Linsong Gao, Jizu Lv, Min-li Bai, Chengzhi Hu, L. Du, Yubai Li
{"title":"Experiment of Enhanced Pool Boiling Heat Transfer on Coupling Effects of Nano-Structure and Synergistic Micro-Channel","authors":"Linsong Gao, Jizu Lv, Min-li Bai, Chengzhi Hu, L. Du, Yubai Li","doi":"10.1115/mnhmt2019-4215","DOIUrl":"https://doi.org/10.1115/mnhmt2019-4215","url":null,"abstract":"\u0000 The manipulation of micro- or nano-structure is a promising method to improve pool boiling heat transfer performance. However, most studies just focus on the micro- or nano-structure without considering the combination micro- and nano-structure. In this paper, we fabricated synergistic microchannel, nano-structure, and micro-nano structure surface on the nickel by different technologies. Pool boiling of DI water under saturated condition was experimentally investigated. Result shows at the wall superheat of 18 K, the heat transfer coefficient of micro-nano structure, nano-structure and synergistic micro-channel surface are 16400, 13050, and 13400 W/m2 K higher 89%, 50%, and 54% than that of smooth surface, respectively. The improved heat transfer is attributed to active nucleation sites and capillary flow.","PeriodicalId":331854,"journal":{"name":"ASME 2019 6th International Conference on Micro/Nanoscale Heat and Mass Transfer","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114892515","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A Lattice Boltzmann Simulation for Thermal Energy Diffusion Through a Micro/Nanoscale Thin Film","authors":"Yan Su","doi":"10.1115/mnhmt2019-3901","DOIUrl":"https://doi.org/10.1115/mnhmt2019-3901","url":null,"abstract":"\u0000 Thermal energy diffusion through two directions of a micro/nanoscale thin film is modeled by a dimensionless form of Boltzmann transport equations of phonon density distribution functions. With the model named a lattice Boltzmann method (LBM), the discrete Boltzmann transport equations are able to be solved directly. The present model applied is based on physic expression of the dimensionless phonon density distribution functions together with both physic based dimensionless relaxation time models and the physic based dimensionless form of boundary conditions. Effects due to the variations of film thickness, distribution of temperature, and phonon transport frequency are all included in the physic based model. Phonon energy and effective thermal conductivity distributions are shown in the two-dimensional (2D) space. The spatial distributions of temperatures and thermal conductivities are validated by comparing with previous studies. Effects of the longitude and transvers direction heat transfer patterns and their effective thermal conductivities under different size and geometry ratios are compared.","PeriodicalId":331854,"journal":{"name":"ASME 2019 6th International Conference on Micro/Nanoscale Heat and Mass Transfer","volume":"57 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125708782","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Ting Liang, Ping Zhang, Peng Yuan, Man Zhou, Siping Zhai
{"title":"Interfacial Thermal Conductance and Thermal Rectification Across In-Plane Graphene/h-BN Heterostructures With Different Bonding Types","authors":"Ting Liang, Ping Zhang, Peng Yuan, Man Zhou, Siping Zhai","doi":"10.1115/mnhmt2019-4159","DOIUrl":"https://doi.org/10.1115/mnhmt2019-4159","url":null,"abstract":"\u0000 The in-plane graphene/hexagonal boron nitride (Gr/h-BN) heterostructures have received extensive attention in recent years due to their excellent physical properties and the development potential of next-generation nanoelectronic devices. Generally, different bonding types between Gr and h-BN are considered in different non-equilibrium molecular dynamics (NEMD) simulations studies. However, which type of bonding is most conducive to interface thermal transport is still very confusing. In this work, we investigate the interfacial thermal conductance (ITC) and the thermal rectification (TR) in five different bonding types of in-plane Gr/h-BN heterostructures by using NEMD simulations. It is found that the ITC depends strongly on the bonding strength and arrangement of different atoms across the boundary. Among the five different bonding types of heterostructures, the C-N