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2019 IEEE Hot Chips 31 Symposium (HCS)最新文献

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A 0.11 PJ/OP, 0.32-128 Tops, Scalable Multi-Chip-Module-Based Deep Neural Network Accelerator Designed with A High-Productivity vlsi Methodology 基于高效率vlsi方法设计的0.11 PJ/OP, 0.32-128 Tops，可扩展的多芯片模块深度神经网络加速器
2019 IEEE Hot Chips 31 Symposium (HCS) Pub Date : 2019-08-01 DOI: 10.1109/HOTCHIPS.2019.8875657
Rangharajan Venkatesan, Y. Shao, B. Zimmer, Jason Clemons, Matthew R. Fojtik, Nan Jiang, Ben Keller, Alicia Klinefelter, N. Pinckney, Priyanka Raina, S. Tell, Yanqing Zhang, W. Dally, J. Emer, C. T. Gray, S. Keckler, Brucek Khailany
{"title":"A 0.11 PJ/OP, 0.32-128 Tops, Scalable Multi-Chip-Module-Based Deep Neural Network Accelerator Designed with A High-Productivity vlsi Methodology","authors":"Rangharajan Venkatesan, Y. Shao, B. Zimmer, Jason Clemons, Matthew R. Fojtik, Nan Jiang, Ben Keller, Alicia Klinefelter, N. Pinckney, Priyanka Raina, S. Tell, Yanqing Zhang, W. Dally, J. Emer, C. T. Gray, S. Keckler, Brucek Khailany","doi":"10.1109/HOTCHIPS.2019.8875657","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2019.8875657","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"86 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122946844","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
Xilinx First 7nm Device: Versal AI Core (VC1902) 赛灵思首款7nm器件:Versal AI Core (VC1902)
2019 IEEE Hot Chips 31 Symposium (HCS) Pub Date : 2019-08-01 DOI: 10.1109/HOTCHIPS.2019.8875639
Sagheer Ahmad, Sridhar P. Subramanian, V. Boppana, Shankar Lakka, F. Ho, Tomai Knopp, Juanjo Noguera, Gaurav Singh, Ralph Wittig
{"title":"Xilinx First 7nm Device: Versal AI Core (VC1902)","authors":"Sagheer Ahmad, Sridhar P. Subramanian, V. Boppana, Shankar Lakka, F. Ho, Tomai Knopp, Juanjo Noguera, Gaurav Singh, Ralph Wittig","doi":"10.1109/HOTCHIPS.2019.8875639","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2019.8875639","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"104 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127963640","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 19
AMD “ZEN 2” AMD“ZEN 2”
2019 IEEE Hot Chips 31 Symposium (HCS) Pub Date : 2019-08-01 DOI: 10.1109/HOTCHIPS.2019.8875673
David Suggs, Dan Bouvier, Michael Clark, Kevin Lepak, Mahesh Subramony
{"title":"AMD “ZEN 2”","authors":"David Suggs, Dan Bouvier, Michael Clark, Kevin Lepak, Mahesh Subramony","doi":"10.1109/HOTCHIPS.2019.8875673","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2019.8875673","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"92 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121615004","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 22
The true Processing In Memory accelerator 真正的内存处理加速器
2019 IEEE Hot Chips 31 Symposium (HCS) Pub Date : 2019-08-01 DOI: 10.1109/HOTCHIPS.2019.8875680
Fabrice Devaux
{"title":"The true Processing In Memory accelerator","authors":"Fabrice Devaux","doi":"10.1109/HOTCHIPS.2019.8875680","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2019.8875680","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131324890","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 96
A Programmable Embedded Microprocessor for Bit-scalable In-memory Computing 用于位扩展内存计算的可编程嵌入式微处理器
2019 IEEE Hot Chips 31 Symposium (HCS) Pub Date : 2019-08-01 DOI: 10.1109/HOTCHIPS.2019.8875632
Hongyang Jia, Hossein Valavi, Yinqi Tang, Jintao Zhang, Naveen Verma
{"title":"A Programmable Embedded Microprocessor for Bit-scalable In-memory Computing","authors":"Hongyang Jia, Hossein Valavi, Yinqi Tang, Jintao Zhang, Naveen Verma","doi":"10.1109/HOTCHIPS.2019.8875632","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2019.8875632","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120813666","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
RTX ON – The NVIDIA TURING GPU 开启RTX - NVIDIA图灵GPU
2019 IEEE Hot Chips 31 Symposium (HCS) Pub Date : 2019-08-01 DOI: 10.1109/HOTCHIPS.2019.8875651
John Burgess
{"title":"RTX ON – The NVIDIA TURING GPU","authors":"John Burgess","doi":"10.1109/HOTCHIPS.2019.8875651","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2019.8875651","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"146 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123262213","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 59
Arm Neoverse N1 Cloud-to-Edge Infrastructure SoCs Arm Neoverse N1云到边缘基础架构soc
2019 IEEE Hot Chips 31 Symposium (HCS) Pub Date : 2019-08-01 DOI: 10.1109/HOTCHIPS.2019.8875640
Andrea Pellegrini, Chris Abernathy
{"title":"Arm Neoverse N1 Cloud-to-Edge Infrastructure SoCs","authors":"Andrea Pellegrini, Chris Abernathy","doi":"10.1109/HOTCHIPS.2019.8875640","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2019.8875640","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129217734","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Silicon at the Heart of HoloLens 2 全息透镜的核心是硅
2019 IEEE Hot Chips 31 Symposium (HCS) Pub Date : 2019-08-01 DOI: 10.1109/HOTCHIPS.2019.8875669
E. Terry
{"title":"Silicon at the Heart of HoloLens 2","authors":"E. Terry","doi":"10.1109/HOTCHIPS.2019.8875669","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2019.8875669","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134429691","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
7NM “NAVI” GPU - A GPU Built for Performance and Efficiency 7NM“NAVI”GPU -性能和效率的GPU
2019 IEEE Hot Chips 31 Symposium (HCS) Pub Date : 2019-08-01 DOI: 10.1109/HOTCHIPS.2019.8875649
Mike Mantor
{"title":"7NM “NAVI” GPU - A GPU Built for Performance and Efficiency","authors":"Mike Mantor","doi":"10.1109/HOTCHIPS.2019.8875649","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2019.8875649","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127478465","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
CYW89459: High Performance and Low Power Wi-Fi and Bluetooth 5.1 Combo Chip for IoT and Automotive CYW89459:用于物联网和汽车的高性能低功耗Wi-Fi和蓝牙5.1组合芯片
2019 IEEE Hot Chips 31 Symposium (HCS) Pub Date : 2019-08-01 DOI: 10.1109/HOTCHIPS.2019.8875681
K. Medepalli
{"title":"CYW89459: High Performance and Low Power Wi-Fi and Bluetooth 5.1 Combo Chip for IoT and Automotive","authors":"K. Medepalli","doi":"10.1109/HOTCHIPS.2019.8875681","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2019.8875681","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122766397","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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