Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357)最新文献_第5页

Development of new Pb-free solder alloy of Sn-Ag-Bi system 新型Sn-Ag-Bi体系无铅钎料合金的研制

Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357) Pub Date : 1999-05-11 DOI: 10.1109/ISEE.1999.765841

K. Habu, N. Takeda, H. Watanabe, K. Ooki, J. Abe, T. Saito, Y. Taniguchi, K. Takayama

引用次数: 5

End-of-life treatment from technical and economical perspectives-a cornerstone of efficient design for recycling 从技术和经济的角度来看，报废处理是有效回收设计的基石

Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357) Pub Date : 1999-05-11 DOI: 10.1109/ISEE.1999.765896

J. Nilsson, M. Bjorkman

引用次数: 4

System simulation and modeling of electronics demanufacturing facilities 电子拆解设备的系统仿真与建模

Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357) Pub Date : 1999-05-11 DOI: 10.1109/ISEE.1999.765883

K. Limaye, R. Caudill

引用次数: 15

End-of-life treatment of telecommunication/IT products-a joint multi-disciplinary project 电讯/资讯科技产品的报废处理-一个多学科的联合项目

Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357) Pub Date : 1999-05-11 DOI: 10.1109/ISEE.1999.765849

M. Bjorkman, L. Melin

{"title":"End-of-life treatment of telecommunication/IT products-a joint multi-disciplinary project","authors":"M. Bjorkman, L. Melin","doi":"10.1109/ISEE.1999.765849","DOIUrl":"https://doi.org/10.1109/ISEE.1999.765849","url":null,"abstract":"The paper describes an ongoing multi-disciplinary joint research project between Ericsson and a multidisciplinary research group within the International Graduate School of Management and Industrial Engineering, Linkoping University, Sweden. The purpose of the project is to develop general as well as Ericsson specific knowledge within the field of end-of-life treatment and design for environment of telecommunication and other information technology products. The project aims at providing support for continuous development of environmental criteria and proactive action. Addressing the following issues fulfils the purpose of the project: How can Ericsson continuously improve its strategies for environmental performance of its products, seen over their whole life cycle? How can end-of-life treatment considerations increase the benefit for a company like Ericsson and its customers? What is the essential focus while designing products to be ahead of demands from customers, other stakeholders, and future environmental legislation? In the paper is a discussion as to why the holistic nature of the project makes multi-disciplinary research vital. The paper also gives an overview of achieved research results and a discussion about important practical aspects concerning this kind of multi-disciplinary joint project between industry and university.","PeriodicalId":360946,"journal":{"name":"Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357)","volume":"237 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121627821","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Metrics for telecom products: essential part of an ecodesign methodology 电信产品的指标:生态设计方法论的重要组成部分

Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357) Pub Date : 1999-05-11 DOI: 10.1109/ISEE.1999.765842

S. Criel, T. Bervoets, P. de Langhe, D. Ceuterick, A. Vercalsteren

{"title":"Metrics for telecom products: essential part of an ecodesign methodology","authors":"S. Criel, T. Bervoets, P. de Langhe, D. Ceuterick, A. Vercalsteren","doi":"10.1109/ISEE.1999.765842","DOIUrl":"https://doi.org/10.1109/ISEE.1999.765842","url":null,"abstract":"Alcatel SSD Antwerp (Belgium) has an \"ecodesign toolkit\" available, in order to reduce the overall environmental impacts of its telecommunications products. This toolkit contains three basic types of \"tools\": qualitative (guidelines and checklists); semi-quantitative (metrics); and quantitative (LCA based approaches). This paper specifically focuses on product related metrics, which indicate how well a product meets the requirements which are part of the ecodesign guidelines and checklist. This allows product designers to calculate a single value (expressed in environmental penalty points) which indicates the environmental performance of a specific product layout. In addition, the metrics reveals the key issues where environmental product improvements can be achieved. In this paper, the metrics approach is described and compared to two life cycle oriented approaches: life cycle assessment (LCA); and an eco-design analysis using software tool for quick eco-design assessments. The subject of this comparative assessment was a fan unit, a sub-assembly of a telecommunication broadband switching rack.","PeriodicalId":360946,"journal":{"name":"Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357)","volume":"181 10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131277151","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Separation processes and economic evaluation of tertiary recycling of electronic scrap 电子废弃物三级回收的分离工艺及经济评价

Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357) Pub Date : 1999-05-11 DOI: 10.1109/ISEE.1999.765874