bonded heterojunction exhibits the highest ITC due to its stronger interfacial bonding. The analyses on the strain distribution indicated that a low interfacial stress level at the interface junction, may facilitate the heat conduction, thus leading to a higher ITC. In addition, we found that TR occurs in all five bonded heterostructures, and the C-B bonded heterojunction possesses the highest TR factor. The present study is of significance for understanding the thermal transport behavior of Gr/h-BN heterostructures and promoting their future applications in thermal management and thermoelectric devices.","PeriodicalId":331854,"journal":{"name":"ASME 2019 6th International Conference on Micro/Nanoscale Heat and Mass Transfer","volume":"80 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132424629","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Yan Baoyu, Gen Li, H. Cao, Xiaozhong Wang, Zhongcheng Wang, Yulong Ji
{"title":"Experimental Study on the Effect of Interface Heat Transfer on Performance of Thermoelectric Generators","authors":"Yan Baoyu, Gen Li, H. Cao, Xiaozhong Wang, Zhongcheng Wang, Yulong Ji","doi":"10.1115/mnhmt2019-4156","DOIUrl":"https://doi.org/10.1115/mnhmt2019-4156","url":null,"abstract":"\u0000 Thermoelectric generators (TEGs) have attracted more and more attention for their usage in waste heat recovery techniques. A key challenge in thermoelectric power conversion is to create a significant temperature difference across the TEG. The interface heat transfer between heat exchanger and TEGs plays a key role in TEGs’ performance when the heat exchanger and TEGs have been determined. In this paper different thermal interface materials (TIMs) were used to create different interface heat transfer conditions. Firstly, the thermal interface conductance of TIMs is measured by using a steady state method. Then the performance of TEGs at different interface heat transfer condition was evaluated. It was found that interface heat transfer between heat exchanger and TEGs has a significant effects on the performance of TEGs.","PeriodicalId":331854,"journal":{"name":"ASME 2019 6th International Conference on Micro/Nanoscale Heat and Mass Transfer","volume":"128 21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122209348","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Theoretical Analysis for Combined Compact Evaporative Cooler Utilizing Nanostructured Surfaces","authors":"Laith Ismael, Hongbin Ma","doi":"10.1115/mnhmt2019-3902","DOIUrl":"https://doi.org/10.1115/mnhmt2019-3902","url":null,"abstract":"\u0000 A detailed mathematical model is modified that describes heat and mass transfer through Combined Compact Evaporative Cooler CCEC using mono-scale sintered particles coating. The model accounts for the effects of particles size, Reynold’s number, and channel spacing on system performance for certain operating conditions. In this study, a Kelvin-Clapeyron equation is utilized to obtain numerical data for an evaporating meniscus in the wet channels and compared to the plain surface. The results indicate that porous coatings enhanced evaporative heat and mass transfer in the wet channels significantly, compared to the plain wet channels walls, due to wicking water that covers entire heated surfaces.","PeriodicalId":331854,"journal":{"name":"ASME 2019 6th International Conference on Micro/Nanoscale Heat and Mass Transfer","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126076257","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Condensation Droplet Distribution Affected by Electrowetting Approach","authors":"Run-gang Yan, Chung-Lung Chen","doi":"10.1115/mnhmt2019-3982","DOIUrl":"https://doi.org/10.1115/mnhmt2019-3982","url":null,"abstract":"\u0000 This paper presents a visualization of condensation droplet distribution affected by the electrowetting-on-dielectric (EWOD) approach. A single-side double-layer-electrode design (grid wire, thin wire, and thick wire) and coplanar-electrode design (zigzag) are discussed. Side-by-side experiments with applied 40V DC electric potential are carried out to compare droplet distribution between charged and uncharged devices with the identical design. The uncharged devices show a random droplet distribution, whereas charged devices have a regulated