IEEE Transactions on Parts, Materials and Packaging最新文献

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Tunnel Film Resistance Utilizing Nonlinear Constriction Resistance Measurements 利用非线性收缩阻力测量隧道薄膜阻力
IEEE Transactions on Parts, Materials and Packaging Pub Date : 1971-03-01 DOI: 10.1109/TPMP.1971.1136438
E. Bock, J. Whitley
{"title":"Tunnel Film Resistance Utilizing Nonlinear Constriction Resistance Measurements","authors":"E. Bock, J. Whitley","doi":"10.1109/TPMP.1971.1136438","DOIUrl":"https://doi.org/10.1109/TPMP.1971.1136438","url":null,"abstract":"Constriction resistance measurements based on non-linearity tend to ignore tunnel films because of the ohmic behavior and temperature insensitivity of tunnel resistance. Theory and experimental verification are given to show that tunnel films can be detected and measured by comparing conventional contact resistance measurements with constriction resistance values obtained with the non-linearity technique.","PeriodicalId":292168,"journal":{"name":"IEEE Transactions on Parts, Materials and Packaging","volume":"53 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1971-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127876171","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Correction to "New Tables for the Mutual Inductance of Coaxial Cylindrical Coils" 对“同轴圆柱线圈互感新表”的修正
IEEE Transactions on Parts, Materials and Packaging Pub Date : 1971-03-01 DOI: 10.1109/TPMP.1971.1136431
C. Siocos
{"title":"Correction to \"New Tables for the Mutual Inductance of Coaxial Cylindrical Coils\"","authors":"C. Siocos","doi":"10.1109/TPMP.1971.1136431","DOIUrl":"https://doi.org/10.1109/TPMP.1971.1136431","url":null,"abstract":"","PeriodicalId":292168,"journal":{"name":"IEEE Transactions on Parts, Materials and Packaging","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1971-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132926017","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Who's Who in G-PMP G-PMP中的谁是谁
IEEE Transactions on Parts, Materials and Packaging Pub Date : 1971-03-01 DOI: 10.1109/TPMP.1971.1136433
E. Shobert
{"title":"Who's Who in G-PMP","authors":"E. Shobert","doi":"10.1109/TPMP.1971.1136433","DOIUrl":"https://doi.org/10.1109/TPMP.1971.1136433","url":null,"abstract":"","PeriodicalId":292168,"journal":{"name":"IEEE Transactions on Parts, Materials and Packaging","volume":"98 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1971-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115069350","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Electrical-Power Brushes for Dry Inert-Gas Atmospheres 干惰性气体环境用电刷
IEEE Transactions on Parts, Materials and Packaging Pub Date : 1971-03-01 DOI: 10.1109/TPMP.1971.1136434
J. Johnson, J. McKinney
{"title":"Electrical-Power Brushes for Dry Inert-Gas Atmospheres","authors":"J. Johnson, J. McKinney","doi":"10.1109/TPMP.1971.1136434","DOIUrl":"https://doi.org/10.1109/TPMP.1971.1136434","url":null,"abstract":"Conventional carbon brushes developed for earth's surface applications were found to be inadequate in terms of wearing life when applied in electrical contact with copper slip rings operating in dry inert-gas atmospheres. Under similar conditions, however, the life of such brushes was vastly increased when special treatments were incorporated in their body structure. One of these treatments (40 W/o MoS 2 ) imparted life ability and electrical voltage stability comparable to those of present-day industrial grade brushes operating in normal air atmospheres.","PeriodicalId":292168,"journal":{"name":"IEEE Transactions on Parts, Materials and Packaging","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1971-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125487659","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
Long Life Slip Rings for Vaccum Operation 真空操作用长寿命滑环
IEEE Transactions on Parts, Materials and Packaging Pub Date : 1971-03-01 DOI: 10.1109/TPMP.1971.1136440
A. Cunningham
{"title":"Long Life Slip Rings for Vaccum Operation","authors":"A. Cunningham","doi":"10.1109/TPMP.1971.1136440","DOIUrl":"https://doi.org/10.1109/TPMP.1971.1136440","url":null,"abstract":"","PeriodicalId":292168,"journal":{"name":"IEEE Transactions on Parts, Materials and Packaging","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1971-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114983350","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
The Effects of Substrate on the Contact Resistance of Tarnish Films 基材对失光膜接触电阻的影响
IEEE Transactions on Parts, Materials and Packaging Pub Date : 1971-03-01 DOI: 10.1109/TPMP.1971.1136442
W. Abbott
{"title":"The Effects of Substrate on the Contact Resistance of Tarnish Films","authors":"W. Abbott","doi":"10.1109/TPMP.1971.1136442","DOIUrl":"https://doi.org/10.1109/TPMP.1971.1136442","url":null,"abstract":"Studies were made of the contact resistance of Ag2S films on pure silver, and on gold-silver and palladium-silver alloys. Although relatively thick films of Ag2S on silver gave low contact resistance, equivalent film thicknesses on other substrates gave contact resistance values that were orders of magnitude higher. These results were attributed to mechanical rather than electrical-property differences of either the films, the substrates, or an interaction of both. Data clearly indicate that the \"desirable\" properties of silver sulfide are unique only to films on pure silver.","PeriodicalId":292168,"journal":{"name":"IEEE Transactions on Parts, Materials and Packaging","volume":"169 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1971-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122420418","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Scanning Electron Microscopy of Contact Surfaces Before and After Arcing 电弧前后接触面的扫描电子显微镜
IEEE Transactions on Parts, Materials and Packaging Pub Date : 1971-03-01 DOI: 10.1109/TPMP.1971.1136439
M. Vasile, G. Kammlott
