C. Vasquez, Josep M. Guerrero
{"title":"Brain Modeling for Microgrid Control and Protection: State of the Art, Challenges, and Future Trends","authors":"Jorge Armando De La Cruz Saavedra, Sen Tan, Diptish Saha, Najmeh Bazmohammadi, Juan C. Vasquez, Josep M. Guerrero","doi":"10.1109/mie.2024.3374234","DOIUrl":"https://doi.org/10.1109/mie.2024.3374234","url":null,"abstract":"","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"130 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-03-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140188903","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Industry Forum at IES ONCON 2023 [News in Industry Activities] IES ONCON 2023 上的行业论坛 [行业活动新闻］
IF 6.3 2区 工程技术
IEEE Industrial Electronics Magazine Pub Date : 2024-03-20 DOI: 10.1109/mie.2024.3358019
Victor Huang
{"title":"Industry Forum at IES ONCON 2023 [News in Industry Activities]","authors":"Victor Huang","doi":"10.1109/mie.2024.3358019","DOIUrl":"https://doi.org/10.1109/mie.2024.3358019","url":null,"abstract":"","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"150 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140182591","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE App IEEE 应用程序
IF 6.3 2区 工程技术
IEEE Industrial Electronics Magazine Pub Date : 2024-03-20 DOI: 10.1109/mie.2024.3368669
{"title":"IEEE App","authors":"","doi":"10.1109/mie.2024.3368669","DOIUrl":"https://doi.org/10.1109/mie.2024.3368669","url":null,"abstract":"","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"24 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140182618","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Collabratec IEEE Collabratec
IF 6.3 2区 工程技术
IEEE Industrial Electronics Magazine Pub Date : 2024-03-20 DOI: 10.1109/mie.2024.3368671
{"title":"IEEE Collabratec","authors":"","doi":"10.1109/mie.2024.3368671","DOIUrl":"https://doi.org/10.1109/mie.2024.3368671","url":null,"abstract":"","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"27 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140182651","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
March 2024 Conference and Workshops Calendars 2024 年 3 月会议和研讨会日历
IF 6.3 2区 工程技术
IEEE Industrial Electronics Magazine Pub Date : 2024-03-20 DOI: 10.1109/mie.2024.3358093
{"title":"March 2024 Conference and Workshops Calendars","authors":"","doi":"10.1109/mie.2024.3358093","DOIUrl":"https://doi.org/10.1109/mie.2024.3358093","url":null,"abstract":"","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"10 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140182725","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
International Forum on Cutting-Edge Interdisciplinary Intelligent Science and Technology [Society News] 前沿跨学科智能科学与技术国际论坛 [社会新闻］
IF 6.3 2区 工程技术
IEEE Industrial Electronics Magazine Pub Date : 2024-03-20 DOI: 10.1109/mie.2024.3357411
Óscar Lucía
{"title":"International Forum on Cutting-Edge Interdisciplinary Intelligent Science and Technology [Society News]","authors":"Óscar Lucía","doi":"10.1109/mie.2024.3357411","DOIUrl":"https://doi.org/10.1109/mie.2024.3357411","url":null,"abstract":"","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"55 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140182738","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE proceedings 电气和电子工程师学会论文集
IF 6.3 2区 工程技术
IEEE Industrial Electronics Magazine Pub Date : 2024-03-20 DOI: 10.1109/mie.2024.3368668
{"title":"IEEE proceedings","authors":"","doi":"10.1109/mie.2024.3368668","DOIUrl":"https://doi.org/10.1109/mie.2024.3368668","url":null,"abstract":"","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"70 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140182750","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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