2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)最新文献

Computer simulation of the reliability of wire bonds and ribbon bonds in power electronics modules 电力电子模块中线键和带键可靠性的计算机模拟

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2017-12-25 DOI: 10.1109/THERMINIC.2017.8233827

K. Nwanoro, Hua Lu, C. Yin, C. Bailey

引用次数: 4

Nanoscale thermal imaging of active devices by fluorescent SThM 有源器件的荧光SThM纳米热成像

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2017-12-25 DOI: 10.1109/THERMINIC.2017.8233839

H. J. Lin, A. Assy, E. Lemaire, D. Briand, L. Billot, P. Gredin, M. Mortier, Z. Chen, L. Aigouy

引用次数: 1

Thermopower characterization of InSb nanowires using thermoreflectance 利用热反射率表征InSb纳米线的热功率

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2017-12-21 DOI: 10.1109/THERMINIC.2017.8233802

R. Chavez, D. Vakulov, S. Gazibegović, D. Car, D. Kendig, A. Tay, A. Shakouri, E. Bakkers

{"title":"Thermopower characterization of InSb nanowires using thermoreflectance","authors":"R. Chavez, D. Vakulov, S. Gazibegović, D. Car, D. Kendig, A. Tay, A. Shakouri, E. Bakkers","doi":"10.1109/THERMINIC.2017.8233802","DOIUrl":"https://doi.org/10.1109/THERMINIC.2017.8233802","url":null,"abstract":"Increasing energy demand and depleting fossil fuels make it imperative to shift to more efficient energy sources. Thermoelectric materials can convert waste heat into electrical energy by means of the Thermopower or Seebeck effect. Nanowires are promising candidates to increase the efficiency of thermo-electric conversion because their low dimensionality is predicted to increase the Seebeck effect due to confinement of charge carriers and decrease thermal conductivity due to boundary scattering of phonons. The Seebeck effect is characterized by the Seebeck coefficient which describes the output voltage per degree Kelvin in a thermoelectric material. Hence, in order to obtain the Seebeck coefficient, it is crucial to accurately measure the temperature difference along the axial direction of the nanowire which has a length of a few micrometers, at the locations where voltage measurements are performed under a temperature gradient. Here we demonstrate an application of thermoreflectance to measure the temperature difference along the nanowire allowing bi-directional measurements of Seebeck coefficient.","PeriodicalId":317847,"journal":{"name":"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-12-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114536180","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

An experimental study towards the practical application of closed-loop flat-plate pulsating heat pipes 闭环平板脉动热管实际应用的实验研究

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2017-12-21 DOI: 10.1109/THERMINIC.2017.8233789

G. Groeneveld, H. V. van Gerner, W. Wits

引用次数: 2

Delphi4LED: LED measurements and variability analysis Delphi4LED: LED测量和可变性分析

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2017-12-21 DOI: 10.1109/THERMINIC.2017.8233797

Josephine Sari, T. Mérelle, A. Di Bucchianico, D. Breton

引用次数: 5

An investigation of porous structure characteristics of heat pipes made by additive manufacturing 增材制造热管多孔结构特性研究

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2017-12-21 DOI: 10.1109/THERMINIC.2017.8233841

D. Jafari, W. Wits, B. Geurts

{"title":"An investigation of porous structure characteristics of heat pipes made by additive manufacturing","authors":"D. Jafari, W. Wits, B. Geurts","doi":"10.1109/THERMINIC.2017.8233841","DOIUrl":"https://doi.org/10.1109/THERMINIC.2017.8233841","url":null,"abstract":"Specific properties of porous media such as thermal conductivity and wicking of liquid into the porous structure are of great importance to many applications. Typically, such porous structures are found in two-phase devices, such as heat pipes (HPs). In this study, we have experimentally analysed the effective thermal conductivity and the wicking of different liquids into a stainless steel 316L porous structure fabricated through selective laser melting (SLM) technology. The sample was rectangular shaped with a porosity of 46.5% and outer dimensions of 20×40×1 mm3. An experimental apparatus and related procedures for the determination of the effective thermal conductivity of the porous structure saturated with distilled water and Ethylene glycol are discussed. The experimentally measured values of effective thermal conductivity are compared with correlations available in the literature. The standard Washburn wicking model is taken into account for the analysis. We describe the application of the Washburn equation to measure the contact angle of a printed porous sample with three test liquids; n-Hexane, water and Ethylene glycol are used to measure contact angles. The experimental results verify that SLM technology can be used to fabricate porous structures for HP technology. The results show an effective thermal conductivity in the range of 1.8–6.0 W/mK for different working fluids.","PeriodicalId":317847,"journal":{"name":"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"69 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-12-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133569756","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 14

