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2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity最新文献

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Efficient multi-parametric uncertainty quantification methods for EMC/EMI applications 电磁兼容/电磁干扰应用中的高效多参数不确定度量化方法
2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity Pub Date : 2015-03-15 DOI: 10.1109/EMCSI.2015.7107715
Zixi Gu, Xingqi Zhang, N. Sood, C. Sarris
{"title":"Efficient multi-parametric uncertainty quantification methods for EMC/EMI applications","authors":"Zixi Gu, Xingqi Zhang, N. Sood, C. Sarris","doi":"10.1109/EMCSI.2015.7107715","DOIUrl":"https://doi.org/10.1109/EMCSI.2015.7107715","url":null,"abstract":"For years, statistical uncertainty in high-frequency circuits had been analyzed by post-processing data from repetitive simulations. Not surprisingly, this approach is extremely time consuming and hardly within the time constraints of a typical engineering design cycle. Recently, several new computational algorithms have been presented, which offer a fresh perspective to this old problem. This paper emphasizes approaches that stem from the polynomial chaos expansion method along with promising hybrid methods that can lead to efficient multi-parametric uncertainty quantification solvers.","PeriodicalId":329933,"journal":{"name":"2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124052743","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
On-chip linear voltage regulator module (VRM) effect on power distribution network (PDN) noise and jitter at high-speed output buffer 片上线性稳压模块(VRM)对配电网络(PDN)高速输出缓冲器噪声和抖动的影响
2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity Pub Date : 2015-03-15 DOI: 10.1109/EMCSI.2015.7107653
Heegon Kim, Sukjin Kim, Joungho Kim, Jingook Kim, C. Yoon, B. Achkir, J. Fan
{"title":"On-chip linear voltage regulator module (VRM) effect on power distribution network (PDN) noise and jitter at high-speed output buffer","authors":"Heegon Kim, Sukjin Kim, Joungho Kim, Jingook Kim, C. Yoon, B. Achkir, J. Fan","doi":"10.1109/EMCSI.2015.7107653","DOIUrl":"https://doi.org/10.1109/EMCSI.2015.7107653","url":null,"abstract":"In this paper, the reduction of power distribution network noise and jitter at high-speed output buffer by using on-chip linear voltage regulator module circuit is introduced and analyzed. The transient response of typical on-chip linear VRM circuit is analyzed in power gating condition. When the on-chip linear VRM circuit is inserted between on-chip PDN and operating high-speed output buffers, the on-chip PDN noise and jitter at output buffer are significantly reduced. The larger on-chip decoupling capacitor leads to the lower PDN noise generated by on-chip linear VRM circuit. The on-chip linear VRM also reduces the impact of the aggressor buffer to the victim buffer in different PDN, resulting in the improved performance of the victim buffer. Reduction of PDN noise and jitter at output buffer using on-chip linear VRM are validated based on SPICE simulation with 110 nm CMOS technology library.","PeriodicalId":329933,"journal":{"name":"2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131007191","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Reconstruction of currents from EMC near-field measurements by means of continuity equation constraints 用连续性方程约束重构电磁兼容近场测量电流
2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity Pub Date : 2015-03-15 DOI: 10.1109/EMCSI.2015.7107677
Martin Schmidt, M. Albach
{"title":"Reconstruction of currents from EMC near-field measurements by means of continuity equation constraints","authors":"Martin Schmidt, M. Albach","doi":"10.1109/EMCSI.2015.7107677","DOIUrl":"https://doi.org/10.1109/EMCSI.2015.7107677","url":null,"abstract":"Electromagnetic compatibility (EMC) is a challenging task in electrical engineering. Near-field scanning provides an insight into the physical behavior of circuits and thus allows understanding the problems. Therefore, near-field scanning enables a well-directed optimization regarding EMC in electronic systems. However, it is a thorough task to gain valuable information from the measured probe signals. One of this valuable information is the distribution of currents in printed circuit boards. In context of EMC, even small current amplitudes are critical. So, the sensitivity of the probe is decisive and due to that there is a lower limit for the probe size. However, the fields across bigger probes are not homogenous and probe compensation is necessary. Additionally, it is advantageous to gain more information by the use of probes with multiple outputs. The usual way to reconstruct the current distribution is a two-step approach with the determination of the electromagnetic fields in an intermediate step. Here, a method for directly mapping dipole sources is analyzed in the context of probes with multiple outputs and simple microstrip devices under test. Parameter studies regarding the number and positions of the dipoles are carried out. Furthermore, the technique requires some a priori information. We propose using a discrete form of the continuity equation as a constraint. By this constraint a significant improvement is achieved.","PeriodicalId":329933,"journal":{"name":"2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132850672","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
