2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium最新文献

Transient Measurement of the Junction-To-Case Thermal Resistance Using Structure Functions: Chances and Limits 用结构函数测量结壳热阻的瞬态:机会和限制

2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium Pub Date : 2008-03-16 DOI: 10.1109/STHERM.2008.4509389

D. Schweitzer, H. Pape, Liu Chen

{"title":"Transient Measurement of the Junction-To-Case Thermal Resistance Using Structure Functions: Chances and Limits","authors":"D. Schweitzer, H. Pape, Liu Chen","doi":"10.1109/STHERM.2008.4509389","DOIUrl":"https://doi.org/10.1109/STHERM.2008.4509389","url":null,"abstract":"The accurate and reproducible measurement of the junction-to-case thermal resistance Rth-JC of power semiconductor devices is far from trivial. In the recent time several new approaches to measure the Rth-JC have been suggested, among them transient measurements with different interface materials between the package and a heat-sink which allow identifying the Rth-IC in the structure function of the heat flow path. This paper shows that numerical effects during the calculation of the structure function as well as 3D heat spreading have a big influence on the structure function which makes it often difficult to determine the Rth-IC. Finite element simulations can provide a clue to identify this value in the structure function. The theoretical findings are applied to and demonstrated for actual measurements and the new approach is compared to the traditional method (involving a thermo-couple measurement of the case temperature) with respect to accuracy and reproducibility. Finally an alternative approach to determining the Rth-IC from transient dual- interface measurements, which is not based on structure functions, is presented.","PeriodicalId":285718,"journal":{"name":"2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-03-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129832251","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 76

Strategies for Modeling Turbulent Flows in Electronics 电子学湍流建模策略

2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium Pub Date : 2008-03-16 DOI: 10.1109/STHERM.2008.4509363

J. Tyacke, P. Tucker, P. Nithiarasu

引用次数: 3

Synthetic Jet Cooling Part II: Experimental Results of an Acoustic Dipole Cooler 合成射流冷却第二部分:声学偶极子冷却器的实验结果

2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium Pub Date : 2008-03-16 DOI: 10.1109/STHERM.2008.4509361

C. Lasance, R. Aarts, Okke Ouweltjes

引用次数: 24

Radiation Heat Transfer from Plate-Fin Heat Sinks 板翅式散热器的辐射传热

2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium Pub Date : 2008-03-16 DOI: 10.1109/STHERM.2008.4509379

Y. Shabany

引用次数: 29

Creation of a Thermal Technology Roadmap in a Consumer Electronics Product Environment 在消费电子产品环境中创建热技术路线图

2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium Pub Date : 2008-03-16 DOI: 10.1109/STHERM.2008.4509375

G. Martin, E. Eggink

引用次数: 6

Local Heat Transfer Coefficient Measurements of Flat Angled Sprays Using Thermal Test Vehicle 用热试验车测量平角喷雾器的局部传热系数

2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium Pub Date : 2008-03-16 DOI: 10.1109/STHERM.2008.4509382

R. Bonner, R. Wadell, G. Popov

{"title":"Local Heat Transfer Coefficient Measurements of Flat Angled Sprays Using Thermal Test Vehicle","authors":"R. Bonner, R. Wadell, G. Popov","doi":"10.1109/STHERM.2008.4509382","DOIUrl":"https://doi.org/10.1109/STHERM.2008.4509382","url":null,"abstract":"Impingement cooling methods, such as spray cooling and jet impingement have demonstrated the capability of cooling high heat flux surfaces while maintaining a low thermal resistance. Most spray cooling and jet impingement experiments attempt to measure the average heat transfer coefficient, even though it is known that heat transfer coefficients are known to change as a function of distance from the impact zone. Secondly, most experiments are done on thick uniformly heated surfaces although most electronic devices are very thin (<0.2 mm) and generate heat very non- uniformly with very large peak heat fluxes (>1000 W/cm2) over very small areas (<0.25 mm2). In this study an accurate measurement of the uniformity of the spray cooling thermal solution was attained using an Intel supplied thermal test vehicle. The heater block is a thin silicon chip (<0.25 mm thick and 7 cm2 in surface area) delivering a uniform heat flux to 70 W/cm2. The platform also has the ability to power large peak heat fluxes (>1000 W/cm2) over small areas (<0.2 5 mm2). Experiments using jet impingement with flat spray nozzles angled to the surface were conducted with water, methanol, and HFE-7000. The axial heat transfer coefficient variation was measured under uniform heat loading. Finally, the measurements are compared to modified models from the literature with good agreement.","PeriodicalId":285718,"journal":{"name":"2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-03-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115487292","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Fast Computation of Temperature Profiles of VLSI ICs with High Spatial Resolution 高空间分辨率超大规模集成电路温度分布的快速计算

2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium Pub Date : 2008-03-16 DOI: 10.1109/STHERM.2008.4509365

Je-Hyoung Park, Xi Wang, A. Shakouri, S. Kang

引用次数: 14

Thermal Characteristics of Integrated Module Board 集成模块板的热特性

2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium Pub Date : 2008-03-16 DOI: 10.1109/STHERM.2008.4509371

