International Journal of Optomechatronics最新文献_第10页

Axial-Stereo 3-D Optical Metrology for Inner Profile of Pipes Using a Scanning Laser Endoscope. 使用扫描激光内窥镜对管道内轮廓进行轴向-立体三维光学测量。

IF 5.5 3区工程技术

International Journal of Optomechatronics Pub Date : 2015-01-01 Epub Date: 2015-06-24 DOI: 10.1080/15599612.2015.1059535

Yuanzheng Gong, Richard S Johnston, C David Melville, Eric J Seibel

引用次数: 0

On-Chip Tuning of the Resonant Wavelength in a High-Q Microresonator Integrated with a Microheater 集成微加热器的高q微谐振器谐振波长的片上调谐

IF 5.5 3区工程技术

International Journal of Optomechatronics Pub Date : 2014-11-18 DOI: 10.1080/15599612.2015.1034905

Jialei Tang, Jintian Lin, Jiangxin Song, Z. Fang, Min Wang, Y. Liao, L. Qiao, Ya Cheng

引用次数: 11

Editorial Board EOV 编辑委员会EOV

IF 5.5 3区工程技术

International Journal of Optomechatronics Pub Date : 2014-10-02 DOI: 10.1080/15599612.2014.980670

引用次数: 0

Editorial: Special Issue on Advances in Optical Imaging and Metrology-Selected Papers From the Conference Fringe 2013 社论:光学成像与计量学进展特刊- 2013年边缘会议论文选集

IF 5.5 3区工程技术

International Journal of Optomechatronics Pub Date : 2014-10-02 DOI: 10.1080/15599612.2014.970842

W. Osten

{"title":"Editorial: Special Issue on Advances in Optical Imaging and Metrology-Selected Papers From the Conference Fringe 2013","authors":"W. Osten","doi":"10.1080/15599612.2014.970842","DOIUrl":"https://doi.org/10.1080/15599612.2014.970842","url":null,"abstract":"Twenty-six years ago it was a joint idea with Hans Rottenkolber, a pioneer of holographic metrology, to organize a workshop dedicated to the discussion of the latest results in automatic processing of fringe patterns. This idea was promoted by the insight that automatic and high precision phase measurement techniques will play a key role in all future industrial and scientific applications of optical imaging and metrology. In the stimulating atmosphere of the first workshop conducted in 1989, the proposal came up to organize that event in an Olympic schedule. Meanwhile 7 workshops have been successfully organized and their main topics were always adapted to the most interesting subjects of the current cycle. For the Fringe 2013 the scope was markedly extended by accentuating the bridge between imaging and metrology. On the one hand, both disciplines are self-standing topics with a long tradition. On the other hand, the current trends in both disciplines show increasing dynamics and fusion stimulated by many fascinating innovations such as high resolution microscopy, computational imaging, 3D imaging, sensor fusion and nano-metrology. Consequently, modern topics like computational imaging, compressed sensing, high-resolution digital wavefront engineering and sensor fusion were included in the program and presented by internationally leading experts. The complete content of all contributions can be found in the proceedings. This special issue offers a selection of 13 papers addressing different topics of the latest Fringe workshop and fitting to the scope of the International Journal of Optomechatronics. All papers highlight their special topic in a more extended way as already presented in the above mentioned proceedings. The given selection conveys a comprehensive overview of the wide bandwidth of topics which was addressed at the workshop and reports about the latest achievements in optical imaging and metrology such as:","PeriodicalId":50296,"journal":{"name":"International Journal of Optomechatronics","volume":"8 1","pages":"229 - 230"},"PeriodicalIF":5.5,"publicationDate":"2014-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/15599612.2014.970842","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"60482385","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Survivability of MEMS Packages at High-G Loads MEMS封装在高g负载下的生存性

IF 5.5 3区工程技术

International Journal of Optomechatronics Pub Date : 2014-10-02 DOI: 10.1080/15599612.2014.972600

