Proceedings of The 27th International Workshop on Vertex Detectors — PoS(VERTEX2018)最新文献_第3页

ATLAS ITk Strip Detector for High-Luminosity LHC 用于高亮度LHC的ATLAS ITk条形探测器

Proceedings of The 27th International Workshop on Vertex Detectors — PoS(VERTEX2018) Pub Date : 2019-09-03 DOI: 10.22323/1.348.0025

A. Blue

{"title":"ATLAS ITk Strip Detector for High-Luminosity LHC","authors":"A. Blue","doi":"10.22323/1.348.0025","DOIUrl":"https://doi.org/10.22323/1.348.0025","url":null,"abstract":"The High Luminosity Large Hadron Collider (HL-LHC) will operate at an ultimate peak instantaneous luminosity of mbox{$7.5times10^{34};mathrm{cm}^{-2}mathrm{s}^{-1}$} which corresponds to approximately 200 inelastic proton-proton collisions per beam crossing (pile-up). It will be operational for more than 10 years and in that time ATLAS aims for a total data set of 4000 fb$^{-1}$. To operate at the higher data rates, withstand the radiation levels, and maintain low occupancy in the high pile-up environment, the current ATLAS Inner Detector (ID) will be replaced by a new Inner Tracker (ITk). The ITk will be an all-silicon tracking system that consists of a pixel detector at small radius close to the beam pipe and a large area strip tracker surrounding it. This contribution focuses on the strip region of the ITk. The central part of the strip tracker will be composed of rectangular 'short' (2.5 cm) and 'long' (5 cm) strip sensors. The forward regions of the strip tracker consist of 6 disks per side, with trapezoidal shaped microstrip sensors of various lengths and strip pitches. In response to the needs of the strip region for the ITk, highly modular structures are being studied and developed, called staves for the central region and petals for the forward regions (end-caps). These structures integrate large numbers of sensors and readout electronics, with precision light weight mechanical elements and cooling structures. A strong prototyping effort has been put in place over the course of the last years in order to optimize the ITk strip system. This contribution summarizes the R&D activities performed by the numerous institutes within the Strips ITk collaboration showing the transition from protoyping to final production.","PeriodicalId":267466,"journal":{"name":"Proceedings of The 27th International Workshop on Vertex Detectors — PoS(VERTEX2018)","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-09-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117223966","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Operational experience with the Silicon Strip Tracker at the CMS experiment 在CMS实验中使用硅条跟踪器的操作经验

Proceedings of The 27th International Workshop on Vertex Detectors — PoS(VERTEX2018) Pub Date : 2019-09-03 DOI: 10.22323/1.348.0003

Ivan Shvetsov

引用次数: 1

Quality Control for ATLAS Inner Tracker Strip Sensor Production ATLAS内跟踪带传感器生产的质量控制

Proceedings of The 27th International Workshop on Vertex Detectors — PoS(VERTEX2018) Pub Date : 2019-09-03 DOI: 10.22323/1.348.0056

C. Klein

引用次数: 0

Fabrication of Aluminum-carbon fiber bridge, stump and pipe connector for Phase-II upgrade 二期改造用铝碳纤维桥架、桩端及管接头的制造

Proceedings of The 27th International Workshop on Vertex Detectors — PoS(VERTEX2018) Pub Date : 2019-09-03 DOI: 10.22323/1.348.0060

Ngangkham Peter Singh, R. Ranjan, D. Srinivasu, P. Behera

引用次数: 0

Tracking particles at fluences 5-10$cdot$10$^{16}$ n$_{eq}$/cm$^2$ 在影响5-10$cdot$10$^{16}$ n$_{eq}$/cm$^2$处跟踪粒子

Proceedings of The 27th International Workshop on Vertex Detectors — PoS(VERTEX2018) Pub Date : 2019-08-30 DOI: 10.22323/1.348.0029

N. Cartiglia, H. Sadrozinski, A. Seiden

引用次数: 2

Timepix3 performance in pulsed power operation 脉冲功率操作中的Timepix3性能

Proceedings of The 27th International Workshop on Vertex Detectors — PoS(VERTEX2018) Pub Date : 2019-03-01 DOI: 10.22323/1.348.0059

