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2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON)最新文献

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Estimating Far-Field EMI from CM current of Buck Converter Buck变换器CM电流对远场电磁干扰的估计
2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON) Pub Date : 2019-11-01 DOI: 10.1109/GEMCCON48223.2019.9132835
Shantala, M. Sudheer
{"title":"Estimating Far-Field EMI from CM current of Buck Converter","authors":"Shantala, M. Sudheer","doi":"10.1109/GEMCCON48223.2019.9132835","DOIUrl":"https://doi.org/10.1109/GEMCCON48223.2019.9132835","url":null,"abstract":"Switch mode power supplies (SMPS) are widely used for their high efficiency, low weight and volume. But they generate Electromagnetic Interference due to high switching frequency. They generate EMI in conducted and radiated frequencies which may be above the accepted international standards. The Radiated Emission affects the performance of the nearby sensitive electronic integrated circuits. As per the international standards the radiated emission frequency ranges from 30MHz to 3GHz. Hence this range of frequencies is investigated here. In this paper a method to estimate the radiated EMI due to Common Mode currents flowing in SMPS is presented. In a buck converter, the CM currents due to different prominent coupling capacitors are calculated. The configuration giving the highest CM current is considered. The far field Radiated emission due to this current at 1m and 3m distance is calculated and is presented.","PeriodicalId":216814,"journal":{"name":"2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON)","volume":"252 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115634279","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Conductor Backed Coplanar Waveguide Bandpass Filter using Vertically Loaded Coupled Open-ended Stubs 采用垂直加载耦合开放式存根的导体背侧共面波导带通滤波器
2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON) Pub Date : 2019-11-01 DOI: 10.1109/GEMCCON48223.2019.9132818
P. Mondal, S. K. Parui, V. P. Padhy, T. Mandal, A. Sarkar
{"title":"Conductor Backed Coplanar Waveguide Bandpass Filter using Vertically Loaded Coupled Open-ended Stubs","authors":"P. Mondal, S. K. Parui, V. P. Padhy, T. Mandal, A. Sarkar","doi":"10.1109/GEMCCON48223.2019.9132818","DOIUrl":"https://doi.org/10.1109/GEMCCON48223.2019.9132818","url":null,"abstract":"In this paper, a Conductor backed coplanar waveguide (CB-CPW) 3rd order bandpass filter is designed using Coupled open ended stub resonator placed vertically to the signal line. Vertically loaded open ended stubs are designed at quarter wavelength so as to behave like a short circuit at the input terminal thus giving a band-accepted response with lesser metallic area or minimum size. Four such coupled open ended resonators are placed in series and also in closely manner to provide greater field confinement of the proposed bandpass filter. The bandpass filter is designed for a centre frequency of 2.5 GHz with FBW of 97.89%, insertion loss of <0.5dB, rising and falling edge selectivity of 30.75 dB/GHz and 27.01dB/GHz respectively with a wide stopband of around 4GHz after the desired passband.","PeriodicalId":216814,"journal":{"name":"2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115088979","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Coupling Analysis of EMP and UWB Fast Transients on PCB Traces PCB走线上EMP和UWB快速瞬变耦合分析
2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON) Pub Date : 2019-11-01 DOI: 10.1109/GEMCCON48223.2019.9132830
Suresh Kumar Munaka, Bala Narendra Ambati, Siva Kumar Pukkalla, Venkata Ramana Botsa, Subbarao Bandaru
{"title":"Coupling Analysis of EMP and UWB Fast Transients on PCB Traces","authors":"Suresh Kumar Munaka, Bala Narendra Ambati, Siva Kumar Pukkalla, Venkata Ramana Botsa, Subbarao Bandaru","doi":"10.1109/GEMCCON48223.2019.9132830","DOIUrl":"https://doi.org/10.1109/GEMCCON48223.2019.9132830","url":null,"abstract":"With the Exponential increase in use of electronics, Intentional Electromagnetic interference (IEMI) pose a greater threat not only for Military Sector, civilian sector as well. There is a potential threat from Electromagnetic Pulse (EMP) attack on Telecom, Radar, Electric Power, Banking and Financial service etc. High Power microwave energy illuminated over vital installation can jam electronic equipment information. In the present study, Structures radiating two different fast transients pulses Viz, EMP and Ultra-Wide Band (UWB) system with different pulse characteristics viz., rise time and frequency content were modeled using 3D EM simulation tool CST. Coupling effects of two different fast transients pulse from IEMI sources EMP, UWB on PCB Traces were studied and presented.","PeriodicalId":216814,"journal":{"name":"2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON)","volume":"387 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116481737","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Modelling and Simulation of Conducted Emission For Electronic Control Module 电子控制模块传导辐射建模与仿真