distribution based on the designed patterns. As droplets on the electrode boundaries become larger, they are likely to slide away and stay in electrode-free regions. The droplets ‘sit’ inside the grid wires and distribute vertically along thin and thick wires. On the coplanar-electrode zigzag device, droplets cover the electrode gaps and are distributed vertically. The charged surfaces lead to a faster droplet growth rate, resulting in larger droplet size and more dispersed droplet distribution. This phenomenon accelerates droplets’ shedding frequency and frees up more condensing areas for small droplets to nucleate and grow. The first shedding moment of the charged surfaces occurs earlier than the uncharged ones for all types of EWOD devices. The detected droplet shedding diameter ranges from 1.2 mm to 2 mm in this study. The work presented in this paper introduces a novel approach to actively influence droplet distribution on microfabricated condensing surfaces and indicates great potential for improving condensation heat transfer rate via EWOD.","PeriodicalId":331854,"journal":{"name":"ASME 2019 6th International Conference on Micro/Nanoscale Heat and Mass Transfer","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127789693","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Chang Cai, Hong Liu, Xi Xi, M. Jia, Weilong Zhang, Yang He
{"title":"Theoretical Model of Bubble Growth in Superheated Ethanol-Water Mixture","authors":"Chang Cai, Hong Liu, Xi Xi, M. Jia, Weilong Zhang, Yang He","doi":"10.1115/mnhmt2019-3985","DOIUrl":"https://doi.org/10.1115/mnhmt2019-3985","url":null,"abstract":"\u0000 A novel model was developed to investigate the bubble growth characteristics in uniformly superheated ethanol-water (EtOH-H2O) mixture. The influence of the mass fraction of ethanol was discussed in detail. In the proposed model, the energy equation and the component diffusion equation for the liquid were respectively coupled with quadratic temperature and mass fraction distribution within the thermal and concentration boundary layers. The non-random two-liquid equation (NRTL) was adopted to obtain the vapor-liquid equilibrium of the binary mixture at the bubble surface. The comparison between the current calculated bubble radius with the available experimental data demonstrates the accuracy of the bubble growth model. The maximum mass diffusion limited growth rate was also proposed to quantify and illustrate the effect of mass diffusion on bubble growth. The results showed that the later stage of bubble growth in a binary mixture is controlled by both mass diffusion and heat transfer. The bubble growth characteristics strongly depend on the initial mass fraction of ethanol. Within a large concentration range, a higher content of ethanol is adverse to bubble growth at a constant superheat degree. The effect of mass diffusion on bubble growth becomes weaker with an increased initial mass fraction of ethanol.","PeriodicalId":331854,"journal":{"name":"ASME 2019 6th International Conference on Micro/Nanoscale Heat and Mass Transfer","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131771261","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
S. Saini, A. Baranwal, T. Yabuki, S. Hayase, K. Miyazaki
{"title":"Uni-Leg Thermoelectric Module Comprised by Coated Hybrid-Perovskite Thin Film","authors":"S. Saini, A. Baranwal, T. Yabuki, S. Hayase, K. Miyazaki","doi":"10.1115/mnhmt2019-4162","DOIUrl":"https://doi.org/10.1115/mnhmt2019-4162","url":null,"abstract":"\u0000 Thermoelectric materials can convert thermal energy into electrical energy without any moving part which leads its path of application to the era of printed and flexible electronics. CsSnI3 perovskite can be a promising thermoelectric material for the next-generation energy conversion due to its intrinsic ultra-low thermal conductivity and large Seebeck coefficient but enhancement of electrical conductivity is still required. CsSnI3 can be prepared by wet process which can reduce the cost of flexible thermoelectric module.