2021 44th International Spring Seminar on Electronics Technology (ISSE)最新文献

Improvement of CuO Thin Film Properties for High Mobility p-Channel TFT Applications 高迁移率p沟道TFT应用中CuO薄膜性能的改进

2021 44th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2021-05-05 DOI: 10.1109/ISSE51996.2021.9467529

Viswanath G. Akkili, R. Thangavel, V. Srivastava

引用次数: 2

Influence of Added Phosphorus and Gallium in Lead-free Bismuth-Tin Alloys on Wetting and Intermetallic Compounds 无铅铋锡合金中添加磷和镓对润湿和金属间化合物的影响

2021 44th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2021-05-05 DOI: 10.1109/ISSE51996.2021.9467660

I. Králová, Anna Kadlecová, P. Veselý, K. Dušek

{"title":"Influence of Added Phosphorus and Gallium in Lead-free Bismuth-Tin Alloys on Wetting and Intermetallic Compounds","authors":"I. Králová, Anna Kadlecová, P. Veselý, K. Dušek","doi":"10.1109/ISSE51996.2021.9467660","DOIUrl":"https://doi.org/10.1109/ISSE51996.2021.9467660","url":null,"abstract":"The aim of this work is to evaluate a wettability improvement and microstructure changes by addition of gallium and trace elements of phosphorus to novel low-temperature lead-free Bi-Sn solder alloys. Four different alloys Bi59Sn40Ga1, Bi57Sn40Ga3, Bi60Sn40 and the eutectic alloy Bi58Sn42 were chosen. Furthermore, all these solders were investigated with an added small amount of phosphorus as well. For the wettability comparison, the wetting balance test in combination with three different fluxes was used. Moreover, these alloys were soldered to a copper plated test board and aged in a climatic chamber at the temperature of 80 °C for 24 days. Subsequently, metallographic cross-sections were made and analyzed by scanning electron microscope (SEM) and energy dispersive X-ray analysis (EDX). The results of the wettability analysis showed the dominance of the chosen flux while soldering. However, it is still possible to draw the conclusion that phosphorus as an additive in Bi-Sn-Ga alloys supports the wetting, which is a crucial property of the solders. On the other hand, by the addition of gallium to the Bi60Sn40, the wetting force decreased. Regarding the microstructure, two different intermetallic compounds were identified. Namely, Cu6Sn5 at the interface between Cu board and alloys Bi60Sn40P and the eutectic one Bi58Sn42. The second detected IMC was CuGa2 between Cu and solder alloys with one and three weight percent of added gallium.","PeriodicalId":303255,"journal":{"name":"2021 44th International Spring Seminar on Electronics Technology (ISSE)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-05-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126609988","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Ag-based Thermal Interface Materials for GaN-on-Si Assembly Chips in Power Applications 电源应用中硅上氮化镓组装芯片的银基热界面材料

2021 44th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2021-05-05 DOI: 10.1109/ISSE51996.2021.9467637

R. Kisiel, P. Śpiewak, M. Kruszewski

引用次数: 2

Investigation of π Stacking Functionalization of Carbon Allotropes for RH Sensing RH传感用碳同素异形体的π堆叠功能化研究

2021 44th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2021-05-05 DOI: 10.1109/ISSE51996.2021.9467585

Karel Šíma, J. Štulík, Josef Slauf, T. Blecha, A. Hamácek

引用次数: 0

Early-Stage Control of Oxygen Sensors for ICE Engines Using Digital Adaptive Filtering 基于数字自适应滤波的内燃机氧传感器早期控制

2021 44th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2021-05-05 DOI: 10.1109/ISSE51996.2021.9467513

Lucian Andrei Perișoară, Irina Bristena Bacîș

引用次数: 0

Navigating Multi-Rate, Electrothermal Simulation Constraints 导航多速率，电热模拟约束

2021 44th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2021-05-05 DOI: 10.1109/ISSE51996.2021.9467617

Mudiyanselage Ruwan T. Perera, W. Werth, Timothy A. Polom

引用次数: 0

Characterization of Thick Film Pastes for Aluminum Nitride Substrates 氮化铝基板厚膜浆料的表征

2021 44th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2021-05-05 DOI: 10.1109/ISSE51996.2021.9467661