{"title":"Scanning Electron Microscopy of Contact Surfaces Before and After Arcing","authors":"M. Vasile, G. Kammlott","doi":"10.1109/TPMP.1971.1136439","DOIUrl":"https://doi.org/10.1109/TPMP.1971.1136439","url":null,"abstract":"An apparatus has been constructed which allows the manipulation of electrical contacts inside a scanning electron microscope. The contact members can be positioned so that an image of their edge profiles can be obtained at magnifications as high as 10,000X. The microgeometry of both the anode and cathode surfaces is clearly imaged. The contacts can be brought together to make electrical contact and then separated to a desired distance. The interelectrode spacing and both contact members can be viewed on the cathode ray tube of the scanning electron microscope. With this technique, contact gaps of less than one micron can be set and measured. Both contacts are connected to coaxial cable circuitry external to the microscope. A pulse of predetermined potential and duration can be transmitted to one of the contact members. If breakdown occurs, an oscillographic record of the event is obtained as well as an immediate image of the damage on the anode and cathode profiles. One of the contacts can then be rotated to obtain a front view for measurements of the arc damage. Using this technique the phenomenon of electrode bridging from an eruption of molten metal from the anode has been observed. Electric fields required for the initiation cf short arcs have been measured as have the diameters of anode craters and their rim heights","PeriodicalId":292168,"journal":{"name":"IEEE Transactions on Parts, Materials and Packaging","volume":"116 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1971-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127307077","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
An Investigation Into the Factors Contributing to Welding of Contact Electrodes in High Vaccum 高真空条件下接触电极焊接影响因素的研究
IEEE Transactions on Parts, Materials and Packaging Pub Date : 1971-03-01 DOI: 10.1109/TPMP.1971.1136435
P. Slade
{"title":"An Investigation Into the Factors Contributing to Welding of Contact Electrodes in High Vaccum","authors":"P. Slade","doi":"10.1109/TPMP.1971.1136435","DOIUrl":"https://doi.org/10.1109/TPMP.1971.1136435","url":null,"abstract":"The effect of a vacuum environment on welding of Cu-Bi (0.3%) electrical contacts has been investigated. The experiments have been planned in order to differentiate between the effects of cold welding, diffusion welding and percussion welding. Cold welding has no affect on newly prepared electrodes, but after the electrodes have been arced appreciably a small residual cold weld force is experienced. The diffusion weld strength is strongly dependent upon the contact force, the electrode temperature and the time in contact. The strongest weld forces are measured in the percussion weld experiment where the electrodes experience a high current prestrike arc as they close. It is also found in this study that the weld force decreases rapidly after the electrode faces are exposed to the residual gases in the vacuum. These results are discussed in terms of the chemisorption of residual gases and the real area of electrical contact. The effects of the change in nature of the electrode surfaces are discussed and a satisfactory qualitative explanation of the results is reached.","PeriodicalId":292168,"journal":{"name":"IEEE Transactions on Parts, Materials and Packaging","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1971-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114587269","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 13
Stress Relaxation and Fatigue of Two Electromechanical Spring Materials Strengthened by Thermomechanical Processing 热力强化两种机电弹簧材料的应力松弛与疲劳
IEEE Transactions on Parts, Materials and Packaging Pub Date : 1971-03-01 DOI: 10.1109/TPMP.1971.1136441
A. Fox
{"title":"Stress Relaxation and Fatigue of Two Electromechanical Spring Materials Strengthened by Thermomechanical Processing","authors":"A. Fox","doi":"10.1109/TPMP.1971.1136441","DOIUrl":"https://doi.org/10.1109/TPMP.1971.1136441","url":null,"abstract":"The reliable performance of electrical contacts often depends on the dimensional stability of the spring material used to operate these contacts. The fatigue and stressrelaxation behavior of two copper-base alloys, Copper Development Association Alloys 510 (5 percent tin phosphor bronze) and 725 (89%Cu-9%Ni-2%Sn), strengthened by thermomechanical processing has been investigated. Strengthening mechanisms resulting from a combination of cold work and low temperature heat treatment have been taken advantage cf to produce electromechanical spring materials which have good conductivity and corrosion resistance, have sufficient ductility forpunching and forming, are dimensionally stable for long periods of time and also adequately resist fatigue stressing. Test data are presented which show the materials processed in this manner to have significant advantages over currently available, commercial tempers in that they permit designs having higher working stresses and better material utilization, thus filling a need created by miniaturization.","PeriodicalId":292168,"journal":{"name":"IEEE Transactions on Parts, Materials and Packaging","volume":"91 5","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1971-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120879233","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
Who's Who in G-PMP G-PMP中的谁是谁
IEEE Transactions on Parts, Materials and Packaging Pub Date : 1970-12-01 DOI: 10.1109/TPMP.1970.1136266
G. Farrall
{"title":"Who's Who in G-PMP","authors":"G. Farrall","doi":"10.1109/TPMP.1970.1136266","DOIUrl":"https://doi.org/10.1109/TPMP.1970.1136266","url":null,"abstract":"","PeriodicalId":292168,"journal":{"name":"IEEE Transactions on Parts, Materials and Packaging","volume":"183 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1970-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124629703","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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