2014 IEEE Hot Chips 26 Symposium (HCS)最新文献

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Bridge chip composing a PCIe switch over ethernet to make a seamless disaggregated computer in data-center scale 桥接芯片由以太网上的PCIe交换机组成,使数据中心规模的计算机无缝分解
2014 IEEE Hot Chips 26 Symposium (HCS) Pub Date : 2014-08-01 DOI: 10.1109/HOTCHIPS.2014.7478836
T. Yoshikawa, Jun Suzuki, Y. Hidaka, J. Higuchi, S. Abe
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引用次数: 2
Low-cost 3D chip stacking with ThruChip wireless connections 低成本3D芯片堆叠与ThruChip无线连接
2014 IEEE Hot Chips 26 Symposium (HCS) Pub Date : 1900-01-01 DOI: 10.1109/hotchips.2014.7478813
D. Ditzel
{"title":"Low-cost 3D chip stacking with ThruChip wireless connections","authors":"D. Ditzel","doi":"10.1109/hotchips.2014.7478813","DOIUrl":"https://doi.org/10.1109/hotchips.2014.7478813","url":null,"abstract":"This article consists of a collection of slides from the author's conference presentation on low cost 3D chip stacking with ThruChip's wireless connections. Some of the specific topics discussed include: the challenges of current 3D stacking methods; the deployment of wireless technologies from a cost and bandwidth perspective; advancements in wafer thinning; stacked wireless data communication; and power distribution facilities.","PeriodicalId":299263,"journal":{"name":"2014 IEEE Hot Chips 26 Symposium (HCS)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130444823","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 33
The ANTON 2 chip a second-generation ASIC for molecular dynamics ANTON 2芯片是第二代分子动力学专用集成电路
2014 IEEE Hot Chips 26 Symposium (HCS) Pub Date : 1900-01-01 DOI: 10.1109/hotchips.2014.7478807
J. A. Butts, Brannon Batson, Jack C. Chao, Martin M. Deneroff, R. Dror, Christopher H. Fenton, Anthony Forte, Joseph Gagliardo, Gennette Gill, Brian Greskamp, J. P. Grossman, C. R. Ho, J. Kuskin, Richard H. Larson, T. Layman, L. Lee, Chester Li, Shark Yeuk-Hai Mok, Mark A. Moraes, Rolf Mueller, Lawrence J. Nociolo, Jon, L., Peticolas, Terry Quan, D. Ramot, Naseer Siddique, Jochen Spengler, P. T. P. Tang, Michael Theobald, Horia Toma, Brian Towles, Stanley C. Wang, David, É., Shaw
{"title":"The ANTON 2 chip a second-generation ASIC for molecular dynamics","authors":"J. A. Butts, Brannon Batson, Jack C. Chao, Martin M. Deneroff, R. Dror, Christopher H. Fenton, Anthony Forte, Joseph Gagliardo, Gennette Gill, Brian Greskamp, J. P. Grossman, C. R. Ho, J. Kuskin, Richard H. Larson, T. Layman, L. Lee, Chester Li, Shark Yeuk-Hai Mok, Mark A. Moraes, Rolf Mueller, Lawrence J. Nociolo, Jon, L., Peticolas, Terry Quan, D. Ramot, Naseer Siddique, Jochen Spengler, P. T. P. Tang, Michael Theobald, Horia Toma, Brian Towles, Stanley C. Wang, David, É., Shaw","doi":"10.1109/hotchips.2014.7478807","DOIUrl":"https://doi.org/10.1109/hotchips.2014.7478807","url":null,"abstract":"This article consists of a collection of slides from the author's conference presentation on the special features, supercomputing capabilities; system design and architectures, processing capabilities, and targeted markets for D.E. Shaw Research's ANTON2 chip, a massively parallel supercomputer.","PeriodicalId":299263,"journal":{"name":"2014 IEEE Hot Chips 26 Symposium (HCS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131181339","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Secure systems design 安全系统设计
2014 IEEE Hot Chips 26 Symposium (HCS) Pub Date : 1900-01-01 DOI: 10.1007/978-1-4302-0377-3_2
L. van Doorn
{"title":"Secure systems design","authors":"L. van Doorn","doi":"10.1007/978-1-4302-0377-3_2","DOIUrl":"https://doi.org/10.1007/978-1-4302-0377-3_2","url":null,"abstract":"","PeriodicalId":299263,"journal":{"name":"2014 IEEE Hot Chips 26 Symposium (HCS)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114731020","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The amd opteron™ A1100 processor codenamed "Seattle" 代号为“西雅图”的amd opteron™A1100处理器
2014 IEEE Hot Chips 26 Symposium (HCS) Pub Date : 1900-01-01 DOI: 10.1109/hotchips.2014.7478815
Sean White, “SEATTLE” Floorplan
{"title":"The amd opteron™ A1100 processor codenamed \"Seattle\"","authors":"Sean White, “SEATTLE” Floorplan","doi":"10.1109/hotchips.2014.7478815","DOIUrl":"https://doi.org/10.1109/hotchips.2014.7478815","url":null,"abstract":"This article consists of a collection of slides from the author's conference presentation on the special features, system design and architectures, processing capabilities, and targeted markets for AMD's Opteron A1100 Processor (Seattle SOC).","PeriodicalId":299263,"journal":{"name":"2014 IEEE Hot Chips 26 Symposium (HCS)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125997021","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
IoT device standards 物联网设备标准
2014 IEEE Hot Chips 26 Symposium (HCS) Pub Date : 1900-01-01 DOI: 10.1109/hotchips.2014.7478803
{"title":"IoT device standards","authors":"","doi":"10.1109/hotchips.2014.7478803","DOIUrl":"https://doi.org/10.1109/hotchips.2014.7478803","url":null,"abstract":"","PeriodicalId":299263,"journal":{"name":"2014 IEEE Hot Chips 26 Symposium (HCS)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122564899","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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