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Challenges for Automating PCB Layout 自动化 PCB 布局面临的挑战
ACM International Symposium on Physical Design Pub Date : 2024-03-12 DOI: 10.1145/3626184.3635285
Wen-Hao Liu, Anthony Agnesina, Haoxing Ren
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引用次数: 0
FastTuner: Transferable Physical Design Parameter Optimization using Fast Reinforcement Learning FastTuner：利用快速强化学习进行可转移的物理设计参数优化
ACM International Symposium on Physical Design Pub Date : 2024-03-12 DOI: 10.1145/3626184.3633328
Hao-Hsiang Hsiao, Yi-Chen Lu, Pruek Vanna-Iampikul, S. Lim
{"title":"FastTuner: Transferable Physical Design Parameter Optimization using Fast Reinforcement Learning","authors":"Hao-Hsiang Hsiao, Yi-Chen Lu, Pruek Vanna-Iampikul, S. Lim","doi":"10.1145/3626184.3633328","DOIUrl":"https://doi.org/10.1145/3626184.3633328","url":null,"abstract":"","PeriodicalId":262167,"journal":{"name":"ACM International Symposium on Physical Design","volume":"100 5","pages":"93-101"},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140395478","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
AI for EDA/Physical Design: Driving the AI Revolution: The Crucial Role of 3D-IC 用于 EDA/物理设计的人工智能：推动人工智能革命：3D-IC 的关键作用
ACM International Symposium on Physical Design Pub Date : 2024-03-12 DOI: 10.1145/3626184.3635275
Erick Chao
{"title":"AI for EDA/Physical Design: Driving the AI Revolution: The Crucial Role of 3D-IC","authors":"Erick Chao","doi":"10.1145/3626184.3635275","DOIUrl":"https://doi.org/10.1145/3626184.3635275","url":null,"abstract":"","PeriodicalId":262167,"journal":{"name":"ACM International Symposium on Physical Design","volume":"73 4","pages":"113"},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140395556","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
SMT-Based Layout Synthesis Approaches for Quantum Circuits 基于 SMT 的量子电路布局合成方法
ACM International Symposium on Physical Design Pub Date : 2024-03-12 DOI: 10.1145/3626184.3633316
Zi-Hao Guo, Ting-Chi Wang
{"title":"SMT-Based Layout Synthesis Approaches for Quantum Circuits","authors":"Zi-Hao Guo, Ting-Chi Wang","doi":"10.1145/3626184.3633316","DOIUrl":"https://doi.org/10.1145/3626184.3633316","url":null,"abstract":"","PeriodicalId":262167,"journal":{"name":"ACM International Symposium on Physical Design","volume":"90 4","pages":"235-243"},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140395525","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Timing-Driven Analytical Placement According to Expected Cell Distribution Range 根据预期单元分布范围进行定时驱动的分析式布局
ACM International Symposium on Physical Design Pub Date : 2024-03-12 DOI: 10.1145/3626184.3633318
Jai-Ming Lin, You-Yu Chang, Wei-Lun Huang
{"title":"Timing-Driven Analytical Placement According to Expected Cell Distribution Range","authors":"Jai-Ming Lin, You-Yu Chang, Wei-Lun Huang","doi":"10.1145/3626184.3633318","DOIUrl":"https://doi.org/10.1145/3626184.3633318","url":null,"abstract":"","PeriodicalId":262167,"journal":{"name":"ACM International Symposium on Physical Design","volume":"38 s169","pages":"177-184"},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140394860","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
GPU/ML-Enhanced Large Scale Global Routing Contest GPU/ML 增强型大规模全球路由竞赛
ACM International Symposium on Physical Design Pub Date : 2024-03-12 DOI: 10.1145/3626184.3639693
Rongjian Liang, Anthony Agnesina, Wen-Hao Liu, Haoxing Ren
{"title":"GPU/ML-Enhanced Large Scale Global Routing Contest","authors":"Rongjian Liang, Anthony Agnesina, Wen-Hao Liu, Haoxing Ren","doi":"10.1145/3626184.3639693","DOIUrl":"https://doi.org/10.1145/3626184.3639693","url":null,"abstract":"","PeriodicalId":262167,"journal":{"name":"ACM International Symposium on Physical Design","volume":"25 S64","pages":"269-274"},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140394916","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Routing-aware Legal Hybrid Bonding Terminal Assignment for 3D Face-to-Face Stacked ICs 针对三维面对面堆叠集成电路的路由感知型合法混合邦定端子分配
