IEEE Transactions on Components and Packaging Technologies最新文献_第2页

Coupled Thermal and Thermo-Mechanical Design Assessment of High Power Light Emitting Diode 大功率发光二极管热-热-机械耦合设计评价

IEEE Transactions on Components and Packaging Technologies Pub Date : 2010-11-22 DOI: 10.1109/TCAPT.2010.2044413

B. Han, C. Jang, A. Bar-Cohen, B. Song

引用次数: 18

Development of a High-Lumen Solid State Down Light Application 高流明固态筒灯应用的发展

IEEE Transactions on Components and Packaging Technologies Pub Date : 2010-11-22 DOI: 10.1109/TCAPT.2010.2055565

M. Arik, Rajdeep Sharma, J. Jackson, S. Prabhakaran, Charles Seeley, Y. Utturkar, S. Weaver, G. Kuenzler, B. Han

{"title":"Development of a High-Lumen Solid State Down Light Application","authors":"M. Arik, Rajdeep Sharma, J. Jackson, S. Prabhakaran, Charles Seeley, Y. Utturkar, S. Weaver, G. Kuenzler, B. Han","doi":"10.1109/TCAPT.2010.2055565","DOIUrl":"https://doi.org/10.1109/TCAPT.2010.2055565","url":null,"abstract":"Light-emitting diode (LED)-based solid-state lighting (SSL) products have been exceeding the predicted performances especially at the chip and package levels. This has led to new SSL-based products for energy savings and long lifetimes. Large amounts of government funding and private investments have been made during the last decade to accelerate and guide the technology. This paper focuses on the development of an LED-based high-lumen luminaire technology. The critical subcomponents of the luminaire are the LED light engine (LED chips and optical system), thermal management, and driver electronics. Each of these subcomponents will be discussed in detail for a 100 W incandescent replacement technology. The paper addresses system integration of each of the subcomponents. While the design of new products evolve, the lack of reliability data poses a risk of premature failure of LED-based products. Premature failures would trigger customer rejection and may delay market penetration. Therefore, luminaire reliability is an important aspect of luminaire design. In cohort with this notion, finally, the luminaire reliability has been discussed.","PeriodicalId":55013,"journal":{"name":"IEEE Transactions on Components and Packaging Technologies","volume":"33 1","pages":"668-679"},"PeriodicalIF":0.0,"publicationDate":"2010-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TCAPT.2010.2055565","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62520608","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 10

Miniature Vapor Compressor Refrigeration System for Electronic Cooling 用于电子冷却的微型蒸汽压缩机制冷系统

IEEE Transactions on Components and Packaging Technologies Pub Date : 2010-11-22 DOI: 10.1109/TCAPT.2010.2070800

Chih-Chung Chang, Nai-Wen Liang, Sih-Li Chen

{"title":"Miniature Vapor Compressor Refrigeration System for Electronic Cooling","authors":"Chih-Chung Chang, Nai-Wen Liang, Sih-Li Chen","doi":"10.1109/TCAPT.2010.2070800","DOIUrl":"https://doi.org/10.1109/TCAPT.2010.2070800","url":null,"abstract":"This paper experimentally investigated the thermal performance of a miniature vapor compressor refrigeration system using a thermal resistance model for electronic cooling. The evaporator, compressor, expansion valve, and condenser are the four main devices forming the refrigeration system with R-134a as a working fluid. The experimental parameters considered were the openings of the expansion valve and input heating power. The results indicated that the system in this paper had the largest cooling capacity of 150 W and coefficient of performance of 4.25 at the 8th and 9th openings of the expansion valve, respectively. The results also showed that correlations of the thermal resistance of the evaporator and the condenser are developed with experimental data and their precision, compared with the experimental data, was about 4.42% and 12%, respectively. Besides the adjustment of the compressor speed could decrease the possibility of the occurrence of condensation phenomena near the inlet and outlet of the evaporator. Also, the smallest dimension of the combination of the evaporator and condenser is presented at the input heating power of 150 W and the 8th opening of the expansion valve.","PeriodicalId":55013,"journal":{"name":"IEEE Transactions on Components and Packaging Technologies","volume":"33 1","pages":"794-800"},"PeriodicalIF":0.0,"publicationDate":"2010-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TCAPT.2010.2070800","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62520761","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