L. Busselle, T. A. Moore, J. M. Shoemaker, R. Allred

引用次数: 7

Environmental performance of mobile products 移动产品的环境性能

Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357) Pub Date : 1999-05-11 DOI: 10.1109/ISEE.1999.765864

B. Ram, A. Stevels, H. Griese, A. Middendorf, J. Muller, N. Nissen, H. Reich

{"title":"Environmental performance of mobile products","authors":"B. Ram, A. Stevels, H. Griese, A. Middendorf, J. Muller, N. Nissen, H. Reich","doi":"10.1109/ISEE.1999.765864","DOIUrl":"https://doi.org/10.1109/ISEE.1999.765864","url":null,"abstract":"Digitalization, miniaturization and integration are strong drivers for further development of products for mobile communication. As such these will generally lead to lower environmental loads per product. However, the strongly increasing number of products on the market will reverse this trend for the total sector. Examinations on telephones have been carried out jointly at Philips Consumer Electronics and at the Fraunhofer Institute for Reliability and Microintegration (IZM). The characteristic product parts, energy supply, display, encasing and electronic signal processing are subjected to an environmental assessment (including environmental assessment with Eco-Indicator and with the Toxic Potential Indicator IZM-TPI) and improvement potentials are shown for the selected products. The analysis shows that in mobile products, energy systems and the printed circuit boards are the key elements in further reduction of environmental loads. Both alternative substrates, lead free soldering and component selection (less hazardous substances) can contribute substantially towards this goal. These three topics are combined with further miniaturization, especially reduction of the board size, in the future. Approximately only half of the potential in this field has been implemented yet. As an overall result, it is concluded that the environmentally based load of present and future mobile products can be kept within limits if a swift implementation of EcoDesign (design for environment) is ensured.","PeriodicalId":360946,"journal":{"name":"Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123789575","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 17

Life-cycle environmental comparison of primary and secondary batteries 一次电池与二次电池寿命周期环境比较

Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357) Pub Date : 1999-05-11 DOI: 10.1109/ISEE.1999.765872

R. Lankey, F. McMichael

引用次数: 4

Semiconductor devices drive environmentally conscious product (ECP) goals 半导体器件推动环境意识产品(ECP)的目标

Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357) Pub Date : 1999-05-11 DOI: 10.1109/ISEE.1999.765838

D.W. McDonnell, M.A. Flandera-Christie

{"title":"Semiconductor devices drive environmentally conscious product (ECP) goals","authors":"D.W. McDonnell, M.A. Flandera-Christie","doi":"10.1109/ISEE.1999.765838","DOIUrl":"https://doi.org/10.1109/ISEE.1999.765838","url":null,"abstract":"Semiconductor technology advances not only drive performance aspects but contribute significantly towards promoting environmentally conscious product (ECP) goals by reducing power requirements and materials for the same function through scaling. As the market drives towards smaller and portable hand-held devices, battery life becomes significant. Several new technologies are discussed which have provided the leadership in manufacturing for IBM microchips while significantly enhancing energy usage material requirements. Copper technology has become the conductor of choice allowing higher speeds through smaller dimensions. Aluminum is not able to keep up when the transistors were made faster and packed closer together thus causing the interconnection to be the gate. Resistance and inductance sap semiconductor speed and power, which has now been overcome through the use of copper technology. Silicon-on-insulator (SOI) alters the transistor design, enhancing them to run faster and use less power. The SOI process protects the millions of tiny transistors on a chip with a \"blanket\" of insulation, reducing harmful electrical effects that sap energy. If performance levels are held constant, SOI chips can require as little as 1/3 the power of today's microchips. SiGe material enhancements offer even further power and material reductions by making it possible to pack more transistors onto a single chip. This technology enhances performance while addressing low-power needs of wireless products, the network access appliance market, as well as the growing segments of the networked world with requirements for high speed routers and switches. This new market outlook demand for more portable devices and the subsequent battery life makes it a major concern to maximize the life of batteries (reducing power requirements) in order to support environmentally conscious goals of energy consumption, materials and disposal concerns.","PeriodicalId":360946,"journal":{"name":"Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123998375","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Implementation of design for environment at a diversified OEM 在一个多元化的OEM实施环境设计

Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357) Pub Date : 1999-05-11 DOI: 10.1109/ISEE.1999.765844

T. Swarr, J. Legarth, E. Huang

引用次数: 5