E. P. Codina

{"title":"Timepix3 performance in pulsed power operation","authors":"E. P. Codina","doi":"10.22323/1.348.0059","DOIUrl":"https://doi.org/10.22323/1.348.0059","url":null,"abstract":"The physics aims at the proposed CLIC linear e+e− collider impose challenging requirements on the performance of the detector system. In particular for the vertex detector the principal challenge is building an ultra-low mass (∼0.2% X0 per layer) detector that can provide a single point resolution of a few micrometers as well as 10 ns time slicing capabilities. To reach such low material budget, CLIC uses an air-flow cooling system in the inner vertex region. This requires very low power dissipation, which is achieved by exploiting CLIC’s low duty cycle (∼< 0.001%) and beam structure, allowing pulsed power operation of the pixel detector. Timepix3 includes power pulsing features, such as, in the analog domain, allowing to switch dynamically between nominal power and shutdown modes, and, in the digital domain, gating the clock of the pixel matrix. This contribution reports the performance of the Timepix3 chip in pulsed power operation, in terms of power saving, detection efficiency and noise performance. Measurements were performed in beam tests taking as reference tracks provided by a telescope, as well as in the laboratory using a radioactive source.","PeriodicalId":267466,"journal":{"name":"Proceedings of The 27th International Workshop on Vertex Detectors — PoS(VERTEX2018)","volume":"2013 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114712452","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Status of silicon detector R&D at CLIC CLIC硅探测器研发现状

Proceedings of The 27th International Workshop on Vertex Detectors — PoS(VERTEX2018) Pub Date : 2019-02-25 DOI: 10.22323/1.348.0033

M. Münker

{"title":"Status of silicon detector R&D at CLIC","authors":"M. Münker","doi":"10.22323/1.348.0033","DOIUrl":"https://doi.org/10.22323/1.348.0033","url":null,"abstract":"The Compact Linear Collider CLIC, a multi-TeV linear electron-positron collider, aims at precision measurements of the Standard Model, as well as direct and indirect searches of physics beyond the Standard Model. These aims translate into challenging requirements imposed on the detector. To reach these requirements, a silicon tracking system is envisaged, being composed of a low-mass vertex detector and a large scale tracker. While the requirements on the tracker are mainly driven by the need for a precise momentum resolution, the requirements on the vertex detector are mainly motivated by the demand on reconstructing secondary vertices from heavy-flavour quarks. A single point spatial resolution of a few micrometres is required for the tracking system together with a material budget of 0.2% of a radiation length per detection layer in the innermost layers. To mitigate hit rates from beam-induced background particles, a timing resolution in the order of a few nanoseconds is needed and the cell sizes are restricted down to 25 μm x 25 μm in the vertex detector and 25 μm − 10 mm in the tracker. To evaluate which technology can meet these requirements, a broad silicon detector R&D is performed for a selected choice of technologies.","PeriodicalId":267466,"journal":{"name":"Proceedings of The 27th International Workshop on Vertex Detectors — PoS(VERTEX2018)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-02-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128846754","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Construction and Quality Assurance of the Belle II Silicon Vertex Detector 百丽II型硅顶点探测器的构造与质量保证

Proceedings of The 27th International Workshop on Vertex Detectors — PoS(VERTEX2018) Pub Date : 2019-01-28 DOI: 10.22323/1.348.0051

