2015 IEEE International Conference on Digital Signal Processing (DSP)最新文献_第9页

Computation and Communication Aware task graph Scheduling on multi-GPU systems 多gpu系统的计算和通信感知任务图调度

2015 IEEE International Conference on Digital Signal Processing (DSP) Pub Date : 2015-07-21 DOI: 10.1109/ICDSP.2015.7251841

Yun-Ting Wang, Jia-Ying Lee, B. Lai

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引用次数: 0

Fast wedgelet pattern decision for DMM in 3D-HEVC 3D-HEVC中DMM的快速小波模式判定

2015 IEEE International Conference on Digital Signal Processing (DSP) Pub Date : 2015-07-21 DOI: 10.1109/ICDSP.2015.7251918

C. Fu, Hongbin Zhang, W. Su, Sik-Ho Tsang, Yui-Lam Chan

引用次数: 31

Adaptive fast intra mode decision of depth map coding by Low Complexity RD-Cost in 3D-HEVC 基于3D-HEVC的低复杂度RD-Cost深度图编码自适应快速模式内决策

2015 IEEE International Conference on Digital Signal Processing (DSP) Pub Date : 2015-07-21 DOI: 10.1109/ICDSP.2015.7251920

Hongbin Zhang, C. Fu, W. Su, Sik-Ho Tsang, Yui-Lam Chan

引用次数: 13

Unified IGBT prognostic using natural computation 使用自然计算的统一IGBT预测

2015 IEEE International Conference on Digital Signal Processing (DSP) Pub Date : 2015-07-21 DOI: 10.1109/ICDSP.2015.7251965

M. Samie, A. Alghassi, S. Perinpanayagam

{"title":"Unified IGBT prognostic using natural computation","authors":"M. Samie, A. Alghassi, S. Perinpanayagam","doi":"10.1109/ICDSP.2015.7251965","DOIUrl":"https://doi.org/10.1109/ICDSP.2015.7251965","url":null,"abstract":"Within the field of Integrated System Health Management, ISHM, there is still a lack of adequate prognostic models for critical applications while systems are missioned to work in harsh environments. One of the main challenges is that prognostic models should be adaptive to changes in working conditions so that prediction of the remaining useful life of systems/components can be well adjusted with the dynamic of variation of both system and working conditions. Among various modeling and prediction techniques, natural computation and soft computing techniques, such as neural networks, offer interesting solutions to adjust prediction of the remaining useful life of systems/components while the complexity of modeling and real-time calculation is also reduced. This paper presents a radically-novel approach for building per-unit prognostic models applied on one of the most critical components of power modules, IGBT, that presents high failure rates in power electronic systems. An advantage is that the prognostic model can be generalized in a per-unit form; and then, its features are adjusted depending on the application, working condition, and dynamic of changes.","PeriodicalId":216293,"journal":{"name":"2015 IEEE International Conference on Digital Signal Processing (DSP)","volume":"6 5","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-07-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133007057","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Memory-access aware work-load distribution for peak-temperature reduction of 3D multi-core embedded systems 面向3D多核嵌入式系统峰值温度降低的内存访问感知工作负载分配

2015 IEEE International Conference on Digital Signal Processing (DSP) Pub Date : 2015-07-21 DOI: 10.1109/ICDSP.2015.7252085

B. K. Mohanty, Vivek Chaturvedi, Vijeta Rathore, T. Srikanthan

{"title":"Memory-access aware work-load distribution for peak-temperature reduction of 3D multi-core embedded systems","authors":"B. K. Mohanty, Vivek Chaturvedi, Vijeta Rathore, T. Srikanthan","doi":"10.1109/ICDSP.2015.7252085","DOIUrl":"https://doi.org/10.1109/ICDSP.2015.7252085","url":null,"abstract":"Multiple cores are preferred to meet the ever increasing computation demand of embedded systems. A multi-core system is communication intensive with on-chip wire delays and on-chip interconnects accounting for half the dynamic power dissipation. A three-dimensional (3D) stacking of dies enables low intra-chip distances for signal transmission and helps to overcome the interconnect bottleneck of multi-core systems. The 3D integration by through silicon via (TSV) can significantly improve memory-logic communication bandwidth of multi-core systems. However, the 3D multi-core system has poor heat removal capability due to position of the heat-sink. In this paper, we made a study on the thermal profile of DRAM memory layers of 3-D multi-core system. In this study, workloads are distributed to memory layers based on its thermal efficiency such that work load of heavier applications is allocated to the memory layer having highest thermal efficiency and those of lighter applications is allocated to the memory layer with lower thermal efficiency. Experimental result shows that with selective work load distribution, the average peak temperature of the 3D multi-core system is reduced than randomly allocated work load to the memory layers. A memory controller could be designed for run-time distribution of work load to the memory layers which will be addressed in the future work.","PeriodicalId":216293,"journal":{"name":"2015 IEEE International Conference on Digital Signal Processing (DSP)","volume":"163 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-07-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130206936","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

An experimental evaluation of broadband spatial IA for uncoordinated MIMO-OFDM systems 非协调MIMO-OFDM系统宽带空间IA的实验评估

2015 IEEE International Conference on Digital Signal Processing (DSP) Pub Date : 2015-07-21 DOI: 10.1109/ICDSP.2015.7251938

J. Fanjul, C. Lameiro, I. Santamaría, J. García-Naya, L. Castedo

引用次数: 5

Cochleagram image feature for improved robustness in sound recognition 耳蜗图图像特征在声音识别中的鲁棒性提高

2015 IEEE International Conference on Digital Signal Processing (DSP) Pub Date : 2015-07-21 DOI: 10.1109/ICDSP.2015.7251910

R. Sharan, T. Moir

引用次数: 15

Optimal power allocation for pilot-assisted interference alignment in MIMO interference networks: Test-bed results MIMO干扰网络中导频辅助干扰对准的最佳功率分配:试验台结果

2015 IEEE International Conference on Digital Signal Processing (DSP) Pub Date : 2015-07-21 DOI: 10.1109/ICDSP.2015.7251941

N. N. Moghadam, H. Farhadi, P. Zetterberg

引用次数: 3

A seizure prediction method based on efficient features and BLDA 基于高效特征和BLDA的癫痫发作预测方法

2015 IEEE International Conference on Digital Signal Processing (DSP) Pub Date : 2015-07-21 DOI: 10.1109/ICDSP.2015.7251854

Qi Yuan, Dongmei Wei

引用次数: 4

Detection of Parkinson's tremor from EMG signals; a singular spectrum analysis approach 肌电图信号对帕金森震颤的检测奇异谱分析方法

2015 IEEE International Conference on Digital Signal Processing (DSP) Pub Date : 2015-07-21 DOI: 10.1109/ICDSP.2015.7251901

K. Eftaxias, Shirin Enshaeifar, O. Geman, S. Kouchaki, S. Sanei

引用次数: 8