A planar low-profile meander antenna design for wireless terminal achieving low self-interference 一种用于无线终端的平面低轮廓弯曲天线设计，实现了低自干扰
2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity Pub Date : 2015-03-15 DOI: 10.1109/EMCSI.2015.7107707
Y. Qi, J. Fan, Ye-Hai Bi, Wei Yu, J. Drewniak
{"title":"A planar low-profile meander antenna design for wireless terminal achieving low self-interference","authors":"Y. Qi, J. Fan, Ye-Hai Bi, Wei Yu, J. Drewniak","doi":"10.1109/EMCSI.2015.7107707","DOIUrl":"https://doi.org/10.1109/EMCSI.2015.7107707","url":null,"abstract":"In this paper, a new internal antenna used for wireless terminal is proposed. The current of this antenna is mostly distributed on the antenna radiator itself, rather than on the main board of the wireless device. As a result, the chance of having self-interference issues, which usually result in receiver desensitization in wireless radios, can be significantly reduced. The antenna has better radiation performance in the vertical polarization with a low profile, and the average gain of this antenna is good as well. Both simulation and measurement results demonstrate the proposed design.","PeriodicalId":329933,"journal":{"name":"2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity","volume":"69 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133077245","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Studying the effect of drilling uncertainty on signal propagation through vias 研究钻井不确定性对信号通过通孔传播的影响
2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity Pub Date : 2015-03-15 DOI: 10.1109/EMCSI.2015.7107716
Yansheng Wang, Srinath Penugonda, Yaojiang Zhang, Ji Chen, J. Fan
{"title":"Studying the effect of drilling uncertainty on signal propagation through vias","authors":"Yansheng Wang, Srinath Penugonda, Yaojiang Zhang, Ji Chen, J. Fan","doi":"10.1109/EMCSI.2015.7107716","DOIUrl":"https://doi.org/10.1109/EMCSI.2015.7107716","url":null,"abstract":"A differential via structure with four varying factors are defined in this paper. The Monte Carlo (MC), stochastic collocation (SC) and design of experiments (DoE) methods are employed to quantify the drilling uncertainties in the abovementioned via structure. A comparison of the results shows that the SC method is more robust and can more efficiently and accurately estimate the mean and the standard deviation of the responses, compared to the DoE method.","PeriodicalId":329933,"journal":{"name":"2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133363728","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
A polynomial chaos approach for EM uncertainty propagation in 3D-FDTD magnetized cold plasma 三维时域有限差分磁化冷等离子体中电磁不确定性传播的多项式混沌方法
2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity Pub Date : 2015-03-15 DOI: 10.1109/EMCSI.2015.7107714
B. T. Nguyen, A. Samimi, J. Simpson
{"title":"A polynomial chaos approach for EM uncertainty propagation in 3D-FDTD magnetized cold plasma","authors":"B. T. Nguyen, A. Samimi, J. Simpson","doi":"10.1109/EMCSI.2015.7107714","DOIUrl":"https://doi.org/10.1109/EMCSI.2015.7107714","url":null,"abstract":"The polynomial chaos-based stochastic Galerkin method is implemented in a magnetized plasma finite-difference time-domain (FDTD) algorithm to characterize the uncertainty characteristics of electromagnetic wave propagation in the ionosphere. This new algorithm efficiently calculates in a single simulation not only the mean electromagnetic field values, but also their standard deviation as caused by the variability or uncertainty of the content of the ionosphere. This approach represents a paradigm shift in our ability to analyze realistic, complex wave propagation in the ionosphere. The algorithm is validated by comparing with Monte Carlo results.","PeriodicalId":329933,"journal":{"name":"2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124084342","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
An improved multiple edge responses method for memory simulation considering worst case and nonlinear crosstalk 考虑最坏情况和非线性串扰的内存仿真多边响应改进方法
2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity Pub Date : 2015-03-15 DOI: 10.1109/EMCSI.2015.7107674
S. Pan, J. Qian
{"title":"An improved multiple edge responses method for memory simulation considering worst case and nonlinear crosstalk","authors":"S. Pan, J. Qian","doi":"10.1109/EMCSI.2015.7107674","DOIUrl":"https://doi.org/10.1109/EMCSI.2015.7107674","url":null,"abstract":"Although multiple edge responses method has been proven effective to capture the input and output nonlinearity in a channel simulation, the method may not be applicable for memory simulation due to the nonlinear crosstalk effect and also the requirement of a massive number of step responses, which significantly reduces the simulation efficiency. In this work, we present an improved simulation methodology involving multiple edge responses to accurately estimate the worst-case eye diagram, specifically applicable for memory simulation. The proposed method is able to capture the nonlinearity effect due to crosstalk, plus has nearly 20 times simulation acceleration compared with the traditional long random input bit pattern simulation, based on a multiple processors system.","PeriodicalId":329933,"journal":{"name":"2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity","volume":"243 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124297266","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Measuring a device's susceptibility to LTE: Preliminary approaches 测量设备对LTE的敏感性:初步方法
