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2019 IEEE Hot Chips 31 Symposium (HCS)最新文献

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Spring Hill (NNP-I 1000) Intel’s Data Center Inference Chip Spring Hill (NNP-I 1000)英特尔的数据中心推理芯片
2019 IEEE Hot Chips 31 Symposium (HCS) Pub Date : 2019-08-01 DOI: 10.1109/HOTCHIPS.2019.8875671
Ofri Wechsler, Michael Behar, Bharat Daga
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引用次数: 23
Ouroboros: An Inference Engine for Deep Learning Based TTS on Embedded Devices Ouroboros:基于嵌入式设备TTS的深度学习推理引擎
2019 IEEE Hot Chips 31 Symposium (HCS) Pub Date : 2019-08-01 DOI: 10.1109/HOTCHIPS.2019.8875664
Jiansong Zhang, Lixue Xia, Zhao Jiang, Hao Liang, Jiaoyan Chen, Shouda Liu, Wei Lin, Yuan Xie
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引用次数: 0
IBM’s Next Generation POWER Processor IBM的下一代POWER处理器
2019 IEEE Hot Chips 31 Symposium (HCS) Pub Date : 2019-08-01 DOI: 10.1109/HOTCHIPS.2019.8875663
Jeffrey Stuecheli, Scott Willenborg, William J. Starke
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引用次数: 5
Zion: Facebook Next- Generation Large Memory Training Platform 锡安:Facebook下一代大内存训练平台
2019 IEEE Hot Chips 31 Symposium (HCS) Pub Date : 2019-08-01 DOI: 10.1109/HOTCHIPS.2019.8875650
Misha Smelyanskiy
{"title":"Zion: Facebook Next- Generation Large Memory Training Platform","authors":"Misha Smelyanskiy","doi":"10.1109/HOTCHIPS.2019.8875650","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2019.8875650","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130807967","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 18
Jintide®: A Hardware Security Enhanced Server CPU with Xeon® Cores under Runtime Surveillance by an In-Package Dynamically Reconfigurable Processor Jintide®:一款硬件安全增强的服务器CPU，采用Xeon®内核，在运行时监控下，采用包内动态可重构处理器
2019 IEEE Hot Chips 31 Symposium (HCS) Pub Date : 2019-08-01 DOI: 10.1109/HOTCHIPS.2019.8875682
Leibo Liu, Ao Luo, Guanhua Li, Jianfeng Zhu, Yong Wang, Gang Shan, Jianfeng Pan, S. Yin, Shaojun Wei
{"title":"Jintide®: A Hardware Security Enhanced Server CPU with Xeon® Cores under Runtime Surveillance by an In-Package Dynamically Reconfigurable Processor","authors":"Leibo Liu, Ao Luo, Guanhua Li, Jianfeng Zhu, Yong Wang, Gang Shan, Jianfeng Pan, S. Yin, Shaojun Wei","doi":"10.1109/HOTCHIPS.2019.8875682","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2019.8875682","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131772681","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Computer and Redundancy Solution for the Full Self-Driving Computer 全自动驾驶计算机的计算机和冗余解决方案
2019 IEEE Hot Chips 31 Symposium (HCS) Pub Date : 2019-08-01 DOI: 10.1109/HOTCHIPS.2019.8875645
P. Bannon, G. Venkataramanan, Debjit Das Sarma, Emil Talpes
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引用次数: 34
DaVinci: A Scalable Architecture for Neural Network Computing 达芬奇:神经网络计算的可扩展架构
2019 IEEE Hot Chips 31 Symposium (HCS) Pub Date : 2019-08-01 DOI: 10.1109/HOTCHIPS.2019.8875654
H. Liao, Jiajin Tu, Jing Xia, Xiping Zhou
{"title":"DaVinci: A Scalable Architecture for Neural Network Computing","authors":"H. Liao, Jiajin Tu, Jing Xia, Xiping Zhou","doi":"10.1109/HOTCHIPS.2019.8875654","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2019.8875654","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125031229","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 65
Lakefield: Hybrid cores in 3D Package 莱克菲尔德:3D包中的混合核心
2019 IEEE Hot Chips 31 Symposium (HCS) Pub Date : 2019-08-01 DOI: 10.1109/HOTCHIPS.2019.8875641
Sanjeev Khushu, Wilfred Gomes
{"title":"Lakefield: Hybrid cores in 3D Package","authors":"Sanjeev Khushu, Wilfred Gomes","doi":"10.1109/HOTCHIPS.2019.8875641","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2019.8875641","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126896376","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
ML Benchmark Design Challenges ML基准设计挑战
2019 IEEE Hot Chips 31 Symposium (HCS) Pub Date : 2019-08-01 DOI: 10.1109/HOTCHIPS.2019.8875660
Peter Mattson
{"title":"ML Benchmark Design Challenges","authors":"Peter Mattson","doi":"10.1109/HOTCHIPS.2019.8875660","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2019.8875660","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126118957","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IC Technology – What Will the Next Node Offer Us? 集成电路技术——下一个节点将为我们带来什么?
2019 IEEE Hot Chips 31 Symposium (HCS) Pub Date : 2019-08-01 DOI: 10.1109/HOTCHIPS.2019.8875692
H. P. Wong
{"title":"IC Technology – What Will the Next Node Offer Us?","authors":"H. P. Wong","doi":"10.1109/HOTCHIPS.2019.8875692","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2019.8875692","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116801071","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
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