IEEE Circuits and Systems Magazine最新文献_第10页

Modeling and Simulation Challenges and Solutions in Cooling Systems for Nanoscale Integrated Circuits[Feature] 纳米级集成电路冷却系统的建模和仿真挑战与解决方案[Feature]

IF 6.9 2区工程技术

IEEE Circuits and Systems Magazine Pub Date : 2023-01-01 DOI: 10.1109/MCAS.2023.3234727

F. Terraneo, A. Leva, W. Fornaciari, David Atienza Alonso

{"title":"Modeling and Simulation Challenges and Solutions in Cooling Systems for Nanoscale Integrated Circuits[Feature]","authors":"F. Terraneo, A. Leva, W. Fornaciari, David Atienza Alonso","doi":"10.1109/MCAS.2023.3234727","DOIUrl":"https://doi.org/10.1109/MCAS.2023.3234727","url":null,"abstract":"The power density in modern Integrated Circuits (ICs) is tremendous. For example, Multi-Processor Systems-on-Chip (MPSoCs) nowadays undergo temperature swings of 40 degrees in 100 milliseconds or less, with rapidly emerging and vanishing sub-millimeter hot spots. As such, not only a simulation-based cooling assessment is vital, but one has to simulate the on-chip thermal phenomena jointly with the heat dissipation system - historically, a challenge. In recent years, however, the idea of coupling traditional 3D chip simulators with heat dissipation models written in Equation-Based Modeling (EBM) languages has proven to be a game changer. EBM languages allow one to compose a model by assembling components described in terms of Differential and Algebraic Equations (DAE) and have the simulation code generated automatically. In this article, we take a tutorial viewpoint on the matter just sketched, to put the reader in the position of exploiting the above technology. We also present the first nucleus of a model library for cooling systems, that we release as free software for the scientific and engineering community.","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":null,"pages":null},"PeriodicalIF":6.9,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62548453","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Women in Circuits and Systems (WiCAS) and Young Professionals (YP) at PRIME-SMACD 2022 [CAS in the World] 电路和系统领域的女性(WiCAS)和年轻专业人士(YP)参加PRIME-SMACD 2022[全球CAS]

IF 6.9 2区工程技术

IEEE Circuits and Systems Magazine Pub Date : 2023-01-01 DOI: 10.1109/mcas.2023.3234731

引用次数: 0

IEEE App IEEE软件

2区工程技术

IEEE Circuits and Systems Magazine Pub Date : 2023-01-01 DOI: 10.1109/mcas.2023.3313826

引用次数: 0

IEEE CASS Tour Ecuador 2023 IEEE CASS厄瓜多尔之旅

2区工程技术

IEEE Circuits and Systems Magazine Pub Date : 2023-01-01 DOI: 10.1109/mcas.2023.3302394

Ricardo Reis, Ramiro Taco

引用次数: 0

Heinrich Hertz [Pioneers in CAS] 海因里希·赫兹[CAS的先驱]

IF 6.9 2区工程技术

IEEE Circuits and Systems Magazine Pub Date : 2023-01-01 DOI: 10.1109/mcas.2023.3234728

W. Mathis, Emeritus

引用次数: 0

An Interview With Gene Frantz, Innovative Thinker and Father of DSP [Interview] 专访创新思想家、DSP之父Gene Frantz

2区工程技术

IEEE Circuits and Systems Magazine Pub Date : 2023-01-01 DOI: 10.1109/mcas.2023.3302181

Gene Frantz

引用次数: 0

Tiny Machine Learning: Progress and Futures [Feature] 微型机器学习:进步与未来[专题]

2区工程技术

IEEE Circuits and Systems Magazine Pub Date : 2023-01-01 DOI: 10.1109/mcas.2023.3302182

Ji Lin, Ligeng Zhu, Wei-Ming Chen, Wei-Chen Wang, Song Han

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引用次数: 0

IEEE IoT Technical Community and IEEE CASS [CAS in the World] IEEE物联网技术社区与IEEE CASS

2区工程技术

IEEE Circuits and Systems Magazine Pub Date : 2023-01-01 DOI: 10.1109/mcas.2023.3302393

Ricardo Reis

引用次数: 0

IEEE CASS Rio de Janeiro Tour 2022 [Education] IEEE CASS里约热内卢de Janeiro Tour 2022[教育]

IF 6.9 2区工程技术

IEEE Circuits and Systems Magazine Pub Date : 2023-01-01 DOI: 10.1109/mcas.2023.3267939

F. Olivera, R. Reis

引用次数: 0

An Interview with Professor Sung-Mo Steve Kang [Interview] 专访姜圣模教授

IF 6.9 2区工程技术

IEEE Circuits and Systems Magazine Pub Date : 2023-01-01 DOI: 10.1109/mcas.2023.3272088

S. Kang

引用次数: 0