R. Pryputniewicz

{"title":"Survivability of MEMS Packages at High-G Loads","authors":"R. Pryputniewicz","doi":"10.1080/15599612.2014.972600","DOIUrl":"https://doi.org/10.1080/15599612.2014.972600","url":null,"abstract":"Advances in emerging technology of microelectromechanical systems (MEMS) are one of the most challenging tasks in today's experimental mechanics. More specifically, development of these miniature devices requires sophisticated design, analysis, fabrication, testing, and characterization tools that have multiphysics and multiscale capabilities, especially as MEMS are being developed for use at harsh conditions. In harsh-environment and high-performance (e.g., military) guidance applications inertial sensors must be sensitive to low rates of rotation yet survive the high blast loads associated with the initial launch. In this multi-year study, a set of tuning fork gyroscopes were subjected to a series of increasing g-loads (culminating at approximately 60,000 g's) with measurements of shape made after each test. A custom set of test sample packages (aka articles) were hermetically sealed with glass lids to allow optical inspection of components while preserving the operating environment (i.e., vacuum). Initial test measurements were made upon fabrication of the articles. Optical and interferometric measurements have been made prior to and after each shock g-loading. The shape of the tuning fork gyroscope (TFG) test articles was measured using a phase shifting Michelson interferometer with compensation for package cover glass. Full field shape was determined and traces of pertinent structures were extracted for comparison. Failure of the die was observed in the form of fractures below the chip surface as well as fractures in the glass lid sealing the package. Potential causes of the failure are discussed as well as a recommendation for modified packaging techniques to mitigate future component failures.","PeriodicalId":50296,"journal":{"name":"International Journal of Optomechatronics","volume":"18 1","pages":"391 - 399"},"PeriodicalIF":5.5,"publicationDate":"2014-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/15599612.2014.972600","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"60483018","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Problems and Solutions in 3-D Analysis of Phase Biological Objects by Optical Diffraction Tomography 光学衍射层析技术在相生物物体三维分析中的问题及解决方法

IF 5.5 3区工程技术

International Journal of Optomechatronics Pub Date : 2014-10-02 DOI: 10.1080/15599612.2014.942934

M. Kujawińska, W. Krauze, A. Kuś, J. Kostencka, T. Kozacki, B. Kemper, M. Dudek

引用次数: 27

3-D Optical Interference Microscopy at the Lateral Resolution 横向分辨率的三维光学干涉显微镜

IF 5.5 3区工程技术

International Journal of Optomechatronics Pub Date : 2014-10-02 DOI: 10.1080/15599612.2014.942924

P. Lehmann, J. Niehues, S. Tereschenko

{"title":"3-D Optical Interference Microscopy at the Lateral Resolution","authors":"P. Lehmann, J. Niehues, S. Tereschenko","doi":"10.1080/15599612.2014.942924","DOIUrl":"https://doi.org/10.1080/15599612.2014.942924","url":null,"abstract":"For applications in micro- and nanotechnologies the lateral resolution of optical 3-D microscopes becomes an issue of increasing relevance. However, lateral resolution of 3-D microscopes is hard to define in a satisfying way. Therefore, we first study the measurement capabilities of a highly resolving white-light interference (WLI) microscope close to the limit of lateral resolution. Results of measurements and simulations demonstrate that better lateral resolution seems to be achievable based on the envelope evaluation of a WLI signal. Unfortunately, close to the lateral resolution limit errors in the measured amplitude of micro-structures appear. On the other hand, results of interferometric phase evaluation seem to be strongly low-pass filtered in this case. Furthermore, the instrument transfer characteristics and the lateral resolution capabilities of WLI instruments are also affected by polarization. TM polarized light is less sensitive to edge diffraction and thus systematic errors can be avoided. However, apart from ghost steps due to fringe order errors, the results of phase evaluation seem to be closer to the real surface topography if TE polarized light is used. The lateral resolution can be further improved by combining WLI and structured illumination microscopy. Since the measured height of rectangular profiles close to the lateral resolution limit is generally too small compared to the real height, we introduce a method based on phase evaluation which characterizes the heights of barely laterally resolved rectangular gratings correctly.","PeriodicalId":50296,"journal":{"name":"International Journal of Optomechatronics","volume":"8 1","pages":"231 - 241"},"PeriodicalIF":5.5,"publicationDate":"2014-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/15599612.2014.942924","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"60481801","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 13

Phase Maps Retrieval from Sequences of Phase Shifted Images with Unknown Phase Steps Using Generalized N-Dimensional Lissajous Figures—Principles and Applications 用广义n维利萨图从相位步长未知的相移图像序列中提取相图——原理与应用

IF 5.5 3区工程技术

International Journal of Optomechatronics Pub Date : 2014-09-25 DOI: 10.1080/15599612.2014.942933

A. Albertazzi, A. Fantin, D. Willemann, M. Benedet

引用次数: 10

Handheld 3-D Scanning with Automatic Multi-View Registration Based on Visual-Inertial Navigation 基于视觉惯性导航的手持式多视点自动配准三维扫描

IF 5.5 3区工程技术

International Journal of Optomechatronics Pub Date : 2014-08-18 DOI: 10.1080/15599612.2014.942931

B. Kleiner, C. Munkelt, T. Thórhallsson, G. Notni, P. Kühmstedt, U. Schneider

引用次数: 6

Single Shot Dual-Wavelength Digital Holography: Calibration Based on Speckle Displacements 单镜头双波长数字全息:基于散斑位移的校准

IF 5.5 3区工程技术

International Journal of Optomechatronics Pub Date : 2014-08-08 DOI: 10.1080/15599612.2014.942932

D. Khodadad, P. Bergström, E. Haellstig, M. Sjödahl

引用次数: 18