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2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON)最新文献

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Performance Validation of ALSE Using In-house Fabricated Long Wire Antenna 利用国产长线天线对自激光放大器进行性能验证
2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON) Pub Date : 2019-11-01 DOI: 10.1109/GEMCCON48223.2019.9132832
Mahesh Chaluvadi, G. Mahesh, K. G. Thomas
{"title":"Performance Validation of ALSE Using In-house Fabricated Long Wire Antenna","authors":"Mahesh Chaluvadi, G. Mahesh, K. G. Thomas","doi":"10.1109/GEMCCON48223.2019.9132832","DOIUrl":"https://doi.org/10.1109/GEMCCON48223.2019.9132832","url":null,"abstract":"The International standard CISPR 25 is applicable to any electrical/electronic component intended for use in vehicles, trailers and devices. In order to minimize the effect of Absorber Lined Shielded Enclosure (ALSE) on measured electric field, the latest edition of CISPR 25 has introduced a procedure in Annexure J for validation of ALSEs in the frequency range of 150 kHz to 1 GHz. The standard proposed two methods for ALSE validation viz. Reference measurement method and Modelled long wire antenna method. In this paper, validation of SAMEER’s Semi-Anechoic Chamber (SAC) using Modelled long wire antenna method is explained. Design and fabrication details of long wire antenna along with measured results are also presented.","PeriodicalId":216814,"journal":{"name":"2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133361149","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Modeling and Simulation of Ground Field Sensor for EMP Measurement EMP测量地场传感器的建模与仿真
2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON) Pub Date : 2019-11-01 DOI: 10.1109/GEMCCON48223.2019.9132833
Amruta Varshini Gunta, B. Venkata Ramana, Subbarao Bandaru, C. B. Rao Kota
{"title":"Modeling and Simulation of Ground Field Sensor for EMP Measurement","authors":"Amruta Varshini Gunta, B. Venkata Ramana, Subbarao Bandaru, C. B. Rao Kota","doi":"10.1109/GEMCCON48223.2019.9132833","DOIUrl":"https://doi.org/10.1109/GEMCCON48223.2019.9132833","url":null,"abstract":"Electromagnetic Pulse (EMP) is a high amplitude, short duration, broadband pulse of electromagnetic energy which can have destructive effects on susceptible electronic types of equipment and systems. In this paper Model & Simulation analysis of ground field derivative sensor carried out for measurement of short duration EMP pulses. For generating EMP pulse, open TEM cell has been modeled and characterized in terms of return loss (S11) and VSWR. EMP field uniformly between TEM plates has obtained. Ground field sensor modeled and mounted on the bottom plate of the TEM cell. Simulation analysis of modeled ground field sensor for measurement of fast EMP pulse carried out. Simulation results are compared with practical results measured using commercially available field sensors. Simulation and measurement results are in close agreement.","PeriodicalId":216814,"journal":{"name":"2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON)","volume":"22 5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131192784","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
GEMCCON 2019 Author Index GEMCCON 2019作者索引
2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON) Pub Date : 2019-11-01 DOI: 10.1109/gemccon48223.2019.9132826
{"title":"GEMCCON 2019 Author Index","authors":"","doi":"10.1109/gemccon48223.2019.9132826","DOIUrl":"https://doi.org/10.1109/gemccon48223.2019.9132826","url":null,"abstract":"","PeriodicalId":216814,"journal":{"name":"2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON)","volume":"77 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133890074","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Field Homogeneity and Quite Zone of India’s Largest EMP Facility 印度最大EMP设施的现场均匀性和安静区
2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON) Pub Date : 2019-11-01 DOI: 10.1109/GEMCCON48223.2019.9132834
Venkata Ramana Botsa, Suresh Kumar Munaka, M. Dushyanth, Subbarao Bandaru
{"title":"Field Homogeneity and Quite Zone of India’s Largest EMP Facility","authors":"Venkata Ramana Botsa, Suresh Kumar Munaka, M. Dushyanth, Subbarao Bandaru","doi":"10.1109/GEMCCON48223.2019.9132834","DOIUrl":"https://doi.org/10.1109/GEMCCON48223.2019.9132834","url":null,"abstract":"Electromagnetic Pulse (EMP) is a short burst of electromagnetic energy which can disrupt the electrical and electronic systems. This paper mainly focuses on Field Homogeneity and quite zone areas identification of India’s Largest Outdoor RS105, EMP Test Facility. Modeling & Simulation analysis of bounded wave EMP antenna was carried out to verify the field uniformity as per the standard. Simulated results are verified with practical results after commissioning the EMP facility to meet the compliance testing for RS105 as per the MIL standards with generated test levels more than 50 kV/m and covering the EUT test volume of 17m(L)X12m(W)X3m(H), sufficient to test the large defence and civilian systems.Quite Zone area has been marked as per ICNIRP guidelines after simulation and practical field survey measurements carried out around the facility.","PeriodicalId":216814,"journal":{"name":"2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128453638","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Electrical Impedance Tomography - Differential Solutions 电阻抗断层成像-差分解决方案
2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON) Pub Date : 2019-11-01 DOI: 10.1109/GEMCCON48223.2019.9132819
M. Viswanath, R. Seetharaman, D. Nedumaran