J. Hlina, J. Řeboun, A. Hamácek

引用次数: 1

Soldering with SACX0307-(TiO2/ZnO) nano-composite solder alloys 用SACX0307-(TiO2/ZnO)纳米复合钎料合金进行焊接

2021 44th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2021-05-05 DOI: 10.1109/ISSE51996.2021.9467652

B. Illés, A. Skwarek, O. Krammer, Dániel Straubinger, Bence Lakó, G. Harsányi, K. Witek

{"title":"Soldering with SACX0307-(TiO2/ZnO) nano-composite solder alloys","authors":"B. Illés, A. Skwarek, O. Krammer, Dániel Straubinger, Bence Lakó, G. Harsányi, K. Witek","doi":"10.1109/ISSE51996.2021.9467652","DOIUrl":"https://doi.org/10.1109/ISSE51996.2021.9467652","url":null,"abstract":"In the present research, the solderability of SACX0307 nano-composite solder alloys was studied. The SACX0307 solder alloys were reinforced by ZnO or TiO2 nanoparticles. The nanoparticles were mixed into the solder paste in different volume fractions between 0.25 and 1 wt%, using the ball milling process. Wetting and mechanical tests were performed with the nano-composite solder alloys and with the reference SACX0307 as well. It was found that the ceramic reinforcements did not have a considerable effect on the wetting of the composite solder alloys. However, the shear strength of the nano-composite solder joints increased compared to the reference SACX0307. Generally, the application of TiO2 nanoparticles resulted in a bit better solderin properties than the ZnO nanoparticles. No straightforward correlation was found between the volume fraction of the ceramic nanoparticles and the soldering properties of the nano-composite solder alloys. Expect in the case of the ZnO nanoparticles, when the volume fraction should not exceed 0.5wt% since it can inhibit the proper reflow of the solder paste.","PeriodicalId":303255,"journal":{"name":"2021 44th International Spring Seminar on Electronics Technology (ISSE)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-05-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128158244","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Establishing a Machine-learning Based Framework for Optimising Electronics Assembly 基于机器学习的电子装配优化框架的建立

2021 44th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2021-05-05 DOI: 10.1109/ISSE51996.2021.9467543

O. Krammer, Tareq I. Al-Ma’aiteh, P. Martinek, A. Géczy

{"title":"Establishing a Machine-learning Based Framework for Optimising Electronics Assembly","authors":"O. Krammer, Tareq I. Al-Ma’aiteh, P. Martinek, A. Géczy","doi":"10.1109/ISSE51996.2021.9467543","DOIUrl":"https://doi.org/10.1109/ISSE51996.2021.9467543","url":null,"abstract":"By the spread of miniaturized components, like the 0201mm size-code (200 × 100 μm) passives, utilizing advanced optimization techniques becomes crucial in this field. A framework was established, which used machine-learning-based estimators to predict the yield of any manufacturing process in electronics technology. The framework includes using various methods, like artificial neural networks (ANN), decision trees and neuro-fuzzy inference systems. It can automatically split the input data into training and testing sets for each learning epoch to reach optimal performance and prevent possible overfitting at the same time. Besides, optimal structures and description functions are also determined automatically. To assess the prediction error, the framework calculates the MAE (Mean Absolute Error), the RMSE (Root Mean Square Error) and the MAPE (Mean Absolute Percentage Error) parameters to decide if the built estimator structure is appropriate. As an outcome, the framework can provide several parameters that the user can optionally select. Parameters like the predicted values of a process output parameter over different input process parameters are provided. Besides, KPI (Key Process Index) of the output parameters or the Desirability Function (which combines many output parameters) can be acquired. The applicability and the performance of the framework were analyzed on the stencil printing process by building an ANN structure.","PeriodicalId":303255,"journal":{"name":"2021 44th International Spring Seminar on Electronics Technology (ISSE)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-05-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132403600","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Analysis of Nanometer-Scale n-Type Double-Gate (DG) MOSFETs Using High-ƙ Dielectrics for High-Speed Applications 高速应用的纳米n型双栅(DG) mosfet的高介电体分析

2021 44th International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2021-05-05 DOI: 10.1109/ISSE51996.2021.9467619

Naveenbalaji Gowthaman, V. Srivastava

引用次数: 4