电沉积技术在形貌控制下合成纳米金

Brij Mohan Mundotiya, W. Ullah
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引用次数: 4

摘要

金纳米结构在MEMS、光电子学和电子工业中有许多技术应用。为了提高金纳米结构在这些领域的适用性和适用性,需要对沉积的金纳米结构的形貌进行修饰。近年来,电沉积法因其时间效率、成本效益和不需要真空技术而成为沉积不同尺寸和形态纳米结构的一种广泛使用的方法。在该方法中,通过调整电解液浓度、电解液温度、电流密度、沉积时间等电沉积工艺参数,可以很容易地控制沉积金纳米结构的形貌。本章详细介绍了影响金纳米结构镀层形貌的关键电沉积参数。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Morphology Controlled Synthesis of the Nanostructured Gold by Electrodeposition Techniques
The gold nanostructures find several technological applications in MEMS, optoelectronics, and electronics industries. To enhance the applicability and suitability of the gold nanostructures in these fields, modification of the morphology of the deposited nanostructure is required. In recent years, the electrodeposition method has emerged as a widely known method for the deposition of the nanostructures of different dimensions and morphologies due to its time efficiency, cost-effectiveness, and absence of vacuum technology. In this method, the morphology of the deposited gold nanostructure can also be easily controlled by tuning the electrodeposition process parameters such as electrolyte concentration, electrolyte temperature, current density, deposition time, etc. This chapter gives a detailed overview of the crucial electrodeposition parameters affecting the morphology of the gold nanostructures deposits.
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