2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献

Data analytics approach for optimal qualification testing of electronic components 电子元件最佳合格测试的数据分析方法

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2018-05-31 DOI: 10.1109/EUROSIME.2018.8369926

S. Stoyanov, M. Ahsan, C. Bailey

{"title":"Data analytics approach for optimal qualification testing of electronic components","authors":"S. Stoyanov, M. Ahsan, C. Bailey","doi":"10.1109/EUROSIME.2018.8369926","DOIUrl":"https://doi.org/10.1109/EUROSIME.2018.8369926","url":null,"abstract":"In electronics manufacturing, required quality of electronic components and parts is ensured through qualification testing using standards and user-defined requirements. The challenge for the industry is that product qualification testing is time-consuming and comes at a substantial cost. The work reported with this paper focus on the development and demonstration of a novel approach that can support “smart qualification testing” by using data analytics and data-driven prognostics modelling. Data analytics approach is developed and applied to historical qualification test datasets for an electronic module (Device under Test, DUT). The qualification spec involves a series of sequentially performed electrical and functional parameter tests on the DUTs. Data analytics is used to identify the tests that are sensitive to pending failure as well as to cross-evaluate the similarity in measurements between all tests, thus generating also knowledge on potentially redundant tests. The capability of data-driven prognostics modelling, using machine learning techniques and available historical qualification datasets, is also investigated. The results obtained from the study showed that predictive models developed from the identified so-called “sensitive to pending failure” tests feature superior performance compared with conventional, as measured, use of the test data. This work is both novel and original because at present, to the best knowledge of the authors, no similar predictive analytics methodology for qualification test time reduction (respectively cost reduction) is used in the electronics industry.","PeriodicalId":216833,"journal":{"name":"2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132388359","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Self-assembly of high performance on-chip RF-MEMS inductors using internal stress 利用内应力自组装高性能片上RF-MEMS电感器

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2018-05-31 DOI: 10.1109/EUROSIME.2018.8369888

Rayan Bajwa, M. Yapici

引用次数: 2

Design, modelling, and characterization of display compatible pMUT device 设计，建模，并表征显示兼容的pMUT设备

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2018-05-30 DOI: 10.1109/EUROSIME.2018.8369931

C. Huang, H. Gao, G. Torri, S. Mao, Y. Jeong, D. Cheyns, V. Rochus, X. Rottenberg

{"title":"Design, modelling, and characterization of display compatible pMUT device","authors":"C. Huang, H. Gao, G. Torri, S. Mao, Y. Jeong, D. Cheyns, V. Rochus, X. Rottenberg","doi":"10.1109/EUROSIME.2018.8369931","DOIUrl":"https://doi.org/10.1109/EUROSIME.2018.8369931","url":null,"abstract":"In this paper, the design, modeling, and characterization of a display compatible pMUT platform are presented. A FEM model is built using COMSOL Multiphysics for evaluating the frequency response, mechanical performance, acoustic pressure, and driving efficiency of our pMUT device across all vibration modes of circular plates. In parallel with it, a first mode analytical model has been developed including electrical, mechanical, and acoustic domains to provide fast estimation for future design. A laser Doppler vibrometer is used to measure the frequency response, displacement, velocity as well as mode shapes of pMUTs with different designs in air. The measured resonance frequency of first mode range from 121.5kHz to 1.1MHz with radius from 500μm to 120μm and fits the prediction of FEM and analytical models. A standard reference microphone is used to measure the acoustic pressure of pMUT inside its frequency range (<125 kHz). The measured acoustic pressure on transverse axis of a 500μm radius pMUT also fits the values from analytical model on acoustic domain.","PeriodicalId":216833,"journal":{"name":"2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"82 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-05-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131606761","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Design and test of a 3D printed acoustic fresnel lens 3D打印菲涅耳透镜的设计与测试

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2018-05-30 DOI: 10.1109/EUROSIME.2018.8369933

G. Torri, M. Signorelli, C. Huang, R. Haouari, S. Mao, X. Rottenberg

引用次数: 0

Simulation and characterization of a high-sensitive micro-opto-mechanical Microphone 高灵敏度微光机械传声器的仿真与特性研究

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2018-05-30 DOI: 10.1109/EUROSIME.2018.8369932