Process Development and Reliability of Microbumps 微凸点的工艺发展和可靠性

IEEE Transactions on Components and Packaging Technologies Pub Date : 2010-11-22 DOI: 10.1109/TCAPT.2010.2046487

S. Lim, V. S. Rao, W. Y. Hnin, W. L. Ching, V. Kripesh, Charles Lee, J. Lau, J. Milla, A. Fenner

{"title":"Process Development and Reliability of Microbumps","authors":"S. Lim, V. S. Rao, W. Y. Hnin, W. L. Ching, V. Kripesh, Charles Lee, J. Lau, J. Milla, A. Fenner","doi":"10.1109/TCAPT.2010.2046487","DOIUrl":"https://doi.org/10.1109/TCAPT.2010.2046487","url":null,"abstract":"The use of flip-chip bonding technology on gold-tin (AuSn) microbumps for flip-chip packaging is becoming increasingly important in the electronics industry. Some of the main advantages of AuSn system over solder flip-chip technology are suitability for very fine pitch interconnection and fluxless bonding. Fluxless flip-chip assembly is in demand especially for medical applications and optoelectonics packaging. Here, we report the assembly process development of a silicon stacked module assembled with AuSn microbumps to meet the stringent reliability. The effects of bond pressure distribution, bond temperature and alignment accuracy were found to be critical in this stacked silicon using AuSn microbumps. A three-factor design of experiment was carried out to investigate the effects of assembly parameters such as bonding pressure, temperature and time on contact resistance and AuSn solder wetting on the electroless nickel and gold under bump metallization. Results showed that higher bond force is undesirable and contributes to passivation cracking and deformed AuSn joint with AuSn solder being squeezed out of the joint during bonding. The reliability result of the flip-chip assembly of stacked silicon module using AuSn microbumps was presented.","PeriodicalId":55013,"journal":{"name":"IEEE Transactions on Components and Packaging Technologies","volume":"33 1","pages":"747-753"},"PeriodicalIF":0.0,"publicationDate":"2010-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TCAPT.2010.2046487","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62520457","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 18

Enhanced Boiling Heat Transfer in Parallel Microchannels With Diffusion Brazed Wire Mesh 扩散钎焊网在平行微通道中增强沸腾传热

IEEE Transactions on Components and Packaging Technologies Pub Date : 2010-11-22 DOI: 10.1109/TCAPT.2010.2070799

Hailei Wang, R. Peterson

{"title":"Enhanced Boiling Heat Transfer in Parallel Microchannels With Diffusion Brazed Wire Mesh","authors":"Hailei Wang, R. Peterson","doi":"10.1109/TCAPT.2010.2070799","DOIUrl":"https://doi.org/10.1109/TCAPT.2010.2070799","url":null,"abstract":"Flow boiling is an important process in energy conversion applications such as power generation and heating, ventilating, and air conditioning systems. Recently, it has drawn interest in the high heat flux electronics cooling community. Flow boiling enhancement, in addition, has the benefit of early onset of nucleate boiling, potentially lowering wall superheat, and increasing the heat transfer coefficient and critical heat flux (CHF). The objective of this paper was to investigate the use of fine metal wire mesh screens to enhance nucleate boiling in microchannels. Contact resistance between the wire mesh and channel heating surface was essentially eliminated by employing a diffusion brazing process to attach the screen to the wall. The parallel microchannels were 1000 μm in width and 510 μm in depth. A dielectric working fluid, HFE 7000, was investigated during this paper. Flow boiling results were compared for channels with and without wire mesh. According to the flow boiling curves obtained in this investigation for the bare and mesh channels, the amount of wall superheat was substantially reduced for the mesh channels at all four stream-wise locations. This indicated that nucleate boiling in the mesh channel was enhanced due to the increase of nucleation sites the mesh introduced. The mesh channels also displayed a higher flow boiling heat transfer coefficient. Both the nucleate boiling dominated regime and convective evaporation dominated regime were identified, with the overall trend of increasing the flow boiling heat transfer coefficient with respect to vapor quality until this quantity reached approximately 0.4. The CHF for the mesh channel was also significantly higher than that for the bare channel. The flow boiling enhancement was achieved with no apparent pressure drop penalty. The results presented here provide a practical means to implement this surface enhancement technique.","PeriodicalId":55013,"journal":{"name":"IEEE Transactions on Components and Packaging Technologies","volume":"33 1","pages":"784-793"},"PeriodicalIF":0.0,"publicationDate":"2010-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TCAPT.2010.2070799","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62520512","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 36