P. Resmi, H. Aihara, T. Aziz, S. Bacher, S. Bahinipati, E. Barberio, T. Baroncelli, T. Baroncelli, A. Basith, G. Batignani, A. Bauer, P. Behera, V. Bertacchi, S. Bettarini, B. Bhuyan, T. Bilka, F. Bosi, L. Bosisio, A. Bozek, F. Buchsteiner, G. Caria, G. Casarosa, M. Ceccanti, D. Červenkov, T. Czank, N. Dash, M. Nuccio, Z. Doležal, F. Forti, M. Friedl, B. Gobbo, J. Grimaldo, K. Hara, T. Higuchi, C. Irmler, A. Ishikawa, H. Jeon, C. Joo, M. Kaleta, J. Kandra, K. Kang, P. Kodyš, T. Kohriki, I. Komorov, Manish Kumar, R. Kumar, P. Kvasnička, C. Licata, K. Lalwani, L. Lanceri, J. Y. Lee, S. C. Lee, Y. B. Li, J. Libby, T. Lueck, P. Mammini, A. Martini, S. Mayekar, G. Mohanty, T. Morii, K. Nakamura, Z. Natkaniec, Y. Onuki, W. Ostrowicz, A. Paladino, E. Paoloni, H. K. Park, K. Prasanth, A. Profeti, K. K. Rao, I. Rashevskaya, G. Rizzo, M. Rozanska, D. Sahoo, J. Sasaki, N. Sato, S. Schultschik, C. Schwanda, J. Stypuła, J. Suzuki, S. Tanaka, H. Tanigawa, G. Taylor, R. Thalmeier, T. Tsuboyama, P. Urquijo, L. Vitale, K.

{"title":"Construction and Quality Assurance of the Belle II Silicon Vertex Detector","authors":"P. Resmi, H. Aihara, T. Aziz, S. Bacher, S. Bahinipati, E. Barberio, T. Baroncelli, T. Baroncelli, A. Basith, G. Batignani, A. Bauer, P. Behera, V. Bertacchi, S. Bettarini, B. Bhuyan, T. Bilka, F. Bosi, L. Bosisio, A. Bozek, F. Buchsteiner, G. Caria, G. Casarosa, M. Ceccanti, D. Červenkov, T. Czank, N. Dash, M. Nuccio, Z. Doležal, F. Forti, M. Friedl, B. Gobbo, J. Grimaldo, K. Hara, T. Higuchi, C. Irmler, A. Ishikawa, H. Jeon, C. Joo, M. Kaleta, J. Kandra, K. Kang, P. Kodyš, T. Kohriki, I. Komorov, Manish Kumar, R. Kumar, P. Kvasnička, C. Licata, K. Lalwani, L. Lanceri, J. Y. Lee, S. C. Lee, Y. B. Li, J. Libby, T. Lueck, P. Mammini, A. Martini, S. Mayekar, G. Mohanty, T. Morii, K. Nakamura, Z. Natkaniec, Y. Onuki, W. Ostrowicz, A. Paladino, E. Paoloni, H. K. Park, K. Prasanth, A. Profeti, K. K. Rao, I. Rashevskaya, G. Rizzo, M. Rozanska, D. Sahoo, J. Sasaki, N. Sato, S. Schultschik, C. Schwanda, J. Stypuła, J. Suzuki, S. Tanaka, H. Tanigawa, G. Taylor, R. Thalmeier, T. Tsuboyama, P. Urquijo, L. Vitale, K.","doi":"10.22323/1.348.0051","DOIUrl":"https://doi.org/10.22323/1.348.0051","url":null,"abstract":"The Belle II experiment, which is situated at the interaction point of the SuperKEKB $e^+e^{-}$ collider at KEK, Tsukuba, Japan, is expected to collect data corresponding to an integrated luminosity of 50~ab$^{- 1}$. This data set will be sensitive to beyond-the-standard-model physics via precision measurements and searches for very rare decays. At its heart lies a six-layer vertex detector consisting of two layers of pixel detectors (PXD) and four layers of double-sided silicon microstrip detectors (SVD). Precise vertexing as provided by this device is essential for measurements of time-dependent $CP$ violation. Crucial aspects of the SVD assembly are precise alignment, as well as rigorous electrical and geometrical quality assurance. We present an overview of the construction of the SVD, including the precision gluing of SVD component modules and the wire-bonding of various electrical components. We also discuss the electrical and geometrical quality assurance tests.","PeriodicalId":267466,"journal":{"name":"Proceedings of The 27th International Workshop on Vertex Detectors — PoS(VERTEX2018)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133546486","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0