Novel Metal Electrodeposition and the Recent Application最新文献

Electrodeposition of High-Functional Metal Oxide on Noble Metal for MEMS Devices 用于MEMS器件的贵金属电沉积高功能金属氧化物

Novel Metal Electrodeposition and the Recent Application Pub Date : 2018-12-14 DOI: 10.5772/INTECHOPEN.82394

W. Chiu, Chun-Yi Chen, T. Chang, T. Hashimoto, H. Kurosu

引用次数: 0

Hard Pure-Gold and Gold-CNT Composite Plating Using Electrodeposition Technique with Environmentally Friendly Sulfite Bath 环保亚硝酸盐浴电沉积技术镀硬纯金和金碳纳米管复合材料

Novel Metal Electrodeposition and the Recent Application Pub Date : 2018-11-29 DOI: 10.5772/INTECHOPEN.82226

Masatsugu Fujishige, S. Arai

{"title":"Hard Pure-Gold and Gold-CNT Composite Plating Using Electrodeposition Technique with Environmentally Friendly Sulfite Bath","authors":"Masatsugu Fujishige, S. Arai","doi":"10.5772/INTECHOPEN.82226","DOIUrl":"https://doi.org/10.5772/INTECHOPEN.82226","url":null,"abstract":"Gold was used by Chinese and Egyptians of ancient times (at least ca 3000 BC). For many years, gold based materials have received great attention from people, due to the good conductor, high chemical stability, unique optical and processable properties. Electrodeposition technology is a long established technique for synthesizing metals on conductive substrates. Advances in equipment and creations of nanomaterials could carry out new technological progress, a large duty ratio with a pulse overvoltage became possible and new composite fillers (for example, carbon nanotubes: CNTs) appeared. Moreover, environmental considerations have become more important as Sustainable Development Goals (SDGs). SDGs were adopted at the United Nations Summit in September 2015 and are the goals set by the 193 member countries to achieve in the 15 years from 2016 to 2030. For the global environment and workers, friendly manufacturing methods have become more important. In this chapter, two nanostructured golds (hard pure-gold plating and gold-CNT composite plating) are discussed. They are a method of hardening the metal as pure-gold by pulsed electrodeposition and a method of combining CNT by controlling the zeta potential with additives, and their application as a contact material was investigated. Additionally, the synthesis and characteristics of electrostatic deposition films with properties using environmentally friendly sulfite bath are discussed.","PeriodicalId":374529,"journal":{"name":"Novel Metal Electrodeposition and the Recent Application","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-11-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126626078","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Multi-Physics Simulation Platform and Multi-Layer Metal Technology for CMOS-MEMS Accelerometer with Gold Proof Mass 金质量CMOS-MEMS加速度计多物理场仿真平台及多层金属技术

Novel Metal Electrodeposition and the Recent Application Pub Date : 2018-11-19 DOI: 10.5772/INTECHOPEN.81832

K. Machida, T. Konishi, D. Yamane, H. Toshiyoshi, Hiroyuki Ito

{"title":"Multi-Physics Simulation Platform and Multi-Layer Metal Technology for CMOS-MEMS Accelerometer with Gold Proof Mass","authors":"K. Machida, T. Konishi, D. Yamane, H. Toshiyoshi, Hiroyuki Ito","doi":"10.5772/INTECHOPEN.81832","DOIUrl":"https://doi.org/10.5772/INTECHOPEN.81832","url":null,"abstract":"This chapter describes technical features and solutions to realize a highly sensitive CMOS-MEMS accelerometer with gold proof mass. The multi-physics simulation platform for designing the CMOS-MEMS device has been developed to understand simultaneously both mechanical and electrical behaviors of MEMS stacked on LSI. MEMS accelerometer fabrication process is established by the multilayer metal technology, which consists of the gold electroplating and the photo-sensitive polyimide film. The proposed MEMS accelerometers are fabricated and evaluated to verify the effectiveness of the proposed techniques regarding sub-1G MEMS and arrayed MEMS devices. The experimental results show that the Brownian noise of the sub-1G MEMS accelerometer can achieve 780 nG/(Hz) 1/2 and the arrayed MEMS accelerometer has a wide detection, ranging from 1.0 to 20 G. Moreover, using the developed simulation platform, we demonstrate the proposed capacitive CMOS-MEMS accelerometer implemented by the multi-layer metal technology. In conclusion, it is confirmed that the multi-physics simulation platform and the multi-layer metal technology for the CMOS-MEMS device have a potential to realize a nano-gravity sensing technology.","PeriodicalId":374529,"journal":{"name":"Novel Metal Electrodeposition and the Recent Application","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-11-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132570342","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Morphology Controlled Synthesis of the Nanostructured Gold by Electrodeposition Techniques 电沉积技术在形貌控制下合成纳米金