2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON) Pub Date : 2019-11-01 DOI: 10.1109/GEMCCON48223.2019.9132821
Vishal V Bodake, Sarang Gupta, S. Bhat, V. D
{"title":"Modelling and Simulation of Conducted Emission For Electronic Control Module","authors":"Vishal V Bodake, Sarang Gupta, S. Bhat, V. D","doi":"10.1109/GEMCCON48223.2019.9132821","DOIUrl":"https://doi.org/10.1109/GEMCCON48223.2019.9132821","url":null,"abstract":"This paper deals with modelling and simulation of Conducted emission of an Electronic Control Unit (ECU) which carries multiple switching elements like switch mode power supply and output drivers. The simulation model includes LISN model, behavior of discrete components in the form of SPICE model and the parasitics of PCB. At PCB the SMPS power supply buck topology with 2 MHz switching frequency and H Bridge driver with 2 KHz switching frequency is used. The peak spectral plot from simulation is used to evaluate the design and identify the noise source in design. Simulation and measurement results are compared to know area of improvement in simulation modelling approach. This paper also highlights effect of adding parasitics into simulation.","PeriodicalId":216814,"journal":{"name":"2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130226902","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
[GEMCCON 2019 Title Page] 【GEMCCON 2019标题页】
2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON) Pub Date : 2019-11-01 DOI: 10.1109/gemccon48223.2019.9132827
{"title":"[GEMCCON 2019 Title Page]","authors":"","doi":"10.1109/gemccon48223.2019.9132827","DOIUrl":"https://doi.org/10.1109/gemccon48223.2019.9132827","url":null,"abstract":"","PeriodicalId":216814,"journal":{"name":"2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON)","volume":"2014 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127423147","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
ESD (Electrostaic Discharge) Soft Failure Risk Assessment For a Thin Display Metal Back Cover 薄显示器金属后盖静电放电软失效风险评估
2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON) Pub Date : 2019-11-01 DOI: 10.1109/GEMCCON48223.2019.9132817
T. D. Lingayat, S. Solanki, Bala P. Subramanya
{"title":"ESD (Electrostaic Discharge) Soft Failure Risk Assessment For a Thin Display Metal Back Cover","authors":"T. D. Lingayat, S. Solanki, Bala P. Subramanya","doi":"10.1109/GEMCCON48223.2019.9132817","DOIUrl":"https://doi.org/10.1109/GEMCCON48223.2019.9132817","url":null,"abstract":"Most of the connected electronic devices such as smart phone, tablet and laptop has LCD (liquid crystal display) with metal back plate as a part of system stack up. The metal back plate of the display helps in grounding the system ingredients and FPC (Flexible Printed Circuits) into the chassis/ system ground which helps to prevent the ESD (Electrostatic Discharge) soft failures and its thickness is around 0.5mm. But as the devices are trending towards more and more thin designs the thickness of the display metal back cover becomes a problem. The paper provides an ESD soft failure risk assessment where the thick display metal back cover is replaced with a less than 0.05mm thin metal sheet and its effect on ESD soft failure is studied. The paper covers following key topics: a) creation of an ESD pass and fail case for a given issue, b) identification of correct measurement parameters in simulation to distinguish between pass and fail case, c) validation of an ESD simulation setup with the help of Z parameter correlation and d) assessment of ESD soft failure using a thick display metal back cover and using a thin metal sheet. The ESD soft failure risk assessment is performed using 3D EM simulation and identified surface current on the system ground as a critical part of soft failure mechanism.","PeriodicalId":216814,"journal":{"name":"2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114252618","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Hybrid Complementary FSS Element based on Fibonacci Spiral for Triple-band EMI Shielding Application 基于斐波那契螺旋的混合互补FSS元件在三波段电磁干扰屏蔽中的应用
