{"title":"Analysis of Pattern Generation in Non-periodic Clock-driven Unidirectionally Coupled Phase Oscillators in a Ring","authors":"Kentaro Takeda","doi":"10.1587/elex.20.20230055","DOIUrl":"https://doi.org/10.1587/elex.20.20230055","url":null,"abstract":"","PeriodicalId":50387,"journal":{"name":"Ieice Electronics Express","volume":null,"pages":null},"PeriodicalIF":0.8,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"67301258","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Adaptive Slope Compensation Technology for Current-Mode Controlled SIDO DC-DC Converter in Continuous Conduction Mode","authors":"Shugao Zhou, Yao Wang","doi":"10.1587/elex.20.20230376","DOIUrl":"https://doi.org/10.1587/elex.20.20230376","url":null,"abstract":"","PeriodicalId":50387,"journal":{"name":"Ieice Electronics Express","volume":null,"pages":null},"PeriodicalIF":0.8,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"67302589","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Tiantian Zhang, Ping Zhu, Junjie Lian, Yunchun Liu
{"title":"Stress analysis and optimization of pop package under random vibration loading","authors":"Tiantian Zhang, Ping Zhu, Junjie Lian, Yunchun Liu","doi":"10.1587/elex.20.20230390","DOIUrl":"https://doi.org/10.1587/elex.20.20230390","url":null,"abstract":"The stress analysis of packaging on packaging (POP) under random vibration loading is conducted using the finite element model. The effect of structural parameters on solder joint stresses is analyzed by sensitivity analysis. Stress fitting is performed using the response surface method (RSM), and the optimization module is used to optimi-ze the structural parameters of POP packaging. The results demonstrate a reduction of 0.016 and 0.0031 MPa in upper and lower solder joint stresses, respectively. This optimization of the structural parameters improves the reliability of the electronic packaging structure.","PeriodicalId":50387,"journal":{"name":"Ieice Electronics Express","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"136204447","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}