Die Bonding for a Nitride Light-Emitting Diode by Low-Temperature Sintering of Micrometer Size Silver Particles 微米级银颗粒低温烧结氮化发光二极管的模具键合

IEEE Transactions on Components and Packaging Technologies Pub Date : 2010-11-22 DOI: 10.1109/TCAPT.2010.2064313

M. Kuramoto, S. Ogawa, M. Niwa, Keun-Soo Kim, K. Suganuma

引用次数: 39

Comprehensive Moisture Diffusion Characteristics of Epoxy Molding Compounds Over Solder Reflow Process Temperature 环氧成型化合物在回流焊温度上的综合水分扩散特性

IEEE Transactions on Components and Packaging Technologies Pub Date : 2010-11-22 DOI: 10.1109/TCAPT.2010.2063430

C. Jang, B. Han, Samson Yoon

引用次数: 28

Multiobjective Optimization of a Grooved Micro-Channel Heat Sink 沟槽式微通道散热器的多目标优化

IEEE Transactions on Components and Packaging Technologies Pub Date : 2010-11-22 DOI: 10.1109/TCAPT.2010.2070874

D. Ansari, A. Husain, Kwang‐Yong Kim

{"title":"Multiobjective Optimization of a Grooved Micro-Channel Heat Sink","authors":"D. Ansari, A. Husain, Kwang‐Yong Kim","doi":"10.1109/TCAPT.2010.2070874","DOIUrl":"https://doi.org/10.1109/TCAPT.2010.2070874","url":null,"abstract":"The shape optimization of a micro-channel heat sink with a grooved structure has been performed using a multiobjective evolutionary algorithm. The thermal-resistance and pumping-power characteristics of the micro-channel heat sink have been investigated numerically. For optimization, four design variables, i.e., the ratios of the groove depth to the micro-channel height, the groove pitch to the micro-channel height, the groove diameter to pitch, and the micro-channel width to height are selected. The thermal resistance and the pumping power are the objective functions. The Navier-Stokes and energy equations for laminar flow and conjugate heat transfer are solved using a finite-volume solver. In comparison with a smooth micro-channel, a decrease in the thermal resistance and an increase in the Nusselt number are obtained in a grooved micro-channel at the expense of pumping power. The thermal resistance in a grooved micro-channel is lower than that in a smooth micro-channel for a fixed pumping power. The ratio of the groove pitch to micro-channel height is found to be the most Pareto-sensitive (sensitive along the Pareto-optimal front), whereas the ratio of the micro-channel width to height is found to be the least Pareto-sensitive variable.","PeriodicalId":55013,"journal":{"name":"IEEE Transactions on Components and Packaging Technologies","volume":"33 1","pages":"767-776"},"PeriodicalIF":0.0,"publicationDate":"2010-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TCAPT.2010.2070874","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62520829","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 41

UTCP: A Novel Polyimide-Based Ultra-Thin Chip Packaging Technology 一种基于聚酰亚胺的超薄芯片封装新技术

IEEE Transactions on Components and Packaging Technologies Pub Date : 2010-11-22 DOI: 10.1109/TCAPT.2010.2060198

W. Christiaens, E. Bosman, J. Vanfleteren

引用次数: 65

Cyclic Magnetic Actuation for Potential Characterization of Interfacial Fatigue Fracture 循环磁驱动界面疲劳断裂电位表征

IEEE Transactions on Components and Packaging Technologies Pub Date : 2010-10-04 DOI: 10.1109/TCAPT.2010.2058113

Jiantao Zheng, G. Ostrowicki, S. Sitaraman

引用次数: 2