{"title":"Book review: Delta-Sigma data converters","authors":"I. Galton, R. Schreier, G. Temes","doi":"10.1109/N-SSC.2005.6500102","DOIUrl":"https://doi.org/10.1109/N-SSC.2005.6500102","url":null,"abstract":"High-performance analog-to-digital converters (ADCs) and digital-to-analog converters (DACs) based on delta-sigma modulation — collectively referred to as delta-sigma data converters — are enabling components in consumer communications and entertainment products including cellular telephones, wireless LANs, modems, mp3 players, and AM/FM radios. They also represent an active area of research and innovation, driven by the ever-increasing performance demands of the consumer electronics marketplace, and the analog circuit design challenges imposed by the continued scaling of CMOS circuit technology. For example, in IEEE circuits conferences and journals alone, there have been over 1500 papers on the subject since 1962","PeriodicalId":307605,"journal":{"name":"IEEE Solid-State Circuits Society Newsletter","volume":"79 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129845859","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Symposium on VLSI circuits meets in June","authors":"W. Lee","doi":"10.1109/N-SSC.2005.6500085","DOIUrl":"https://doi.org/10.1109/N-SSC.2005.6500085","url":null,"abstract":"The International Symposium on VLSI Circuits will be held on June 16–18th, 2005 at the Rihga Royal Hotel, Kyoto, Japan. The Symposium consists of three days of technical presentations and informal evening rump sessions on VLSI circuit design. Following tradition, the Symposium on VLSI Circuits will follow the Symposium on VLSI Technology at the same location.","PeriodicalId":307605,"journal":{"name":"IEEE Solid-State Circuits Society Newsletter","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116344968","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Wireless Wednesday at DAC","authors":"I. Verbauwhede","doi":"10.1109/N-SSC.2005.6500095","DOIUrl":"https://doi.org/10.1109/N-SSC.2005.6500095","url":null,"abstract":"A complete wireless system is a very complex design problem. It requires designers from very different backgrounds. The communication engineer needs to figure out the wireless system performance, and will run lots of simulations in Matlab or Simulink to get the bit error rate (BER) that he or she needs. The team will also need a MAC designer who is willing to dig into the standards and implement the MAC protocols with minimum resources and within the latency and throughput requirements. The hardware or digital designer will develop the building blocks to implement the next generation LDPC coder or Turbo accelerator. The analog and RF designers are probably in a different department worrying about getting the power amplifiers, LNAs, D/As and A/Ds operating at 1V and with a minimal power budget. Then there is the poor system designer that needs to figure out how all the modules communicate, can be integrated and tested.","PeriodicalId":307605,"journal":{"name":"IEEE Solid-State Circuits Society Newsletter","volume":"91 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131234603","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Chapters report","authors":"A. Loke, Tin Tin Wee","doi":"10.1109/n-ssc.2005.6500089","DOIUrl":"https://doi.org/10.1109/n-ssc.2005.6500089","url":null,"abstract":"In the past four months, the SSCS Denver Chapter hosted meetings spanning technology, device, reliability, and design topics. In December 2004, newly elected chapter chair Dr. Alvin Loke of Agilent Technologies presented a tutorial on deep submicron CMOS device technology and its impact on circuit design. Dr. Loke summarized the importance of understanding the impact of effects such as halo implants, active area mechanical stress, and well implant mask proximity as well as limitations in IC manufacturing to successfully design analog circuits in deep submicron CMOS.","PeriodicalId":307605,"journal":{"name":"IEEE Solid-State Circuits Society Newsletter","volume":"61 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130156955","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"ISSCC — The later years","authors":"D. Pricer","doi":"10.1109/ISSCC.2003.1264026","DOIUrl":"https://doi.org/10.1109/ISSCC.2003.1264026","url":null,"abstract":"In the first 35 years of the ISSCC conference, the technical program grew from 18 papers to about 90, while maintaining the strictest standards for paper acceptance. The evening hours were filled with panel discussions; the more controversial, the better. An attendee could expect an experience that was Spartan, intense, and just two days long. In the last 15 years, ISSCC gradually added new features.","PeriodicalId":307605,"journal":{"name":"IEEE Solid-State Circuits Society Newsletter","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-02-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129135723","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"The process of choice for wireless, Bipolar/BiCMOS convenes in Monterey, California","authors":"C. McAndrew","doi":"10.1109/N-SSC.2002.6499896","DOIUrl":"https://doi.org/10.1109/N-SSC.2002.6499896","url":null,"abstract":"Wireless communications is a burgeoning market and a major driver behind the semiconductor industry, and SiGe BiCMOS and III-V technologies have emerged as the manufacturing processes of choice for many wireless ICs. If you work in or are interested in this exciting area, then the IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM) is a conference you will want to attend, scheduled 29 September–1 October 2002.","PeriodicalId":307605,"journal":{"name":"IEEE Solid-State Circuits Society Newsletter","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125002554","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"European Solid-State Circuits conference to be held jointly with devices conference","authors":"A. Baschirotto, R. Castello","doi":"10.1109/N-SSC.2002.6499901","DOIUrl":"https://doi.org/10.1109/N-SSC.2002.6499901","url":null,"abstract":"The 29th European Solid-State Circuits Conference (ESSCIRC 2002), organized by the University of Pavia, will be held 24–26 September 2002 in Florence, Italy.","PeriodicalId":307605,"journal":{"name":"IEEE Solid-State Circuits Society Newsletter","volume":"195 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115651160","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Free how-to guide for course design available","authors":"Lynn Murison","doi":"10.1109/N-SSC.2002.6499837","DOIUrl":"https://doi.org/10.1109/N-SSC.2002.6499837","url":null,"abstract":"Available free from the Educational Activities Board (EAB) is the Telcordia Technologies' Reference Guide for Instructional Design and Development. This online-only, how-to guide teaches efficient and effective course and tutorial design. The guide explains how to add educational value to your tutorials and courses, which can qualify them for Continuing Education Units.","PeriodicalId":307605,"journal":{"name":"IEEE Solid-State Circuits Society Newsletter","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127684882","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"West Ukraine Chapter activities","authors":"M. Andriychuk","doi":"10.1109/N-SSC.2001.6499806","DOIUrl":"https://doi.org/10.1109/N-SSC.2001.6499806","url":null,"abstract":"The West Ukraine Chapter in Lviv has sponsored two student technical conferences and one technical meeting this year, supporting the leadership of faculty and students at two academic institutions.","PeriodicalId":307605,"journal":{"name":"IEEE Solid-State Circuits Society Newsletter","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115546881","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Profile of the IEEE SSCS Greece Chapter","authors":"Thanos Skodras","doi":"10.1109/N-SSC.2001.6499805","DOIUrl":"https://doi.org/10.1109/N-SSC.2001.6499805","url":null,"abstract":"The SSCS Greece Chapter has provided a plethora of activities during its first year of operation: seven lectures by engineers from the industry, one workshop, one career event, and one Distinguished Lecture (DL). All of the activities were very useful and well attended. The audience of the lectures was mainly from the University of Patras (faculty and students), while that of the Distinguished Lecture was from nearby companies. The University hosted all the Chapter events, except the Distinguished Lecture, which was hosted by the Patras Science Park, the local incubator of hightech startups. The Chapter is grateful for the cooperation of the University and the Science Park for hosting these events. It is worth pointing out that the Chapter has helped bridge the gap between academia and industry by providing a bi-directional link for the flow of knowledge.","PeriodicalId":307605,"journal":{"name":"IEEE Solid-State Circuits Society Newsletter","volume":"74 5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127734389","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}