发布求助
文献互助 智能选刊 最新文献

ACM International Symposium on Physical Design最新文献

筛选
英文 中文
Practical Mixed-Cell-Height Legalization Considering Vertical Cell Abutment Constraint 考虑到垂直小区支墩约束的实用混合小区高度合法化
ACM International Symposium on Physical Design Pub Date : 2024-03-12 DOI: 10.1145/3626184.3633317
Teng-Ping Huang, Shao-Yun Fang
{"title":"Practical Mixed-Cell-Height Legalization Considering Vertical Cell Abutment Constraint","authors":"Teng-Ping Huang, Shao-Yun Fang","doi":"10.1145/3626184.3633317","DOIUrl":"https://doi.org/10.1145/3626184.3633317","url":null,"abstract":"","PeriodicalId":262167,"journal":{"name":"ACM International Symposium on Physical Design","volume":"66 5","pages":"151-159"},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140394517","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Reinforcement Learning or Simulated Annealing for Analog Placement? A Study based on Bounded-Sliceline Grids 模拟放置的强化学习还是模拟退火？基于有界切线网格的研究
ACM International Symposium on Physical Design Pub Date : 2024-03-12 DOI: 10.1145/3626184.3635281
M. Lin, Chou-Chen Lee, Yi-Chao Hsieh
{"title":"Reinforcement Learning or Simulated Annealing for Analog Placement? A Study based on Bounded-Sliceline Grids","authors":"M. Lin, Chou-Chen Lee, Yi-Chao Hsieh","doi":"10.1145/3626184.3635281","DOIUrl":"https://doi.org/10.1145/3626184.3635281","url":null,"abstract":"","PeriodicalId":262167,"journal":{"name":"ACM International Symposium on Physical Design","volume":"59 5","pages":"143-150"},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140394675","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
PANEL: EDA Challenges at Advanced Technology Nodes A 小组讨论：先进技术节点 A 的 EDA 挑战
ACM International Symposium on Physical Design Pub Date : 2024-03-12 DOI: 10.1145/3626184.3639698
Eugene Liu
{"title":"PANEL: EDA Challenges at Advanced Technology Nodes A","authors":"Eugene Liu","doi":"10.1145/3626184.3639698","DOIUrl":"https://doi.org/10.1145/3626184.3639698","url":null,"abstract":"","PeriodicalId":262167,"journal":{"name":"ACM International Symposium on Physical Design","volume":"39 S173","pages":"67"},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140395074","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Engineering the Future of IC Design with AI 用人工智能设计集成电路的未来
ACM International Symposium on Physical Design Pub Date : 2024-03-12 DOI: 10.1145/3626184.3639691
Ruchir Puri
{"title":"Engineering the Future of IC Design with AI","authors":"Ruchir Puri","doi":"10.1145/3626184.3639691","DOIUrl":"https://doi.org/10.1145/3626184.3639691","url":null,"abstract":"","PeriodicalId":262167,"journal":{"name":"ACM International Symposium on Physical Design","volume":"4 2","pages":"1"},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140395106","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Novel Transformer Model Based Clustering Method for Standard Cell Design Automation 用于标准单元设计自动化的基于变压器模型的新型聚类方法
ACM International Symposium on Physical Design Pub Date : 2024-03-12 DOI: 10.1145/3626184.3633314
Chia-Tung Ho, Ajay Chandna, David Guan, Alvin Ho, Minsoo Kim, Yaguang Li, Haoxing Ren
{"title":"Novel Transformer Model Based Clustering Method for Standard Cell Design Automation","authors":"Chia-Tung Ho, Ajay Chandna, David Guan, Alvin Ho, Minsoo Kim, Yaguang Li, Haoxing Ren","doi":"10.1145/3626184.3633314","DOIUrl":"https://doi.org/10.1145/3626184.3633314","url":null,"abstract":"","PeriodicalId":262167,"journal":{"name":"ACM International Symposium on Physical Design","volume":"29 S92","pages":"195-203"},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140395188","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IncreMacro: Incremental Macro Placement Refinement IncreMacro：增量宏置放精细化
ACM International Symposium on Physical Design Pub Date : 2024-03-12 DOI: 10.1145/3626184.3633321
Yuan Pu, Tinghuan Chen, Zhuolun He, Chen Bai, Haisheng Zheng, Yibo Lin, Bei Yu
