2016 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS XIX)最新文献

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A 20uA/MHz at 200MHz microcontroller with low power memory access scheme for small sensing nodes 20uA/MHz at 200MHz微控制器,具有低功耗存储器访问方案,适用于小型传感节点
2016 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS XIX) Pub Date : 2016-04-20 DOI: 10.1109/CoolChips.2016.7503677
M. Nakajima, Ichiro Naka, Fumihiro Matsushima, T. Yamauchi
{"title":"A 20uA/MHz at 200MHz microcontroller with low power memory access scheme for small sensing nodes","authors":"M. Nakajima, Ichiro Naka, Fumihiro Matsushima, T. Yamauchi","doi":"10.1109/CoolChips.2016.7503677","DOIUrl":"https://doi.org/10.1109/CoolChips.2016.7503677","url":null,"abstract":"Motion sensing technology has been applied in a wide range of fields of IoT. In the future, sensor device can be highly expected to be applied in the field of sports, but in order to achieve this, we need to reduce the size and weight while maintaining high performance as shown in Figure 1. It is necessary to sample a signal from the 9D sensor (3-axis gyroscope, 3-axis accelerometer and 3-axis compass) by more than 1 K/s of rate to measure the max speed (over 300km/h) for a detailed motion analysis in the sports, and necessary to provide 100-200MHz performance to CPU. Also, in order to put sensor on the body, we must reduce the size of the battery, which is largest and heaviest parts of all. When a button type battery is used for as a power source, the average current in the system will be less than 10mA during operation. In this paper, by using the following two techniques, we have successfully reduced power consumption during system operation while maintaining the high performance. Those two techniques include low-power parallel cache and cache memory with address-mapped mode. They help reduce power consumption of flash memory, memory system, and overall system respectively. By using these techniques, we have succeeded in reducing power consumption during sensing application operation at 20uA/MHz at 200MHz.","PeriodicalId":273992,"journal":{"name":"2016 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS XIX)","volume":"110 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127098500","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Thermal safety through Limp Home Mode for intelligent Rear View Camera Systems 智能后视摄像系统通过软回家模式实现热安全
2016 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS XIX) Pub Date : 2016-04-20 DOI: 10.1109/CoolChips.2016.7503680
Piyali Goswami, Y. Marathe, Kedar Chitnis, Koichi Saito
{"title":"Thermal safety through Limp Home Mode for intelligent Rear View Camera Systems","authors":"Piyali Goswami, Y. Marathe, Kedar Chitnis, Koichi Saito","doi":"10.1109/CoolChips.2016.7503680","DOIUrl":"https://doi.org/10.1109/CoolChips.2016.7503680","url":null,"abstract":"Multiprocessor SoCs (MPSoCs) are deployed in intelligent Rear View Camera Systems (iRVCS) for capture, analytics and display. iRVCS, mounted near the car's exterior surface, are subject to direct sunlight for prolonged time. At high junction temperatures (Tj) iRVCS completely shuts down for thermal protection resulting in complete loss of visibility. The paper focuses on techniques to detect such conditions and switch to a Limp Home Mode (LHM) with basic rear view visibility. When Tj reduces, it seamlessly switches back to original usecase. Results showed the switch takes <; 350 milliseconds achieving 20-25% power savings (5°C cooler) at high ambient temperatures.","PeriodicalId":273992,"journal":{"name":"2016 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS XIX)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124462733","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Message from the program committee chairs 来自项目委员会主席的信息
2016 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS XIX) Pub Date : 1900-01-01 DOI: 10.1109/CoolChips.2016.7503665
Makoto Ikeda, Fumio Arakawa
{"title":"Message from the program committee chairs","authors":"Makoto Ikeda, Fumio Arakawa","doi":"10.1109/CoolChips.2016.7503665","DOIUrl":"https://doi.org/10.1109/CoolChips.2016.7503665","url":null,"abstract":"Welcome to COOL Chips XIX, an international symposium that provides you with the latest developments on low-power and high-speed chips. This year we are bringing you an exciting program that includes six keynote speeches, one invited talk, two instructive special invited lectures and one panel discussion in this noble harbor city of Yokohama.","PeriodicalId":273992,"journal":{"name":"2016 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS XIX)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116670711","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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