T. Karila, P. Palm

{"title":"Thermal Characteristics of Integrated Module Board","authors":"T. Karila, P. Palm","doi":"10.1109/STHERM.2008.4509371","DOIUrl":"https://doi.org/10.1109/STHERM.2008.4509371","url":null,"abstract":"In traditional approach of electronics manufacturing, active and passive components are mounted on printed circuit board (PCB) utilizing surface mount technology (SMT). Due to the continuous miniaturization of electronic products, new innovative packaging technologies have been developed to meet future requirements. Integrated module board (1MB) technology offers solution for embedding active and passive components inside an organic substrate or PCB mother board. Development through three technology generations has enabled cost-effective manufacturing without drawbacks in terms of reliability, yield and system performance. The requirement of decreased product size along with constantly increasing power densities poses an issue of overheating. As embedded ICs are in question, the thermal management of the packages is typically even more challenging: gained benefit in size and weight produces fewer options for thermal management methods. However, despite of lost volume, 1MB technology also offers some degrees of freedom to manage the thermal load produced by ICs. This paper presents the summary of results about the initial thermal studies of the 1MB technology that is also presented in general terms. System-in-board (SiB) and system-in-package (SiP) types of packages have been manufactured and measured in standard natural convection environment and modeled with thermal simulation software. The results have provided fundamental information about the thermal behavior of the 1MB structure - e.g. main heat flow paths have been determined and the efficiency of various thermal enhancement methods has been evaluated.","PeriodicalId":285718,"journal":{"name":"2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-03-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133724866","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Radially Oscillating Flow Hybrid Cooling System for Low Profile Electronics Applications 用于低轮廓电子应用的径向振荡流混合冷却系统

2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium Pub Date : 2008-03-16 DOI: 10.1109/STHERM.2008.4509381

R. Walchli, R. Linderman, T. Brunschwiler, U. Kloter, H. Rothuizen, N. Bieri, D. Poulikakos, B. Michel

{"title":"Radially Oscillating Flow Hybrid Cooling System for Low Profile Electronics Applications","authors":"R. Walchli, R. Linderman, T. Brunschwiler, U. Kloter, H. Rothuizen, N. Bieri, D. Poulikakos, B. Michel","doi":"10.1109/STHERM.2008.4509381","DOIUrl":"https://doi.org/10.1109/STHERM.2008.4509381","url":null,"abstract":"The radially oscillating flow hybrid cooling system, in the following referred to as RADIOS, provides a thin form factor cold plate with radial spreading of heat to a larger area. A small liquid volume (<10 ml) is hermetically sealed within the system and does not require external hose connections. Four membrane pumps running in a phase-delayed manner induce a constant-speed, oscillating direction fluid flow at the chip source that continuously shuttles heat to an extended periphery and returns cool liquid to the chip. In the peripheral branches, heat is transferred from the liquid to solid structures and finally dissipated to the air. A micro-scale copper mesh enables low-resistance heat transfer (solid-liquid and liquid- solid) in a thin form factor (< 2 mm). Narrow channels between the discrete heat exchanger areas optimize the spreading performance and reduce the fluid volume. Numerical modeling shows an effective conductivity of 20X and 50X over bulk copper for the spreader plates and the interconnecting tubes, respectively. The technology presented here promotes modular liquid cooling units for low-profile computing systems without incurring the risk of flooding associated with conventional liquid cooling circuits.","PeriodicalId":285718,"journal":{"name":"2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-03-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129114191","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

Thermal Test Chip Design and Performance Considerations 热测试芯片的设计和性能考虑

2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium Pub Date : 2008-03-16 DOI: 10.1109/STHERM.2008.4509367

B. Siegal, J. Galloway

{"title":"Thermal Test Chip Design and Performance Considerations","authors":"B. Siegal, J. Galloway","doi":"10.1109/STHERM.2008.4509367","DOIUrl":"https://doi.org/10.1109/STHERM.2008.4509367","url":null,"abstract":"Increasing device complexity, greater power densities, ever changing packages, and shorter time-to-market deadlines have combined to make thermal characterization efforts more frenzied than ever. A thermal test chip was designed to assist the thermal engineer in answering critical thermal packaging or material questions. It has a standard heat source with integrated temperature sensors in a format that can handle both wire bond and bump chip configurations in a scaleable array size. This allows a single wafer to supply various array sizes to meet changing requirements. The key requirements for a thermal test chip are: (1) Maximum possible heating area relative to chip size (2) Uniform temperature profile across heating area (3) Low temperature coefficient for heating source (4) Temperature sensor in center of chip (5) Simple-to-use temperature sensor(s) (6) Multiple temperature sensors for a temperature profile across chip surface (7) Kelvin Connections (i.e., 4-wire connections) for improved measurement accuracy (8) Chip size that closely approximates the chip being simulated. This paper will describe a thermal test chip that meets these requirements in the simplest manner possible. Insight into future investigations will also be presented.","PeriodicalId":285718,"journal":{"name":"2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium","volume":"2014 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-03-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114678385","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 21