{"title":"IncreMacro: Incremental Macro Placement Refinement","authors":"Yuan Pu, Tinghuan Chen, Zhuolun He, Chen Bai, Haisheng Zheng, Yibo Lin, Bei Yu","doi":"10.1145/3626184.3633321","DOIUrl":"https://doi.org/10.1145/3626184.3633321","url":null,"abstract":"This paper proposes IncreMacro , a novel approach for macro placement refinement in the context of integrated circuit (IC) design. The suggested approach iteratively and incrementally optimizes the placement of macros in order to enhance IC layout routability and timing performance. To achieve this, IncreMacro utilizes several methods including kd-tree-based macro diagnosis, gradient-based macro shifting and constraint-graph-based LP for macro legalization. By employing these techniques iteratively, IncreMacro meets two critical solution requirements of macro placement: (1) pushing macros to the chip boundary; and (2) preserving the original macro relative positional relationship. The proposed approach has been incorporated into DREAMPlace and AutoDMP , and is evaluated on several RISC-V benchmark circuits at the 7-nm technology node. Experimental results show that, compared with the macro placement solution provided by DREAMPlace ( AutoDMP ), IncreMacro reduces routed wirelength by 6.5% (16.8%), improves the routed worst negative slack (WNS) and total negative slack (TNS) by 59.9% (99.6%) and 63.9% (99.9%), and reduces the total power consumption by 3.3% (4.9%).","PeriodicalId":262167,"journal":{"name":"ACM International Symposium on Physical Design","volume":"104 9","pages":"169-176"},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140395688","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
DSO.ai - A Distributed System to Optimize Physical Design Flows DSO.ai - 优化物理设计流程的分布式系统
ACM International Symposium on Physical Design Pub Date : 2024-03-12 DOI: 10.1145/3626184.3639780
P. Verma
{"title":"DSO.ai - A Distributed System to Optimize Physical Design Flows","authors":"P. Verma","doi":"10.1145/3626184.3639780","DOIUrl":"https://doi.org/10.1145/3626184.3639780","url":null,"abstract":"","PeriodicalId":262167,"journal":{"name":"ACM International Symposium on Physical Design","volume":"60 2","pages":"115-116"},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140394672","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Introduction of 3D IC Thermal Analysis Flow 3D 集成电路热分析流程介绍
ACM International Symposium on Physical Design Pub Date : 2024-03-12 DOI: 10.1145/3626184.3635283
Alex Hung
{"title":"Introduction of 3D IC Thermal Analysis Flow","authors":"Alex Hung","doi":"10.1145/3626184.3635283","DOIUrl":"https://doi.org/10.1145/3626184.3635283","url":null,"abstract":"","PeriodicalId":262167,"journal":{"name":"ACM International Symposium on Physical Design","volume":"81 4","pages":"213"},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140395473","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Solvers, Engines, Tools and Flows: The Next Wave for AI/ML in Physical Design 求解器、引擎、工具和流程：物理设计领域人工智能/ML 的下一波浪潮
ACM International Symposium on Physical Design Pub Date : 2024-03-12 DOI: 10.1145/3626184.3635277
Andrew B. Kahng
{"title":"Solvers, Engines, Tools and Flows: The Next Wave for AI/ML in Physical Design","authors":"Andrew B. Kahng","doi":"10.1145/3626184.3635277","DOIUrl":"https://doi.org/10.1145/3626184.3635277","url":null,"abstract":"It has been six years since an ISPD-2018 invited talk on “Machine Learning Applications in Physical Design” [25]. Since then, despite considerable activity across both academia and industry, many R&D targets remain open. At the same time, there is now clearer understanding of where AI/ML can and cannot (yet) move the needle in physical design, as well as some of the difficult blockers and technical challenges that lie ahead. Some futures for AI/ML-boosted physical design are visible across solvers, engines, tools and flows – and in contexts that span generative AI, the modeling of “magic” handoffs at flow interstices, academic research infrastructure, and the culture of benchmarking and open-source EDA.","PeriodicalId":262167,"journal":{"name":"ACM International Symposium on Physical Design","volume":"96 5","pages":"117-124"},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140395494","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Scheduling and Physical Design 调度和物理设计
ACM International Symposium on Physical Design Pub Date : 2024-03-12 DOI: 10.1145/3626184.3635290
Jason Cong
{"title":"Scheduling and Physical Design","authors":"Jason Cong","doi":"10.1145/3626184.3635290","DOIUrl":"https://doi.org/10.1145/3626184.3635290","url":null,"abstract":"","PeriodicalId":262167,"journal":{"name":"ACM International Symposium on Physical Design","volume":"28 4","pages":"219-225"},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140395627","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
下一页 尾页
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：604180095
Book学术官方微信
小红书