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Instrumentation Mesure Metrologie最新文献

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Ultrasound Monitoring of Water Content in Ultra High Temperature Milk 超高温牛奶中水分的超声监测
Instrumentation Mesure Metrologie Pub Date : 2023-08-31 DOI: 10.18280/i2m.220406
El Houssaine Ouacha, Redouane Leghrib, Nabil Khatib, Bouazza Faiz, Hicham Banouni, Ali Moudden, Idriss Aboudaoud
{"title":"Ultrasound Monitoring of Water Content in Ultra High Temperature Milk","authors":"El Houssaine Ouacha, Redouane Leghrib, Nabil Khatib, Bouazza Faiz, Hicham Banouni, Ali Moudden, Idriss Aboudaoud","doi":"10.18280/i2m.220406","DOIUrl":"https://doi.org/10.18280/i2m.220406","url":null,"abstract":"ABSTRACT","PeriodicalId":38637,"journal":{"name":"Instrumentation Mesure Metrologie","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-08-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135990231","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Development of a Low-Cost and Modular Vertical Farming Rig for Sustainable Farming Process 一种低成本模块化垂直农业钻机的开发，用于可持续农业过程
Instrumentation Mesure Metrologie Pub Date : 2023-06-30 DOI: 10.18280/i2m.220302
Oluwatobi Oyeshile, D. Fadare, R. A. Kazeem, O. Ikumapayi, A. Adetunla, D. A. Fadare, Isaac O. Enobun, A. Adeoye
{"title":"Development of a Low-Cost and Modular Vertical Farming Rig for Sustainable Farming Process","authors":"Oluwatobi Oyeshile, D. Fadare, R. A. Kazeem, O. Ikumapayi, A. Adetunla, D. A. Fadare, Isaac O. Enobun, A. Adeoye","doi":"10.18280/i2m.220302","DOIUrl":"https://doi.org/10.18280/i2m.220302","url":null,"abstract":"","PeriodicalId":38637,"journal":{"name":"Instrumentation Mesure Metrologie","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-06-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"45931470","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Business Risk and CAPEX/OPEX Analysis: Impact on Natural Gas Fiscal Measurement Systems 商业风险和资本支出/运营支出分析:对天然气财政计量系统的影响
Instrumentation Mesure Metrologie Pub Date : 2023-06-30 DOI: 10.18280/i2m.220304
C. Barateiro, Mauricio Casado, Claudio Makarovsky, J. R. De Farias Filho
{"title":"Business Risk and CAPEX/OPEX Analysis: Impact on Natural Gas Fiscal Measurement Systems","authors":"C. Barateiro, Mauricio Casado, Claudio Makarovsky, J. R. De Farias Filho","doi":"10.18280/i2m.220304","DOIUrl":"https://doi.org/10.18280/i2m.220304","url":null,"abstract":"","PeriodicalId":38637,"journal":{"name":"Instrumentation Mesure Metrologie","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-06-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"42397137","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Effect of Parameters of Chemical Mechanical Polishing (CMP) for Improving Surface Roughness for Semiconductor Material Kind Silicon 化学机械抛光（CMP）参数对提高半导体材料硅表面粗糙度的影响
Instrumentation Mesure Metrologie Pub Date : 2023-06-30 DOI: 10.18280/i2m.220305
S. Mousa, S. Aghdeab
{"title":"Effect of Parameters of Chemical Mechanical Polishing (CMP) for Improving Surface Roughness for Semiconductor Material Kind Silicon","authors":"S. Mousa, S. Aghdeab","doi":"10.18280/i2m.220305","DOIUrl":"https://doi.org/10.18280/i2m.220305","url":null,"abstract":"Chemical Mechanical Polishing (CMP) is the polishing process where the top surface of a wafer is smoothed using a slurry containing abrasive grit as well as reactive chemical agents. The polishing process is partly mechanical and partly chemical. The mechanical element's main advantage is that it is achieved without great effort to manufacture and supplies good-quality general mechanical and electrical properties. In the current study, the invention reckons on the chemical and mechanical properties of the composition particles (abrasive slurry) utilized to polish silicon surfaces traveling through chemical-mechanical polishing (CMP). MINITAB 17 software was used to estimate the influence of the (CMP) input variables on the surface roughness (Ra) of the silicon workpiece. Other process input variables were disk speed (rpm), the dose of abrasive, the grain size of the abrasive, and the type of slurry. In order to get the best response surface roughness, the current findings show that the constant coefficient of determination (R2) is 95.80%. Furthermore, the effects of disk speed (X1), abrasive dose (X2), abrasive grain size (X3), and type of slurry (X4) on achieving a superior surface roughness finish were 21.05%, 4.34%, 50.00%, and 24.59%, respectively.","PeriodicalId":38637,"journal":{"name":"Instrumentation Mesure Metrologie","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-06-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"47377197","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Systematic Literature Network Analysis: Research Mapping of International Roughness Index 系统的文献网络分析：国际粗糙度指数研究制图
