发布求助
文献互助 智能选刊 最新文献

3D and Circuit Integration of MEMS最新文献

筛选
英文 中文
Index 指数
3D and Circuit Integration of MEMS Pub Date : 1900-01-01 DOI: 10.1002/9783527823239.index
{"title":"Index","authors":"","doi":"10.1002/9783527823239.index","DOIUrl":"https://doi.org/10.1002/9783527823239.index","url":null,"abstract":"","PeriodicalId":436477,"journal":{"name":"3D and Circuit Integration of MEMS","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134560646","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Polymer Bonding 聚合物粘结
3D and Circuit Integration of MEMS Pub Date : 1900-01-01 DOI: 10.1002/9783527823239.ch15
Xiaojing Wang, F. Niklaus
{"title":"Polymer Bonding","authors":"Xiaojing Wang, F. Niklaus","doi":"10.1002/9783527823239.ch15","DOIUrl":"https://doi.org/10.1002/9783527823239.ch15","url":null,"abstract":"","PeriodicalId":436477,"journal":{"name":"3D and Circuit Integration of MEMS","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128813320","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Metal Bonding 金属焊接
3D and Circuit Integration of MEMS Pub Date : 1900-01-01 DOI: 10.1002/9783527823239.ch13
J. Froemel
{"title":"Metal Bonding","authors":"J. Froemel","doi":"10.1002/9783527823239.ch13","DOIUrl":"https://doi.org/10.1002/9783527823239.ch13","url":null,"abstract":"","PeriodicalId":436477,"journal":{"name":"3D and Circuit Integration of MEMS","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116355189","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Anodic Bonding 阳极键合
3D and Circuit Integration of MEMS Pub Date : 1900-01-01 DOI: 10.1007/springerreference_66275
M. Esashi
{"title":"Anodic Bonding","authors":"M. Esashi","doi":"10.1007/springerreference_66275","DOIUrl":"https://doi.org/10.1007/springerreference_66275","url":null,"abstract":"","PeriodicalId":436477,"journal":{"name":"3D and Circuit Integration of MEMS","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115701942","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Through‐substrate Vias 通过检测底物通过
3D and Circuit Integration of MEMS Pub Date : 1900-01-01 DOI: 10.1002/9783527823239.ch20
Zhyao Wang
{"title":"Through‐substrate Vias","authors":"Zhyao Wang","doi":"10.1002/9783527823239.ch20","DOIUrl":"https://doi.org/10.1002/9783527823239.ch20","url":null,"abstract":"","PeriodicalId":436477,"journal":{"name":"3D and Circuit Integration of MEMS","volume":"65 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121458644","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Reactive Bonding 反应性结合
3D and Circuit Integration of MEMS Pub Date : 1900-01-01 DOI: 10.1002/9783527823239.ch14
Klaus Vogel, S. Braun, Christian Hofmann, Mathias Weiser, M. Wiemer, T. Otto, H. Kuhn
{"title":"Reactive Bonding","authors":"Klaus Vogel, S. Braun, Christian Hofmann, Mathias Weiser, M. Wiemer, T. Otto, H. Kuhn","doi":"10.1002/9783527823239.ch14","DOIUrl":"https://doi.org/10.1002/9783527823239.ch14","url":null,"abstract":"","PeriodicalId":436477,"journal":{"name":"3D and Circuit Integration of MEMS","volume":"62 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124506607","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Buried Channels in Monolithic Si 单片硅中的埋藏沟道
3D and Circuit Integration of MEMS Pub Date : 1900-01-01 DOI: 10.1002/9783527823239.ch19
K. Maenaka
{"title":"Buried Channels in Monolithic\u0000 Si","authors":"K. Maenaka","doi":"10.1002/9783527823239.ch19","DOIUrl":"https://doi.org/10.1002/9783527823239.ch19","url":null,"abstract":"","PeriodicalId":436477,"journal":{"name":"3D and Circuit Integration of MEMS","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133359828","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Heterogeneously Integrated Aluminum Nitride MEMS Resonators and Filters 异质集成氮化铝MEMS谐振器和滤波器
3D and Circuit Integration of MEMS Pub Date : 1900-01-01 DOI: 10.1002/9783527823239.ch7
Enes Calayir, S. Merugu, Jaewung Lee, Navab Singh, G. Piazza
{"title":"Heterogeneously Integrated Aluminum Nitride\u0000 MEMS\u0000 Resonators and Filters","authors":"Enes Calayir, S. Merugu, Jaewung Lee, Navab Singh, G. Piazza","doi":"10.1002/9783527823239.ch7","DOIUrl":"https://doi.org/10.1002/9783527823239.ch7","url":null,"abstract":"","PeriodicalId":436477,"journal":{"name":"3D and Circuit Integration of MEMS","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123874016","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Bulk Micromachining 大部分微加工
3D and Circuit Integration of MEMS Pub Date : 1900-01-01 DOI: 10.1002/9783527823239.ch2
Xinxin Li, Heng Yang
{"title":"Bulk Micromachining","authors":"Xinxin Li, Heng Yang","doi":"10.1002/9783527823239.ch2","DOIUrl":"https://doi.org/10.1002/9783527823239.ch2","url":null,"abstract":"","PeriodicalId":436477,"journal":{"name":"3D and Circuit Integration of MEMS","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132388951","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
首页 上一页
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：481959085
Book学术官方微信