Novel Metal Electrodeposition and the Recent Application Pub Date : 2018-11-16 DOI: 10.5772/INTECHOPEN.80846

Brij Mohan Mundotiya, W. Ullah

引用次数: 4

Cu Wiring Fabrication by Supercritical Fluid Deposition for MEMS Devices 超临界流体沉积制备MEMS器件铜线

Novel Metal Electrodeposition and the Recent Application Pub Date : 2018-11-15 DOI: 10.5772/INTECHOPEN.81636

E. Kondoh

{"title":"Cu Wiring Fabrication by Supercritical Fluid Deposition for MEMS Devices","authors":"E. Kondoh","doi":"10.5772/INTECHOPEN.81636","DOIUrl":"https://doi.org/10.5772/INTECHOPEN.81636","url":null,"abstract":"Process technologies that use supercritical CO 2 fluids to fabricate high-aspect-ratio three-dimensional nano- and micro-components are described. Supercritical CO 2 is a state of CO 2 above the critical point. Supercritical CO 2 fluids are used as alternatives to common media (gases and liquids) in MEMS device fabrication to both overcome the drawbacks of these materials and to realize a superior three-dimensional process opportunity. Supercritical fluids behave as both gases and liquids, offer many of the advantages of both, and have zero surface tension. Supercritical fluids are an ideal medium for fabricating very high-aspect-ratio features owing to their superior capability of diffusion transport. As MEMSs have complex and high-aspect-ratio structures, using a supercritical fluid as a process medium in MEMS fabrication provides ideal performance in film coating, plug filling of concave features, and the etching/cleaning of residues. In this chapter, the physicochemical properties of supercritical fluids are first described in terms of MEMS processing, but from a different point of view than that of the common literature on supercritical chemical processing. Next, various applications to thin film processing are described with a focus on interconnect/wiring fabrication of MEMS devices.","PeriodicalId":374529,"journal":{"name":"Novel Metal Electrodeposition and the Recent Application","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114138966","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Pulse-Current Electrodeposition of Gold 脉冲电流电沉积金

Novel Metal Electrodeposition and the Recent Application Pub Date : 2018-11-05 DOI: 10.5772/INTECHOPEN.80845

Chun-Yi Chen, Masaharu Yoshiba, Haochun Tang, T. Chang, T. Nagoshi, D. Yamane, T. Konishi, K. Machida

{"title":"Pulse-Current Electrodeposition of Gold","authors":"Chun-Yi Chen, Masaharu Yoshiba, Haochun Tang, T. Chang, T. Nagoshi, D. Yamane, T. Konishi, K. Machida","doi":"10.5772/INTECHOPEN.80845","DOIUrl":"https://doi.org/10.5772/INTECHOPEN.80845","url":null,"abstract":"Pulse-current electrodeposition and a sulfite-based electrolyte were used in fabrication of pure gold films. Surface of the pulse-electrodeposited gold film possessed less defect, lower roughness, smaller grain size, and denser texture when compared with the gold film prepared by constant-current electrodeposition. Microstructures and compressive yield strength of the electrodeposited gold could be controlled by regulating the pulse on-time and off-time intervals in pulse-current electrodeposition. The gold film prepared under the optimum conditions showed an average grain size at 10.4 nm, and the compressive yield strength reached 800 MPa for a pillar-type micro-specimen having dimensions of 10 μm × 10 μm × 20 μm fabricated from the pulse-electrodeposited gold film. Average grain size of the pulse-electrodeposited gold film was much smaller, and the compressive yield strength was much higher than the values reported in other studies. The high strength is due to the grain boundary strengthening mechanism known as the Hall-Petch relationship. In general, the pulse-electrodeposited gold films showed yield strength ranging from 400 to 673 MPa when the average grain size varied by adjusting the pulse-electrodeposition parameters.","PeriodicalId":374529,"journal":{"name":"Novel Metal Electrodeposition and the Recent Application","volume":"2018 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131462199","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Electrodeposition of Gold Alloys and the Mechanical Properties 金合金的电沉积及其力学性能

Novel Metal Electrodeposition and the Recent Application Pub Date : 2018-11-05 DOI: 10.5772/INTECHOPEN.80755

Haochun Tang, T. Chang, Chun-Yi Chen, T. Nagoshi, D. Yamane, T. Konishi, K. Machida

引用次数: 2

Evaluation Methods of Mechanical Properties of Micro-Sized Specimens 微尺度试件力学性能评价方法研究

Novel Metal Electrodeposition and the Recent Application Pub Date : 2018-11-05 DOI: 10.5772/INTECHOPEN.80589

T. Nagoshi, T. Chang

引用次数: 0