Instrumentation Mesure Metrologie Pub Date : 2023-06-30 DOI: 10.18280/i2m.220301
L. Lendra, M. Wibowo, J. Hatmoko
{"title":"A Systematic Literature Network Analysis: Research Mapping of International Roughness Index","authors":"L. Lendra, M. Wibowo, J. Hatmoko","doi":"10.18280/i2m.220301","DOIUrl":"https://doi.org/10.18280/i2m.220301","url":null,"abstract":"","PeriodicalId":38637,"journal":{"name":"Instrumentation Mesure Metrologie","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-06-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"42296140","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Assessment of Irrigation Water Quality Using the Canadian Water Quality Index (CWQI) in the Hilla Main Canal, Iraq 利用加拿大水质指数(CWQI)评价伊拉克希拉主运河灌溉水质
Instrumentation Mesure Metrologie Pub Date : 2023-06-30 DOI: 10.18280/i2m.220303
M. Mohsen, F. Al-Mohammed
{"title":"Assessment of Irrigation Water Quality Using the Canadian Water Quality Index (CWQI) in the Hilla Main Canal, Iraq","authors":"M. Mohsen, F. Al-Mohammed","doi":"10.18280/i2m.220303","DOIUrl":"https://doi.org/10.18280/i2m.220303","url":null,"abstract":"","PeriodicalId":38637,"journal":{"name":"Instrumentation Mesure Metrologie","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-06-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44098310","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Congestion Control Mechanism on Transport Layer Protocol: The Application of Terahertz Frequency 传输层协议中的拥塞控制机制:太赫兹频率的应用
Instrumentation Mesure Metrologie Pub Date : 2023-04-30 DOI: 10.18280/i2m.220202
Sabelo Emmanuel. Sithole, P. Thakur, G. Singh
{"title":"Congestion Control Mechanism on Transport Layer Protocol: The Application of Terahertz Frequency","authors":"Sabelo Emmanuel. Sithole, P. Thakur, G. Singh","doi":"10.18280/i2m.220202","DOIUrl":"https://doi.org/10.18280/i2m.220202","url":null,"abstract":"ABSTRACT","PeriodicalId":38637,"journal":{"name":"Instrumentation Mesure Metrologie","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-04-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"48788006","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Development of a Mechatronics System for Cavitation Prevention in a Pump 泵防汽蚀机电一体化系统的研制
Instrumentation Mesure Metrologie Pub Date : 2023-04-30 DOI: 10.18280/i2m.220201
Agbor A. Esoso, S. Akande, Omolayo M. Ikumapayi
{"title":"Development of a Mechatronics System for Cavitation Prevention in a Pump","authors":"Agbor A. Esoso, S. Akande, Omolayo M. Ikumapayi","doi":"10.18280/i2m.220201","DOIUrl":"https://doi.org/10.18280/i2m.220201","url":null,"abstract":"ABSTRACT","PeriodicalId":38637,"journal":{"name":"Instrumentation Mesure Metrologie","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-04-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44212795","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
An Energy Efficient Technique for Improved Network Lifetime in Wireless Sensor Network (WSN) Through Energy, Distance, and Density-Based Clustering 基于能量、距离和密度聚类提高无线传感器网络(WSN)网络寿命的节能技术
Instrumentation Mesure Metrologie Pub Date : 2023-04-30 DOI: 10.18280/i2m.220203
Asha Rawat, M. Kalla
{"title":"An Energy Efficient Technique for Improved Network Lifetime in Wireless Sensor Network (WSN) Through Energy, Distance, and Density-Based Clustering","authors":"Asha Rawat, M. Kalla","doi":"10.18280/i2m.220203","DOIUrl":"https://doi.org/10.18280/i2m.220203","url":null,"abstract":"","PeriodicalId":38637,"journal":{"name":"Instrumentation Mesure Metrologie","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-04-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"42023558","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Prospective Study on Perturb Observe MPPT Methods for Photovoltaic Systems 光伏系统微扰观测MPPT方法的前瞻性研究
Instrumentation Mesure Metrologie Pub Date : 2023-04-30 DOI: 10.18280/i2m.220204
Sreenivasulu Annam, S. Srikrishna, Sangameswara Raju Prabandhankam, Ganesan Sivarajan
{"title":"A Prospective Study on Perturb Observe MPPT Methods for Photovoltaic Systems","authors":"Sreenivasulu Annam, S. Srikrishna, Sangameswara Raju Prabandhankam, Ganesan Sivarajan","doi":"10.18280/i2m.220204","DOIUrl":"https://doi.org/10.18280/i2m.220204","url":null,"abstract":"ABSTRACT","PeriodicalId":38637,"journal":{"name":"Instrumentation Mesure Metrologie","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-04-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"48340364","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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