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2011 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP)最新文献

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A closed-loop micromachined accelerometer based on thermal convection 基于热对流的闭环微机械加速度计
2011 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP) Pub Date : 2011-05-11 DOI: 10.1049/MNL.2012.0702
A. Garraud, P. Combette, B. Charlot, P. Loisel, A. Giani
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引用次数: 12
Wafer-level glass-caps for advanced optical applications 用于先进光学应用的晶圆级玻璃帽
2011 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP) Pub Date : 2011-05-11 DOI: 10.1109/ECTC.2011.5898732
J. Leib, O. Gyenge, U. Hansen, S. Maus, K. Hauck, K. Zoschke, M. Toepper
{"title":"Wafer-level glass-caps for advanced optical applications","authors":"J. Leib, O. Gyenge, U. Hansen, S. Maus, K. Hauck, K. Zoschke, M. Toepper","doi":"10.1109/ECTC.2011.5898732","DOIUrl":"https://doi.org/10.1109/ECTC.2011.5898732","url":null,"abstract":"A novel process flow to manufacture miniaturized optical windows on wafer-level is presented. Those windows can be used for miniaturized optical products like high-brightness LEDs (HB-LED) and digital projection (DLP) as well as more complex optical data-communication, since integrated optical functions can be implemented with low tolerances. We explain the fabrication of cap-wafers having a shallow cavity with a depth of typically 10 μm used in photo sensors and a unique manufacturing process for cap-wafers with a deep cavity of e.g. 300 μm used in LED packaging. Those cap-wafers are used in wafer-level integration of advanced, miniaturized optical products. We discuss two options for wafer bonding i.e. bonding using adhesive as well as anodic bonding. As an example on product level a miniaturized photo sensor package, a pressure sensor package as well as a LED package is discussed.","PeriodicalId":261909,"journal":{"name":"2011 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP)","volume":"69 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126704205","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
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