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3D and Circuit Integration of MEMS最新文献

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Metal Surface Micromachining 金属表面微加工
3D and Circuit Integration of MEMS Pub Date : 2021-04-23 DOI: 10.1002/9783527823239.ch6
M. Sasaki
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引用次数: 0
MEMS Using CMOS Wafer 采用CMOS晶圆的MEMS
3D and Circuit Integration of MEMS Pub Date : 2021-04-23 DOI: 10.1002/9783527823239.ch8
W. Fang, Sheng-Shian Li, Yi Chiu, Ming-Huang Li
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引用次数: 1
Packaging, Sealing, and Interconnection 包装、密封、互连
3D and Circuit Integration of MEMS Pub Date : 2021-04-23 DOI: 10.1002/9783527823239.ch17
M. Esashi
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引用次数: 2
Soldering by Local Heating 局部加热焊接
3D and Circuit Integration of MEMS Pub Date : 2021-04-23 DOI: 10.1002/9783527823239.ch16
Yu-Ting Cheng, Liwei Lin
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引用次数: 0
Direct Bonding 直接键合
3D and Circuit Integration of MEMS Pub Date : 1900-01-01 DOI: 10.1002/9783527823239.ch12
H. Takagi
{"title":"Direct Bonding","authors":"H. Takagi","doi":"10.1002/9783527823239.ch12","DOIUrl":"https://doi.org/10.1002/9783527823239.ch12","url":null,"abstract":"","PeriodicalId":436477,"journal":{"name":"3D and Circuit Integration of MEMS","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129886835","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Piezoelectric MEMS 压电式MEMS
3D and Circuit Integration of MEMS Pub Date : 1900-01-01 DOI: 10.1002/9783527823239.ch10
T. T. Kobayashi (AIST)
{"title":"Piezoelectric MEMS","authors":"T. T. Kobayashi (AIST)","doi":"10.1002/9783527823239.ch10","DOIUrl":"https://doi.org/10.1002/9783527823239.ch10","url":null,"abstract":"","PeriodicalId":436477,"journal":{"name":"3D and Circuit Integration of MEMS","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131275402","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Overview 概述
3D and Circuit Integration of MEMS Pub Date : 1900-01-01 DOI: 10.1002/9783527823239.ch1
Masayoshi Esashi
{"title":"Overview","authors":"Masayoshi Esashi","doi":"10.1002/9783527823239.ch1","DOIUrl":"https://doi.org/10.1002/9783527823239.ch1","url":null,"abstract":"","PeriodicalId":436477,"journal":{"name":"3D and Circuit Integration of MEMS","volume":"68 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123886571","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Epitaxial Poly Si Surface Micromachining 外延多晶硅表面微加工
3D and Circuit Integration of MEMS Pub Date : 1900-01-01 DOI: 10.1002/9783527823239.ch4
M. Esashi
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引用次数: 0
Vacuum Packaging 真空包装
3D and Circuit Integration of MEMS Pub Date : 1900-01-01 DOI: 10.1002/9783527823239.ch18
M. Esashi
{"title":"Vacuum Packaging","authors":"M. Esashi","doi":"10.1002/9783527823239.ch18","DOIUrl":"https://doi.org/10.1002/9783527823239.ch18","url":null,"abstract":"","PeriodicalId":436477,"journal":{"name":"3D and Circuit Integration of MEMS","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125046531","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
Wafer Transfer 晶片传送
3D and Circuit Integration of MEMS Pub Date : 1900-01-01 DOI: 10.1002/9783527823239.ch9
M. Esashi
{"title":"Wafer Transfer","authors":"M. Esashi","doi":"10.1002/9783527823239.ch9","DOIUrl":"https://doi.org/10.1002/9783527823239.ch9","url":null,"abstract":"","PeriodicalId":436477,"journal":{"name":"3D and Circuit Integration of MEMS","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114215261","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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