2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

Computer simulation of the reliability of wire bonds and ribbon bonds in power electronics modules

Pub Date : 2017-12-25 DOI: 10.1109/THERMINIC.2017.8233827 K. Nwanoro, Hua Lu, C. Yin, C. Bailey

Nanoscale thermal imaging of active devices by fluorescent SThM

Pub Date : 2017-12-25 DOI: 10.1109/THERMINIC.2017.8233839 H. J. Lin, A. Assy, E. Lemaire, D. Briand, L. Billot, P. Gredin, M. Mortier, Z. Chen, L. Aigouy

Thermopower characterization of InSb nanowires using thermoreflectance

Pub Date : 2017-12-21 DOI: 10.1109/THERMINIC.2017.8233802 R. Chavez, D. Vakulov, S. Gazibegović, D. Car, D. Kendig, A. Tay, A. Shakouri, E. Bakkers