Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357)最新文献_第2页

Global environmental protection technologies in the Matsushita Electric Group (Panasonic) 全球环保技术在松下电器集团(Panasonic)

Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357) Pub Date : 1999-05-11 DOI: 10.1109/ISEE.1999.765871

T. Nitta, D. A. Thompson

引用次数: 1

Implementing design for environment changes in Quantum's high-end tape business 在量子的高端磁带业务中实现环境变化的设计

Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357) Pub Date : 1999-05-11 DOI: 10.1109/ISEE.1999.765845

D. Newman, G. Chambers, B. Jimison, D. Cox

{"title":"Implementing design for environment changes in Quantum's high-end tape business","authors":"D. Newman, G. Chambers, B. Jimison, D. Cox","doi":"10.1109/ISEE.1999.765845","DOIUrl":"https://doi.org/10.1109/ISEE.1999.765845","url":null,"abstract":"Quantum's Specialty Storage Products Group (SSPG) designs and manufactures high-end Digital Linear Tape (DLT/sup TM/) back-up systems, libraries and autoloaders. Quantum set out to improve the environmental performance of this product line by developing and implementing a design for environment (DFE) program customized for the product, its customers, and end-users. Although environmental improvement was a high priority for the project, it was also critical to encourage those changes that would meet business needs, and that could feasibly be implemented. A combined effort was made between Environmental Engineers, SSPG Marketing, and Advanced Products (AP) Engineering to identify such possible changes. To prioritize DFE areas, Quantum considered, in order of priority: (1) market advantage and customer concerns, (2) engineering feasibility/cost, and (3) environmental impact. Data from end-users, as well as from product knowledge, literature and disassembly sequences were utilized. As a result of the prioritization and involvement of these groups, changes were made to the product design that will reduce environmental impact during use and disposal phases.","PeriodicalId":360946,"journal":{"name":"Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128028083","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Understanding the real impact of DFE guidelines: a case study of four generations of telephones 了解DFE指南的真正影响:四代电话的案例研究

Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357) Pub Date : 1999-05-11 DOI: 10.1109/ISEE.1999.765863

H. Al-Okush, R. Caudill, V. Thomas

引用次数: 13

A combinatorial cost-benefit analysis methodology for designing modular electronic products for the environment 面向环境的模块化电子产品设计组合成本效益分析方法

Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357) Pub Date : 1999-05-11 DOI: 10.1109/ISEE.1999.765888

P. Veerakamolmal, Surendra M. Gupta

引用次数: 16

Characterization of material outputs from an electronics demanufacturing facility 电子拆解设备的材料输出特性

Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357) Pub Date : 1999-05-11 DOI: 10.1109/ISEE.1999.765885

S.K. Das, S. Matthew

{"title":"Characterization of material outputs from an electronics demanufacturing facility","authors":"S.K. Das, S. Matthew","doi":"10.1109/ISEE.1999.765885","DOIUrl":"https://doi.org/10.1109/ISEE.1999.765885","url":null,"abstract":"In a typical disassembly facility there are two classes of outputs, (i) retrieved parts or subsystems, and (ii) material waste. The material waste is shipped out to either a material reclamation facility or a landfill site. A clear definition of this material output is essential to the modeling and analysis of a disassembly facility. These definitions will determine the appropriate disassembly plan, process economics, and handling requirements. In this paper we introduce and define the majority of outputs from electronic disassembly plants. The work is based on studies conducted at several commercial facilities. For each output the purity thresholds, the most likely recycling paths, and the potential reuse values are discussed. Recycling costs tend to increase as the purity of the entering material drops. One of the purposes of disassembly therefore, is to enhance the purity of the output bins. A disassembly planner must address several questions in the context of the bins, such as: is it economical to further disassemble a subassembly so as to increase purity? Is there enough mass to warrant maintaining a high copper bin? We expect the results of this paper will permit the development of assignment type disassembly planning models. We identify eight classes of output bins: ferrous metals, nonferrous metals, sources of precious metals, packaging materials, glass and ceramics, plastics, hazardous parts, and paper. Specific bins are discussed in detail. Common sources of these outputs are also discussed, and the relative market value is evaluated.","PeriodicalId":360946,"journal":{"name":"Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357)","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114719576","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 25

Eco-efficiency of take-back systems of electronic products 电子产品回收系统的生态效率

Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357) Pub Date : 1999-05-11 DOI: 10.1109/ISEE.1999.765891

A. Stevels

引用次数: 10

Integrating customer preferences into green design and manufacturing 将客户偏好融入绿色设计和制造

Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357) Pub Date : 1999-05-11 DOI: 10.1109/ISEE.1999.765877

D. Thurston, W. Hoffman

引用次数: 8

Recycling infrastructure for engineering thermoplastics: a supply chain analysis 工程热塑性塑料的回收基础设施:供应链分析

Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357) Pub Date : 1999-05-11 DOI: 10.1109/ISEE.1999.765875

P. Dillon

引用次数: 15

Research plan. CRT recycling 研究计划。CRT回收

Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357) Pub Date : 1999-05-11 DOI: 10.1109/ISEE.1999.765893

G. Voorhees

引用次数: 1

Supply chain environmental assessment of the telecommunications sectors 电讯行业的供应链环境评估

Proceedings of the 1999 IEEE International Symposium on Electronics and the Environment (Cat. No.99CH36357) Pub Date : 1999-05-11 DOI: 10.1109/ISEE.1999.765866

A. Horvath

引用次数: 6