A multi-objective genetic algorithm optimisation of plate-fin heatsinks 板翅片散热器的多目标遗传算法优化

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2017-09-01 DOI: 10.1109/THERMINIC.2017.8233784

Younis Osama Abdelsalam, S. Alimohammadi, Quentin Pelletier, T. Persoons

引用次数: 4

An investigation of component interaction and analysis of its impact on electro-thermal behaviour in a power dense boost converter topology 功率密集升压变换器拓扑结构中元件相互作用及其对电热行为影响的研究

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2017-09-01 DOI: 10.1109/THERMINIC.2017.8233844

M. Shahjalal, H. Lu, C. Bailey

引用次数: 0

Study on the temperature-dependent thermal resistance matrix of a multi-chip LED-matrix 多芯片led矩阵温度相关热阻矩阵的研究

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2017-09-01 DOI: 10.1109/THERMINIC.2017.8233842

L. Mitterhuber, S. Defregger, J. Magnien, J. Rose, F. Schrank, Stefan Hörth, L. Goullon, M. Hutter, E. Kraker

{"title":"Study on the temperature-dependent thermal resistance matrix of a multi-chip LED-matrix","authors":"L. Mitterhuber, S. Defregger, J. Magnien, J. Rose, F. Schrank, Stefan Hörth, L. Goullon, M. Hutter, E. Kraker","doi":"10.1109/THERMINIC.2017.8233842","DOIUrl":"https://doi.org/10.1109/THERMINIC.2017.8233842","url":null,"abstract":"The solid lighting industry comply with costumer's requirements of high light output and a higher grade of functionality, especially in the automotive sector. The integration of multiple LED-chips on one illuminant has the advantage of weight and size reduction. However, multiple LED-chips lead to increased power density; to get rid of their produced heat, an energy strategy is necessary. The key term is Thermal Management, to understand the thermal behavior of a LED lighting system. In this paper, the investigation of the thermal interdependencies of a 4-chip-matrix was presented. The thermal characterization was done by thermal transient measurements of each chip and their structure functions, followed by the study of its thermal resistance (Rth) matrix. The Rth-matrix represented the thermal properties of each LED-chip and its interdependency. As supplement of the thermal characterization, thermal simulations were carried out. Moreover, the Rth-matrix was used to analyze the LED-matrix in terms of their temperature dependency. The heat path investigation via Rth-matrix showed different behaviors of the 4-chip-matrix by using different heat sink temperatures. The method was used as an evaluation tool for thermal management of LED-matrix systems.","PeriodicalId":317847,"journal":{"name":"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115353502","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Fast electro-thermal simulation of large area OLEDs in natural convection environment 自然对流环境下大面积oled的快速电热模拟

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2017-09-01 DOI: 10.1109/THERMINIC.2017.8233821

L. Pohl, Z. Kohári, A. Poppe

{"title":"Fast electro-thermal simulation of large area OLEDs in natural convection environment","authors":"L. Pohl, Z. Kohári, A. Poppe","doi":"10.1109/THERMINIC.2017.8233821","DOIUrl":"https://doi.org/10.1109/THERMINIC.2017.8233821","url":null,"abstract":"Organic LEDs can be used not only in displays but also in intelligent light sources. Unlike inorganic LEDs, OLEDs do not function as point-like but as surface light sources since manufacturing of large area light sources is more feasible with OLED technologies. Despite their lower luminous efficacy this makes OLEDs still an attractive option especially in high end indoor applications, The major issue in such applications is the homegenity of the luminance of the large OLED panels. In natural convection environment the temperature difference in the same device can reach 20–30°C which can result in up to 30–40% difference in current density and thus in the luminance. CFD simulation is the obvious way to handle this problem but integration of a CFD solver in an OLED simulator may be difficult and the solution times are high. This paper presents the application of three natural convection models for vertical plates in an electro-thermal field solver based OLED simulator as thermal boundary condition. Simulation results of a free-standing 50∗50 mm2 active surface OLED, surrounded by still air, are compared with measurement results.","PeriodicalId":317847,"journal":{"name":"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116569441","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1