发布求助
文献互助 智能选刊 最新文献

2023 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)最新文献

筛选
英文 中文
Session VI Panel Discussions 第六部分小组讨论
2023 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS) Pub Date : 2023-04-19 DOI: 10.1109/coolchips57690.2023.10122101
{"title":"Session VI Panel Discussions","authors":"","doi":"10.1109/coolchips57690.2023.10122101","DOIUrl":"https://doi.org/10.1109/coolchips57690.2023.10122101","url":null,"abstract":"","PeriodicalId":387793,"journal":{"name":"2023 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2023-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129092719","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Special Session Speakers Biography 特别会议讲者简介
2023 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS) Pub Date : 2023-04-19 DOI: 10.1109/coolchips57690.2023.10122114
{"title":"Special Session Speakers Biography","authors":"","doi":"10.1109/coolchips57690.2023.10122114","DOIUrl":"https://doi.org/10.1109/coolchips57690.2023.10122114","url":null,"abstract":"","PeriodicalId":387793,"journal":{"name":"2023 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2023-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114431698","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
COOL-NPU: Complementary Online Learning Neural Processing Unit with CNN-SNN Heterogeneous Core and Event-driven Backpropagation COOL-NPU:具有CNN-SNN异构核心和事件驱动反向传播的互补在线学习神经处理单元
2023 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS) Pub Date : 2023-04-19 DOI: 10.1109/COOLCHIPS57690.2023.10121940
Sangyeob Kim, Soyeon Kim, Seongyon Hong, Sangjin Kim, Donghyeon Han, Jiwon Choi, H. Yoo
{"title":"COOL-NPU: Complementary Online Learning Neural Processing Unit with CNN-SNN Heterogeneous Core and Event-driven Backpropagation","authors":"Sangyeob Kim, Soyeon Kim, Seongyon Hong, Sangjin Kim, Donghyeon Han, Jiwon Choi, H. Yoo","doi":"10.1109/COOLCHIPS57690.2023.10121940","DOIUrl":"https://doi.org/10.1109/COOLCHIPS57690.2023.10121940","url":null,"abstract":"This paper presents a low power NPU, COmplementary Online Learning Neural Processing Unit (COOL-NPU) with three key features: 1) low-power forward gradient generation logic with global counter and local gradient unit, 2) skip index generator and sparsity-aware CNN core for neuron-level backpropagation, 3) SNN core with distributed L1 cache to eliminate redundant SRAM access. By using complementary characteristic of CNN and SNN, we achieve 47.7% energy reduction than previous state-of-the-art online learning processor.","PeriodicalId":387793,"journal":{"name":"2023 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2023-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129712571","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Dual Vector Load for Improved Pipelining in Vector Processors 改进矢量处理器流水线的双矢量负载
2023 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS) Pub Date : 2023-04-19 DOI: 10.1109/COOLCHIPS57690.2023.10121996
Viktor Razilov, Juncen Zhong, E. Matús, G. Fettweis
{"title":"Dual Vector Load for Improved Pipelining in Vector Processors","authors":"Viktor Razilov, Juncen Zhong, E. Matús, G. Fettweis","doi":"10.1109/COOLCHIPS57690.2023.10121996","DOIUrl":"https://doi.org/10.1109/COOLCHIPS57690.2023.10121996","url":null,"abstract":"Vector processors execute instructions that manipulate vectors of data items using time-division multiplexing (TDM). Chaining, the pipelined execution of vector instruction, ensures high performance and utilization. When two vectors are loaded sequentially to be the input of a follow-up compute instruction, which is often the case in vector applications, chaining cannot take effect during the duration of the entire first vector load. To close this gap, we propose dual load: A parallel or interleaved load of the two input vectors. We study this feature analytically and make statements on necessary conditions for performance improvements. Our investigation finds that compute-bound and some memory-bound applications profit from this feature when the memory and compute bandwidths are sufficiently high. A speedup of up to 33 % is possible in the ideal case. Our practical implementation shows improvements of up to 21 % with a hardware overhead of less than 2 %.","PeriodicalId":387793,"journal":{"name":"2023 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2023-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133209364","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
首页 上一页
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：481959085
Book学术官方微信