ACM International Symposium on Physical Design Pub Date : 2024-03-12 DOI: 10.1145/3626184.3633322
Siting Liu, Jiaxi Jiang, Zhuolun He, Ziyi Wang, Yibo Lin, Bei Yu, Martin D F Wong
{"title":"Routing-aware Legal Hybrid Bonding Terminal Assignment for 3D Face-to-Face Stacked ICs","authors":"Siting Liu, Jiaxi Jiang, Zhuolun He, Ziyi Wang, Yibo Lin, Bei Yu, Martin D F Wong","doi":"10.1145/3626184.3633322","DOIUrl":"https://doi.org/10.1145/3626184.3633322","url":null,"abstract":"Face-to-face (F2F) stacked 3D IC is a promising alternative for scaling beyond Moore’s Law. In F2F 3D ICs, dies are connected through bonding terminals whose positions can significantly impact routing performance. Further, there exists resource competition among all the 3D nets due to the constrained bonding terminal number. In advanced technology nodes, such 3D integration may also introduce legality challenges of bonding terminals, as the metal pitches can be much smaller than the sizes of bonding terminals. Previous works attempt to insert bonding terminals automatically using existing 2D commercial P&R tools and then consider inter-die connection legality, but they fail to take the legality and routing performance into account simultaneously. In this paper, we explore the formulation of the generalized assignment in the hybrid bonding terminal assignment problem. Our framework, BTAssign , offers a strict legality guarantee and an iterative solution. The experiments are conducted on 18 open-source designs with various 3D net densities and the most advanced bonding scale. The results reveal that BTAssign can achieve improvements in routed wirelength under all testing conditions from 1 . 0% to 5 . 0% with a tolerable runtime overhead.","PeriodicalId":262167,"journal":{"name":"ACM International Symposium on Physical Design","volume":"97 12","pages":"75-82"},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140395319","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Pioneering Contributions of Professor Martin D. F. Wong to Automatic Floorplan Design Martin D. F. Wong 教授对自动平面设计的开创性贡献
ACM International Symposium on Physical Design Pub Date : 2024-03-12 DOI: 10.1145/3626184.3635291
Ting-Chi Wang
{"title":"Pioneering Contributions of Professor Martin D. F. Wong to Automatic Floorplan Design","authors":"Ting-Chi Wang","doi":"10.1145/3626184.3635291","DOIUrl":"https://doi.org/10.1145/3626184.3635291","url":null,"abstract":"","PeriodicalId":262167,"journal":{"name":"ACM International Symposium on Physical Design","volume":"55 5","pages":"229"},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140394465","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
MedPart: A Multi-Level Evolutionary Differentiable Hypergraph Partitioner MedPart：多级进化可微分超图分割器
ACM International Symposium on Physical Design Pub Date : 2024-03-12 DOI: 10.1145/3626184.3633319
Rongjian Liang, Anthony Agnesina, Haoxing Ren
{"title":"MedPart: A Multi-Level Evolutionary Differentiable Hypergraph Partitioner","authors":"Rongjian Liang, Anthony Agnesina, Haoxing Ren","doi":"10.1145/3626184.3633319","DOIUrl":"https://doi.org/10.1145/3626184.3633319","url":null,"abstract":"","PeriodicalId":262167,"journal":{"name":"ACM International Symposium on Physical Design","volume":"39 s175","pages":"3-11"},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140395072","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Accelerating Physical Design from 1 to N 加速物理设计，从 1 到 N
ACM International Symposium on Physical Design Pub Date : 2024-03-12 DOI: 10.1145/3626184.3638040
Evangeline F. Y. Young
{"title":"Accelerating Physical Design from 1 to N","authors":"Evangeline F. Y. Young","doi":"10.1145/3626184.3638040","DOIUrl":"https://doi.org/10.1145/3626184.3638040","url":null,"abstract":"","PeriodicalId":262167,"journal":{"name":"ACM International Symposium on Physical Design","volume":"93 12","pages":"227"},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140395343","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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