2015 12th China International Forum on Solid State Lighting (SSLCHINA)最新文献

Junction temperature measurement to optimize thermal design of LED arrays 结温测量优化LED阵列热设计

2015 12th China International Forum on Solid State Lighting (SSLCHINA) Pub Date : 2015-12-21 DOI: 10.1109/SSLCHINA.2015.7360687

H. Ye, Hongyu Tang, S. Leung, C. Qian, Xuejun Fan, Guoqi Zhang

引用次数: 4

Recent progress of COB technology and color quality metrics COB技术和色彩质量指标的最新进展

2015 12th China International Forum on Solid State Lighting (SSLCHINA) Pub Date : 2015-12-21 DOI: 10.1109/SSLCHINA.2015.7360682

Jiaping Shao

引用次数: 1

Asymmetric PWM controlled LLCC resonant half bridge dual outputs LED driver 非对称PWM控制的LLCC谐振半桥双输出LED驱动器

2015 12th China International Forum on Solid State Lighting (SSLCHINA) Pub Date : 2015-12-21 DOI: 10.1109/SSLCHINA.2015.7360702

Xinke Wu, Chen Hu, G. Hua

引用次数: 0

Deep considerations on LED package technology 对LED封装技术的深刻思考

2015 12th China International Forum on Solid State Lighting (SSLCHINA) Pub Date : 2015-12-21 DOI: 10.1109/SSLCHINA.2015.7360678

Li Kunzhui, Xu Shaohua, Tang Yuchuang, Weng Xiangze, Wang Yi

{"title":"Deep considerations on LED package technology","authors":"Li Kunzhui, Xu Shaohua, Tang Yuchuang, Weng Xiangze, Wang Yi","doi":"10.1109/SSLCHINA.2015.7360678","DOIUrl":"https://doi.org/10.1109/SSLCHINA.2015.7360678","url":null,"abstract":"This paper focus our attention on the deep considerations for LED package technology. The research includes the following content: (i) the influence of binding force between the chip and substrate, the leakage rate of silver paste conductive adhesive, the failure rate of light emission based on different glue quantities from different companies are studied carefully; (ii) a variety of abnormalities appeared in the process of die bond are demonstrated, and some failure reasons of lighting extracting are analyzed, and the correct processing method for dealing of these abnormalities are suggested; (iii) the influence of the size, abrasiveness, the tear force, and the power of porcelain mouth on package product performance and the quality are discussed; (iv) the influence of phosphor particle size, the amount of anti-settling powder, the viscosity of the fluorescent glue, and the baking conditions on white LED color coordinates and color concentration are analyzed. For same batch of the same chip packaging technology with same device setting parameters, there are still existing a certain bias in lighting output power, color coordinates and color concentration etc. It is found that many key factors are coming from the less consideration for package materials. The uneven distribution of mixing or dispensing phosphors is also a key factor to influence the package quality of SMD and COB light source.","PeriodicalId":331882,"journal":{"name":"2015 12th China International Forum on Solid State Lighting (SSLCHINA)","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126651181","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Towards high reliability GaN LEDs: Understanding the physical origin of gradual and catastrophic failure 迈向高可靠性GaN led:了解渐进和灾难性故障的物理根源

2015 12th China International Forum on Solid State Lighting (SSLCHINA) Pub Date : 2015-12-21 DOI: 10.1109/SSLCHINA.2015.7360690

M. Meneghini, C. de Santi, M. Buffolo, A. Munaretto, G. Meneghesso, E. Zanoni

{"title":"Towards high reliability GaN LEDs: Understanding the physical origin of gradual and catastrophic failure","authors":"M. Meneghini, C. de Santi, M. Buffolo, A. Munaretto, G. Meneghesso, E. Zanoni","doi":"10.1109/SSLCHINA.2015.7360690","DOIUrl":"https://doi.org/10.1109/SSLCHINA.2015.7360690","url":null,"abstract":"This paper reviews the most relevant mechanisms responsible for the gradual and catastrophic failure of InGaN-based light emitting diodes, for application in general lighting. Based on recent results obtained on state-of-the-art LEDs and lamps, we discuss the following: (i) the lifetime of 800 lm retrofit lamps is still limited by the early degradation of the InGaN-LEDs, of the plastic encapsulant/reflectors, and of the driving circuitry. High temperatures and/or poor thermal management can significantly reduce the lifetime of the lamps in real-life applications. (ii) mid-power LEDs, that represent a low-cost widely adopted alternative to power devices, can suffer from both chip and package degradation, that result in a significant decrease in optical power and shift in the chromatic properties. (iii) Electrical overstress (EOS) can result in the sudden failure of power LEDs; failure can be due to the fusion of the bonding wires, to the degradation of the metal lines, or to the cracking of the semiconductor material. The results presented within this paper provide an update on the state-of-the-art of LED reliability.","PeriodicalId":331882,"journal":{"name":"2015 12th China International Forum on Solid State Lighting (SSLCHINA)","volume":"71 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122540506","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Design of LED dimming system with the specific target parameter control function 设计具有特定目标参数控制功能的LED调光系统