{"title":"Electrical Impedance Tomography - Differential Solutions","authors":"M. Viswanath, R. Seetharaman, D. Nedumaran","doi":"10.1109/GEMCCON48223.2019.9132819","DOIUrl":"https://doi.org/10.1109/GEMCCON48223.2019.9132819","url":null,"abstract":"Topological derivative application to electrically conducting material having various characteristics, its implication on how this influences the result of obtaining an image with increased intensity on regions of organs with appreciable results compared to existing techniques is the main theme of this paper. Characteristic function, Lebesgue space, weak derivative and distributional derivative helps to get an enhanced image with ne plus ultra results. Introducing inclusions in the conducting region and arriving at shape derived results for the domain forms part of the problem. Image processing techniques and Shape derivative problem go hand in hand. Finally application of Hessian matrix and the Strum Liouville operator to regions brought in focus by the impedance tomography helps to obtain results in pinpointed way is brought out.","PeriodicalId":216814,"journal":{"name":"2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128335788","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
[Copyright notice] (版权)
2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON) Pub Date : 2019-11-01 DOI: 10.1109/gemccon48223.2019.9132815
{"title":"[Copyright notice]","authors":"","doi":"10.1109/gemccon48223.2019.9132815","DOIUrl":"https://doi.org/10.1109/gemccon48223.2019.9132815","url":null,"abstract":"","PeriodicalId":216814,"journal":{"name":"2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON)","volume":"99 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115154799","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
GEMCCON 2019 Sponsors
2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON) Pub Date : 2019-11-01 DOI: 10.1109/gemccon48223.2019.9132820
{"title":"GEMCCON 2019 Sponsors","authors":"","doi":"10.1109/gemccon48223.2019.9132820","DOIUrl":"https://doi.org/10.1109/gemccon48223.2019.9132820","url":null,"abstract":"","PeriodicalId":216814,"journal":{"name":"2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128568417","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
HEMP Hardening of Shielded Enclosure for Critical Equipment Protection 用于关键设备保护的屏蔽外壳的HEMP硬化
2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON) Pub Date : 2019-11-01 DOI: 10.1109/GEMCCON48223.2019.9132828
Shaik Saymeer, B. V. Ramana, Subbarao Bandaru, M. Satya Anuradha
{"title":"HEMP Hardening of Shielded Enclosure for Critical Equipment Protection","authors":"Shaik Saymeer, B. V. Ramana, Subbarao Bandaru, M. Satya Anuradha","doi":"10.1109/GEMCCON48223.2019.9132828","DOIUrl":"https://doi.org/10.1109/GEMCCON48223.2019.9132828","url":null,"abstract":"Electromagnetic Pulse (EMP) is transient pulse of electromagnetic field which can interference the electrical & electronic systems. The wireless communication, defence, industry and now extended to Consumer sectors are major victims for the electromagnetic pulse. The Shielded Enclosure offers shielding against the intentional & un-intentional electromagnetic radiations. Shielding of EM waves can be done through the reflection, absorption, multiple reflections by the shield/ barrier. The metals and their alloys can be used as the shields.In this paper, it is proposed to develop rectangular enclosure for providing hardening against HEMP. 3D EM Modeling and simulation analysis carried out by modeling the bounded wave EMP antenna and rectangular enclosure. HEMP hardening obtained in simulations compared with practical measurements carried out using D-dot sensor.","PeriodicalId":216814,"journal":{"name":"2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126062629","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Low Cost Conducted EMI Measurement on Site for Product EMC Pre-compliance 产品EMC预合规现场低成本电磁干扰测量
2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON) Pub Date : 2019-11-01 DOI: 10.1109/GEMCCON48223.2019.9132829
Wei Wu, Yuejia Wu
{"title":"Low Cost Conducted EMI Measurement on Site for Product EMC Pre-compliance","authors":"Wei Wu, Yuejia Wu","doi":"10.1109/GEMCCON48223.2019.9132829","DOIUrl":"https://doi.org/10.1109/GEMCCON48223.2019.9132829","url":null,"abstract":"This paper proposes a low cost product conducted EMI measurement solution. The solution employs a general oscilloscope plus Cloud Computing to make conducted EMI measurement on manufacture’s workshop, to save time and expense of sending products through multiple rounds of compliance measurement at the test house. An EMI-separation-device based on enhanced EMI filter is introduced and grounding contribution to conducted EMI measurement is studied to ensure success of measurement on site. An application example is given showing the conducted EMI measurement on site through oscilloscope plus Cloud Computing is fast and low cost.","PeriodicalId":216814,"journal":{"name":"2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133916969","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
GEMCCON 2019 Committees
2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON) Pub Date : 2019-11-01 DOI: 10.1109/gemccon48223.2019.9132823
{"title":"GEMCCON 2019 Committees","authors":"","doi":"10.1109/gemccon48223.2019.9132823","DOIUrl":"https://doi.org/10.1109/gemccon48223.2019.9132823","url":null,"abstract":"","PeriodicalId":216814,"journal":{"name":"2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON)","volume":"99 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125104451","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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