H. Gao, C. Huang, W. Westerveld, R. Haouari, B. Troia, F. Verhaegen, R. Jansen, B. Figeys, X. Rottenberg, V. Rochus

引用次数: 5

Investigation of trapping behaviour in GaN HEMTs through physical TCAD simulation of capacitance voltage characteristics 通过物理TCAD模拟电容电压特性来研究GaN hemt的捕获行为

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2018-04-16 DOI: 10.1109/EUROSIME.2018.8369924

K. Mukherjee, A. Curutchet, F. Darracq, N. Malbert, N. Labat

{"title":"Investigation of trapping behaviour in GaN HEMTs through physical TCAD simulation of capacitance voltage characteristics","authors":"K. Mukherjee, A. Curutchet, F. Darracq, N. Malbert, N. Labat","doi":"10.1109/EUROSIME.2018.8369924","DOIUrl":"https://doi.org/10.1109/EUROSIME.2018.8369924","url":null,"abstract":"GaN based HEMTs are setting performance standards for superior efficiency and high-power operation. However, material defects, manifested in the form of traps is threatening progress through substantially limiting charge transport and degrading the two-dimensional electron gas density. These effects are often worsened under high frequency conditions. This work utilizes TCAD simulation to build a physics-based model of a GaN HEMT, and provide detailed insight into acceptor trap behavior localized at four critical structural regions, through transient capacitance-voltage (C-V) simulations at multiple frequencies. Small signal capacitance profiles are extracted at different drain biases to reflect the charge distribution and illustrate individual and relative effects of each trap type at different stages of transistor operation. This offers a deeper, predictive understanding by isolating trapping processes that simultaneously impact device operation for a real device.","PeriodicalId":216833,"journal":{"name":"2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128837604","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Robustness of BGAs: Parametric study of voids' distribution in SAC solder joints BGAs的鲁棒性:SAC焊点中空洞分布的参数化研究

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2018-04-16 DOI: 10.1109/EUROSIME.2018.8369939

S. Pin, A. Gracia, J. Delétage, J. Fouquet, H. Frémont

{"title":"Robustness of BGAs: Parametric study of voids' distribution in SAC solder joints","authors":"S. Pin, A. Gracia, J. Delétage, J. Fouquet, H. Frémont","doi":"10.1109/EUROSIME.2018.8369939","DOIUrl":"https://doi.org/10.1109/EUROSIME.2018.8369939","url":null,"abstract":"The study aims at evaluating by simulation the impact of voids on the mechanical behaviour of a BGA solder joint. The Finite Element (FE) method is adapted to achieve such a task where an infinite number of different void distributions is possible. The modelling process involves a global calculation of a thermal load and a refined sub model. The global model represents a quarter of an electronic package soldered to a piece of PCB while the submodel is limited to a single ball with coper pads and defects under investigation i.e. intermetallic compounds (IMC) and voids. Creep properties are taken into account to model mechanical response of the lead-free solder SAC 305. The simulation of a thermal cycle is performed on the global model with only elastic properties. The nodal displacements are extracted from the results to be applied to the submodel's mesh. True viscoplastic mechanical behaviour is simulated in this refined model to get the RoHS solder material response with respect to different defects' considerations. The void distribution is handled with 4 parameters driving the height and thickness of the layer of apparition, the size and the proximity of voids. Simulating the effects of these parameters can afford to sort them for future reliability assessments via Finite Element methods.","PeriodicalId":216833,"journal":{"name":"2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121050311","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Lifetime modelling and geometry optimization of meander tracks in stretchable electronics 可拉伸电子学中曲径轨道的寿命建模与几何优化

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2018-04-15 DOI: 10.1109/EUROSIME.2018.8369887

A. Grams, S. Kuttler, T. Löher, H. Walter, O. Wittier, K. Lang

引用次数: 3

Parametric model order reduction of a thermoelectric generator for electrically active implants 电活性植入物热电发生器参数化模型降阶

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2018-04-15 DOI: 10.1109/EUROSIME.2018.8369946

C. Yuan, O. Jadhav, E. Rudnyi, D. Hohlfeld, T. Bechtold

引用次数: 6

Lumen maintenance prediction for LEDs — New insights led的流明维护预测-新见解

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2018-04-15 DOI: 10.1109/EUROSIME.2018.8369895

B. Jacobs, W. V. van Driel, M. Schuld

引用次数: 1