\u0000 In this work, CsSnI3 thin films were fabricated by spin coating wet process. Thin films were structurally and chemically characterized using XRD and SEM. Thermoelectric properties such as electrical conductivity, Seebeck coefficient, and thermal conductivity were measured at 300 K. Uni-leg thermoelectric modules were fabricated on a glass substrate using CsSnI3 thin films. The maximum output is about 0.8 nW for 5 legs (25 mm × 3 mm × 600 nm) modules for the temperature difference of about 5°C. These results will open a new pathway to thermoelectric modules for flexible electronics in spite of low output power.","PeriodicalId":331854,"journal":{"name":"ASME 2019 6th International Conference on Micro/Nanoscale Heat and Mass Transfer","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130310709","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Bo Zhang, Shan Gao, Yunmin Liang, Ji Li, P. Mao, Wei Liu, Zhichun Liu
{"title":"Investigation of the Thermo-Mechanical Property of Knitting 3D Polyethylene: A Comparative Study","authors":"Bo Zhang, Shan Gao, Yunmin Liang, Ji Li, P. Mao, Wei Liu, Zhichun Liu","doi":"10.1115/mnhmt2019-4029","DOIUrl":"https://doi.org/10.1115/mnhmt2019-4029","url":null,"abstract":"\u0000 Polymers have been widely used due to low cost, light weight, chemical inertness and easy of processing. However, bulk polymers are usually considered as thermal insulators owing to their low thermal conductivity. In this paper, the 3D polyethylene (PE) structure based on knitting method is proposed. We investigate the thermo-mechanical property of 3D PE and make a comparison with the amorphous PE. The results show that the 3D PE has a higher thermal conductivity, elastic modulus, and shear modulus than amorphous PE, which provides a novel perspective on designing high thermal conductivity polymers. In the past decades, although the strain effect on the thermal conductivity of PE has been intensively studied, little research has been focused on the impact of shear. In this work, the thermal conductivity of PE under different shear strain is calculated by molecular dynamics simulation. Unexpectedly, the impact of shear on the amorphous PE and 3D PE is different. For amorphous PE, the average thermal conductivity is insensitive to the shear strain. However, the thermal conductivity of 3D PE can be slightly enhanced when the shear strain is large enough. The underlying mechanism is related to the specific morphology. Our findings can deliver new insights on designing high thermal conductive polymers.","PeriodicalId":331854,"journal":{"name":"ASME 2019 6th International Conference on Micro/Nanoscale Heat and Mass Transfer","volume":"155 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123445163","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Chunrong Yu, Yulong Ji, L. Chu, Zongyu Wang, Yadong Li, Hongbin Ma
{"title":"The Phenomenon of Unidirectional Circulating Flow in an Oscillating Heat Pipe","authors":"Chunrong Yu, Yulong Ji, L. Chu, Zongyu Wang, Yadong Li, Hongbin Ma","doi":"10.1115/mnhmt2019-3937","DOIUrl":"https://doi.org/10.1115/mnhmt2019-3937","url":null,"abstract":"\u0000 The phenomena of two different types of unidirectional circulating flow pattern in a copper oscillating heat pipe (OHP) were firstly discovered and investigated. The OHP has six turns and three sections: evaporator, condenser and adiabatic sections with lengths of 40 mm, 64 mm, and 51 mm, respectively. R152a was used as the working fluid, the effects of the tilt angle from 0° to 90° and the heat input on the flow and heat transfer of the working fluid in OHP was studied. The experimental results showed that (1) the OHP charged with R152a can form a unidirectional circulating flow at any tilt angle under certain heat input, and the unidirectional circulating flow become steady as the heat input increases; (2) another type of circulating flow was found in the same OHP as the heat input increased to a relative high level, the difference between the two types of circulating flow is that the liquid slugs move forward with or without back forward oscillating movement; (3) the unidirectional circulating flow of the working fluid without back forward oscillating movement in the OHP significantly enhance the heat transfer of OHP.","PeriodicalId":331854,"journal":{"name":"ASME 2019 6th International Conference on Micro/Nanoscale Heat and Mass Transfer","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123716132","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}