2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON) Pub Date : 2019-11-01 DOI: 10.1109/GEMCCON48223.2019.9132824
V. K. Kanth, S. Raghavan
{"title":"Hybrid Complementary FSS Element based on Fibonacci Spiral for Triple-band EMI Shielding Application","authors":"V. K. Kanth, S. Raghavan","doi":"10.1109/GEMCCON48223.2019.9132824","DOIUrl":"https://doi.org/10.1109/GEMCCON48223.2019.9132824","url":null,"abstract":"Electromagnetic interference (EMI) caused by microwave sources leads to the malfunction and faulty readings of many real-time systems. Hence it is essential to provide EMI shielding for sensitive electronic devises anwd chambers. An array of periodic elements offers advantages such as transparency and opacity at selected frequencies with lower weight. In this regard, a complementary frequency selective surfaces (CFSS) has been analyzed for EMI shielding application. The CFSS exhibits a highly stable response with three controllable passbands for normal and oblique incidences. Such response is more suitable for allowing selective frequency bands with strong stopband between them.","PeriodicalId":216814,"journal":{"name":"2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132026764","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
GEMCCON 2019 Final Program GEMCCON 2019最终计划
2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON) Pub Date : 2019-11-01 DOI: 10.1109/gemccon48223.2019.9132816
{"title":"GEMCCON 2019 Final Program","authors":"","doi":"10.1109/gemccon48223.2019.9132816","DOIUrl":"https://doi.org/10.1109/gemccon48223.2019.9132816","url":null,"abstract":"","PeriodicalId":216814,"journal":{"name":"2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121540987","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Characterization of Derivative Sensor Without Using Transient Source 不使用瞬态源的导数传感器特性
2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON) Pub Date : 2019-11-01 DOI: 10.1109/GEMCCON48223.2019.9132836
R. Kichouliya, S. Satav, D. C. Pande
{"title":"Characterization of Derivative Sensor Without Using Transient Source","authors":"R. Kichouliya, S. Satav, D. C. Pande","doi":"10.1109/GEMCCON48223.2019.9132836","DOIUrl":"https://doi.org/10.1109/GEMCCON48223.2019.9132836","url":null,"abstract":"Derivative sensors (D dot and B dot) are used for measurement of transient electric and magnetic fields mainly from Electromagnetic pulse (EMP) and lightning events. These sensors are characterized by using standard field generation method like monocone antenna and TEM cell methods. This paper discusses the methodology for characterizing the sensors from its frequency domain transfer function, which in turn can be used for measuring the transient signals.","PeriodicalId":216814,"journal":{"name":"2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128989242","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Effect of Penetrating Conductors on Enclosure HEMP Hardening 穿透导体对外壳HEMP硬化的影响
2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON) Pub Date : 2019-11-01 DOI: 10.1109/GEMCCON48223.2019.9132822
Pranab Mistry, B. V. Ramana, Shaik Saymeer, B. Subbarao
{"title":"Effect of Penetrating Conductors on Enclosure HEMP Hardening","authors":"Pranab Mistry, B. V. Ramana, Shaik Saymeer, B. Subbarao","doi":"10.1109/GEMCCON48223.2019.9132822","DOIUrl":"https://doi.org/10.1109/GEMCCON48223.2019.9132822","url":null,"abstract":"An electromagnetic modelling and simulation analysis carried out to study the effect of penetrating conductors on EMP Shielding Effectiveness (SE) of the shielded enclosure. Transient electromagnetic fields from an EMP source, which can induce currents into a conductor. This current will continue to flow on the conductor as it penetrates the shield boundary. The current flowing in the conductor will cause the re-radiation of an EMP field on the other side of the shielding boundary. For both plane wave and transient EMP SE with different positions of cable penetration into the shielded enclosure was analyzed, and based on the obtained results it recommends suitable cable penetration, to minimize the fields coupling inside the enclosure. This investigation will be utilized for routing the cables from the external electromagnetic environment to protect sensitive electronics systems inside the enclosure.","PeriodicalId":216814,"journal":{"name":"2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131188250","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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