2012 35th International Spring Seminar on Electronics Technology最新文献_第3页

Bus encoding algorithm to reduce crosstalk effects 总线编码算法减少串扰影响

2012 35th International Spring Seminar on Electronics Technology Pub Date : 2012-05-09 DOI: 10.1109/ISSE.2012.6273165

M. Daraban, D. Pitica

引用次数: 1

Day and night vision detectors - Design of antireflection coatings 昼和夜视探测器。防反射涂层的设计

2012 35th International Spring Seminar on Electronics Technology Pub Date : 2012-05-09 DOI: 10.1109/ISSE.2012.6273093

T. Pencheva, B. Gyoch, P. Mashkov

引用次数: 0

Effect of surface treatment on the conductive adhesive interconnection of flexible solar cells 表面处理对柔性太阳能电池导电粘合互连的影响

2012 35th International Spring Seminar on Electronics Technology Pub Date : 2012-05-09 DOI: 10.1109/ISSE.2012.6273120

A. Reithe, M. Munch, K. Wolter

引用次数: 1

Packaging of electronic devices for long-term implantation 用于长期植入的电子设备包装

2012 35th International Spring Seminar on Electronics Technology Pub Date : 2012-05-09 DOI: 10.1109/ISSE.2012.6273121

S. Kirsten, J. Uhlemann, M. Braunschweig, K. Wolter

引用次数: 7

Reliability investigation of low silver content micro-alloyed SAC solders 低银微合金SAC焊料可靠性研究

2012 35th International Spring Seminar on Electronics Technology Pub Date : 2012-05-09 DOI: 10.1109/ISSE.2012.6273126

O. Krammer, T. Garami

引用次数: 19

LTCC membranes With integrated heating structures, temperature sensors and strain gauges LTCC膜具有集成加热结构，温度传感器和应变片

2012 35th International Spring Seminar on Electronics Technology Pub Date : 2012-05-09 DOI: 10.1109/ISSE.2012.6273169

N. Gutzeit, J. Muller, C. Reinlein, S. Gebhardt

引用次数: 3

Virtual laboratory for the e-learning education in the electronics technologies 面向电子技术在线学习教育的虚拟实验室

2012 35th International Spring Seminar on Electronics Technology Pub Date : 2012-05-09 DOI: 10.1109/ISSE.2012.6273149

D. Demeter, J. Banský

{"title":"Virtual laboratory for the e-learning education in the electronics technologies","authors":"D. Demeter, J. Banský","doi":"10.1109/ISSE.2012.6273149","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273149","url":null,"abstract":"This paper is concerning with a virtual laboratory, which is implemented at the Department of technologies in Electronics and which will be used for distant and blended e-Learning of the technologies in electronics, as well as supporting the classical theoretical lectures. The laboratory itself is based on 360° panorama pictures created from every laboratory at our department. We have integrated into the system some basic information about equipment's, such as the name and type of the equipment, the technological procedures for which it can be used, some safety regulations related to working with the equipment and we have attached the user manual for equipment, if we had it available. The technological processes and laboratory exercises are covered by education videos and flash animations created by our colleagues. This system should help our students to get familiar with the laboratory equipment as well as with the technologies and techniques used at our department. This system is mainly designed for students, who have limited access to the laboratories (e.g. persons with some disability) and for the external students. It is also suitable for using in standard education process, where the number of the students is bigger, than the capacity of the laboratories. It should also support the lecturer at the theoretical lectures. In the future, the virtual laboratory will be used by the researchers for remote access of the laboratory equipment.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129427671","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Solder joints properties as function of multiple reflow Vapor Phase Soldering process 多回流气相焊接工艺对焊点性能的影响

2012 35th International Spring Seminar on Electronics Technology Pub Date : 2012-05-09 DOI: 10.1109/ISSE.2012.6273127

M. Branzei, I. Plotog, F. Miculescu, G. Vărzaru, P. Svasta, A. Thumm

{"title":"Solder joints properties as function of multiple reflow Vapor Phase Soldering process","authors":"M. Branzei, I. Plotog, F. Miculescu, G. Vărzaru, P. Svasta, A. Thumm","doi":"10.1109/ISSE.2012.6273127","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273127","url":null,"abstract":"The continuous trend towards high density and miniaturization of electronic devices involves the use of multiple reflow processes in assembling technologies for second level of interconnections in electronic packaging hierarchy. According to the “4P” Soldering Model concept (4PSMC), considering the Pad-Paste-Pin-Process elements as Key Process Input Variables (KPIV), the solder joints are the result of KPIV synergistically interactions and correlations with consequences over their microstructure. In the paper, taking into consideration the cooling rate influence over intermetallic compounds (IMC) formation and microstructure, there was described the investigations over electrical and mechanical properties of solder joints resulted from multiple reflow Vapor Phase Soldering (VPS) process, in terms of 4PSMC. Maintaining the pad, pin and paste of KPIV as references measurements of solder joints resistances and shear forces were perform as function of VPS process's number for two values of cooling rate, respectively IMC microstructures and stereofractography studies. The results of the studies performed and presented in the paper will be use for improving process control in order to assure the solder joints reliability, to minimize losses on VPS lines, to reduce defects number and rework time.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128297033","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 11

Silver micropowders as SiC die attach material for high temperature applications 银微粉作为SiC模具的高温附着材料

2012 35th International Spring Seminar on Electronics Technology Pub Date : 2012-05-09 DOI: 10.1109/ISSE.2012.6273125

R. Kisiel, Z. Szczepański, P. Firek, J. Grochowski, M. Myśliwiec, M. Guziewicz

引用次数: 12

Image intensifier power supply 图像增强电源

2012 35th International Spring Seminar on Electronics Technology Pub Date : 2012-05-09 DOI: 10.1109/ISSE.2012.6273089

Y. Dzhenkov

引用次数: 0