2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity Pub Date : 2015-03-15 DOI: 10.1109/EMCSI.2015.7107660
J. Coder, J. Ladbury, W. Young
{"title":"Measuring a device's susceptibility to LTE: Preliminary approaches","authors":"J. Coder, J. Ladbury, W. Young","doi":"10.1109/EMCSI.2015.7107660","DOIUrl":"https://doi.org/10.1109/EMCSI.2015.7107660","url":null,"abstract":"Previous testing has shown that measuring a device's susceptibility to a radiated, broadband signal can present a different set of challenges than those faced when testing with a narrow-band signal. Decisions ranging from choosing a measurement facility to defining the measurement of the radiated electric field to defining when a DUT has failed can all have an impact on the final test results. In previous publications we've outlined these challenges via the use of experiments involving cable communications equipment and its susceptibility (or lack thereof) to radiated LTE signals. Here, we continue with those experiments, but shift the focus to proposing solutions to these questions. We discuss these solutions in a general sense, with hopes that they will encourage discussion in the community.","PeriodicalId":329933,"journal":{"name":"2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity","volume":"165 3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127538351","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Real-time programmable VR for power delivery efficiency enhancement 实时可编程VR电力输送效率的提高
2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity Pub Date : 2015-03-15 DOI: 10.1109/EMCSI.2015.7107712
Wei Shen, Weixia Liang, H. Hu
{"title":"Real-time programmable VR for power delivery efficiency enhancement","authors":"Wei Shen, Weixia Liang, H. Hu","doi":"10.1109/EMCSI.2015.7107712","DOIUrl":"https://doi.org/10.1109/EMCSI.2015.7107712","url":null,"abstract":"The typical VR for server CPU or memory is multi-phase with constant switching frequency and drive voltage. This only provides the best VR efficiency in certain load ranges. In this paper, we will introduce a new VR technology. This technology attempts to enhance the VR power efficiency and reduce the power loss through programming the digital VR with different VR factors (phase counts, switching frequencies and drive voltages) when the CPU and memory load varies. The efficiency improvement and power savings of the new technology were tested on one server board. Using this methodology, over 7.2W of CPU VR power loss was saved when the board operates under certain load conditions.","PeriodicalId":329933,"journal":{"name":"2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity","volume":"06 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127201288","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Design of package BGA pin-out for >25Gb/s high speed SerDes considering PCB via crosstalk 考虑串扰的>25Gb/s高速串行电路封装BGA引脚设计
2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity Pub Date : 2015-03-15 DOI: 10.1109/EMCSI.2015.7107669
Wei Yao, Jane Lim, Ji Zhang, Kenneth H. Tseng, K. Qiu, R. Brooks
{"title":"Design of package BGA pin-out for >25Gb/s high speed SerDes considering PCB via crosstalk","authors":"Wei Yao, Jane Lim, Ji Zhang, Kenneth H. Tseng, K. Qiu, R. Brooks","doi":"10.1109/EMCSI.2015.7107669","DOIUrl":"https://doi.org/10.1109/EMCSI.2015.7107669","url":null,"abstract":"Fast growing bandwidth demands for networking and data center applications continuously face difficult signal integrity challenges. Among them, serializer/deserializer (SerDes) package pin-out and its corresponding printed circuit board (PCB) via crosstalk have become a significant source of high jitter and limit the performance of high speed serial links. In this paper, a variety of far-end crosstalk (FEXT) and near-end crosstalk (NEXT) SerDes pin-out patterns are designed and investigated to explore the crosstalk performance for interfaces running 25Gb/s and beyond. The impact of PCB routing layer selection and via stub are also considered. Both frequency domain and time domain analysis are studied based on 3-dimensional (3D) full wave electromagnetic (EM) simulation, and the results are compared along with the calculated integrated crosstalk noise (ICN) to find the pattern with better signal isolation. A PCB test vehicle is designed and manufactured to provide measurement and verification results by using broadband micro-probes and multi-port vector network analyzer (VNA). The optimized pin-out is then selected to evaluate the overall link performance based on the input/output buffer information specification algorithmic modeling interface (IBIS-AMI) model from silicon vendors.","PeriodicalId":329933,"journal":{"name":"2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130679889","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
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