2015 12th China International Forum on Solid State Lighting (SSLCHINA) Pub Date : 2015-12-21 DOI: 10.1109/SSLCHINA.2015.7360700

Haoran Li, Zechun Liu, Yaojie Sun, Yandan Lin

引用次数: 1

A subversive innovation on GaN P-type reflective electrode using electroless silver plating 化学镀银GaN p型反射电极的颠覆性创新

2015 12th China International Forum on Solid State Lighting (SSLCHINA) Pub Date : 2015-12-21 DOI: 10.1109/SSLCHINA.2015.7360679

Qinjin Wang, Jun Ma, Teng Zhan, X. Yi, Enqing Guo, Zhiqiang Liu, Ting Wang, Xiansong Fu, Junxi Wang, Guohong Wang, Jinmin Li

{"title":"A subversive innovation on GaN P-type reflective electrode using electroless silver plating","authors":"Qinjin Wang, Jun Ma, Teng Zhan, X. Yi, Enqing Guo, Zhiqiang Liu, Ting Wang, Xiansong Fu, Junxi Wang, Guohong Wang, Jinmin Li","doi":"10.1109/SSLCHINA.2015.7360679","DOIUrl":"https://doi.org/10.1109/SSLCHINA.2015.7360679","url":null,"abstract":"In this work, we first proposed an innovation on GaN p-type reflective electrode in flip-chip LEDs (FCLEDs) using a novel method so called electroless silver plating (ESP). In our ESP method, we use chemical way to form a perfect Ag reflector, differ from traditional fabrication of p-type reflective electrode using electron beam deposition (EB). Under our investigation, the Ag reflective electrode formed by ESP possesses better optical and electric characteristics. Compared with EB, the reflectance of electrode by ESP over the whole visible light spectrum was 93%, higher than EB samples, which only show 82%. Otherwise, ohmic contact characteristic between metal and GaN also shows the same rule as reflectance. ESP samples exhibit better specific contact resistance than EB samples, they're 6.5 * 10-3Ω · cm2 and 6 * 10-2Ω· cm2, respectively. Moreover, the fantastic results of I-V as well as L-I measurement likewise verify electroless silver plating to be a potential manufacturing technology of p-type reflective electrode.","PeriodicalId":331882,"journal":{"name":"2015 12th China International Forum on Solid State Lighting (SSLCHINA)","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126522437","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Development of AlGaN-based deep ultraviolet light-emitting diodes and laser diodes 氮化镓基深紫外发光二极管和激光二极管的研制

2015 12th China International Forum on Solid State Lighting (SSLCHINA) Pub Date : 2015-12-21 DOI: 10.1109/SSLCHINA.2015.7360677

Yanan Guo, Yun Zhang, Junxi Wang, Jianchang Yan, Yingdong Tian, Xiang Chen, Lili Sun, T. Wei, Jinmin Li

引用次数: 0

Glare perception in office lighting with LEDs for different working modes 不同工作模式下led办公照明的眩光感知

2015 12th China International Forum on Solid State Lighting (SSLCHINA) Pub Date : 2015-12-21 DOI: 10.1109/SSLCHINA.2015.7360711

Yanda Chen, Y. Tu, Fan Lu, Lu Liu, Lili Wang

引用次数: 0

A POF based breakdown method for LED lighting color shift reliability 基于POF的LED照明色移可靠性击穿方法

2015 12th China International Forum on Solid State Lighting (SSLCHINA) Pub Date : 2015-12-21 DOI: 10.1109/SSLCHINA.2015.7360689

Guangjun Lu, W. V. van Driel, Xuejun Fan, M. Y. Mehr, Jiajie Fan, C. Qian, G. Zhang

引用次数: 2