IEEE Circuits and Systems Magazine最新文献_第10页

Modeling and Simulation Challenges and Solutions in Cooling Systems for Nanoscale Integrated Circuits[Feature] 纳米级集成电路冷却系统的建模和仿真挑战与解决方案[Feature]

IF 6.9 2区工程技术

IEEE Circuits and Systems Magazine Pub Date : 2023-01-01 DOI: 10.1109/MCAS.2023.3234727

F. Terraneo, A. Leva, W. Fornaciari, David Atienza Alonso

{"title":"Modeling and Simulation Challenges and Solutions in Cooling Systems for Nanoscale Integrated Circuits[Feature]","authors":"F. Terraneo, A. Leva, W. Fornaciari, David Atienza Alonso","doi":"10.1109/MCAS.2023.3234727","DOIUrl":"https://doi.org/10.1109/MCAS.2023.3234727","url":null,"abstract":"The power density in modern Integrated Circuits (ICs) is tremendous. For example, Multi-Processor Systems-on-Chip (MPSoCs) nowadays undergo temperature swings of 40 degrees in 100 milliseconds or less, with rapidly emerging and vanishing sub-millimeter hot spots. As such, not only a simulation-based cooling assessment is vital, but one has to simulate the on-chip thermal phenomena jointly with the heat dissipation system - historically, a challenge. In recent years, however, the idea of coupling traditional 3D chip simulators with heat dissipation models written in Equation-Based Modeling (EBM) languages has proven to be a game changer. EBM languages allow one to compose a model by assembling components described in terms of Differential and Algebraic Equations (DAE) and have the simulation code generated automatically. In this article, we take a tutorial viewpoint on the matter just sketched, to put the reader in the position of exploiting the above technology. We also present the first nucleus of a model library for cooling systems, that we release as free software for the scientific and engineering community.","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":"23 1","pages":"36-56"},"PeriodicalIF":6.9,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62548453","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Women in Circuits and Systems (WiCAS) and Young Professionals (YP) at PRIME-SMACD 2022 [CAS in the World] 电路和系统领域的女性(WiCAS)和年轻专业人士(YP)参加PRIME-SMACD 2022[全球CAS]

IF 6.9 2区工程技术

IEEE Circuits and Systems Magazine Pub Date : 2023-01-01 DOI: 10.1109/mcas.2023.3234731

引用次数: 0

IEEE App IEEE软件

2区工程技术

IEEE Circuits and Systems Magazine Pub Date : 2023-01-01 DOI: 10.1109/mcas.2023.3313826

引用次数: 0

IEEE CASS Tour Ecuador 2023 IEEE CASS厄瓜多尔之旅

2区工程技术

IEEE Circuits and Systems Magazine Pub Date : 2023-01-01 DOI: 10.1109/mcas.2023.3302394

Ricardo Reis, Ramiro Taco

引用次数: 0

Heinrich Hertz [Pioneers in CAS] 海因里希·赫兹[CAS的先驱]

IF 6.9 2区工程技术

IEEE Circuits and Systems Magazine Pub Date : 2023-01-01 DOI: 10.1109/mcas.2023.3234728

W. Mathis, Emeritus

引用次数: 0

IEEE IoT Technical Community and IEEE CASS [CAS in the World] IEEE物联网技术社区与IEEE CASS

2区工程技术

IEEE Circuits and Systems Magazine Pub Date : 2023-01-01 DOI: 10.1109/mcas.2023.3302393

Ricardo Reis

引用次数: 0

An Interview With Gene Frantz, Innovative Thinker and Father of DSP [Interview] 专访创新思想家、DSP之父Gene Frantz

2区工程技术

IEEE Circuits and Systems Magazine Pub Date : 2023-01-01 DOI: 10.1109/mcas.2023.3302181

Gene Frantz

引用次数: 0

Tiny Machine Learning: Progress and Futures [Feature] 微型机器学习:进步与未来[专题]

2区工程技术

IEEE Circuits and Systems Magazine Pub Date : 2023-01-01 DOI: 10.1109/mcas.2023.3302182

Ji Lin, Ligeng Zhu, Wei-Ming Chen, Wei-Chen Wang, Song Han

{"title":"Tiny Machine Learning: Progress and Futures [Feature]","authors":"Ji Lin, Ligeng Zhu, Wei-Ming Chen, Wei-Chen Wang, Song Han","doi":"10.1109/mcas.2023.3302182","DOIUrl":"https://doi.org/10.1109/mcas.2023.3302182","url":null,"abstract":"Tiny machine learning (TinyML) is a new frontier of machine learning. By squeezing deep learning models into billions of IoT devices and microcontrollers (MCUs), we expand the scope of applications and enable ubiquitous intelligence. However, TinyML is challenging due to the hardware constraints: the tiny memory resource is difficult hold deep learning models designed for cloud and mobile platforms. There is also limited compiler and inference engine support for bare-metal devices. Therefore, we need to co-design the algorithm and system stack to enable TinyML. In this review, we will first discuss the definition, challenges, and applications of TinyML. We then survey the recent progress in TinyML and deep learning on MCUs. Next, we will introduce MCUNet, showing how we can achieve ImageNet-scale AI applications on IoT devices with system-algorithm co-design. We will further extend the solution from inference to training and introduce tiny on-device training techniques. Finally, we present future directions in this area. Today’s “large” model might be tomorrow’s “tiny” model. The scope of TinyML should evolve and adapt over time.","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"136303583","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

An Interview with Professor Sung-Mo Steve Kang [Interview] 专访姜圣模教授

IF 6.9 2区工程技术

IEEE Circuits and Systems Magazine Pub Date : 2023-01-01 DOI: 10.1109/mcas.2023.3272088

S. Kang

引用次数: 0

IEEE CASS Rio de Janeiro Tour 2022 [Education] IEEE CASS里约热内卢de Janeiro Tour 2022[教育]

IF 6.9 2区工程技术

IEEE Circuits and Systems Magazine Pub Date : 2023-01-01 DOI: 10.1109/mcas.2023.3267939

F. Olivera, R. Reis

引用次数: 0