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2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME)最新文献

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Measurement and acquisition system with fiber optic data transmission 测量采集系统采用光纤数据传输
2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) Pub Date : 2009-09-01 DOI: 10.1109/SIITME.2009.5407357
I. Lita, M. Jurian, I. B. Cioc, D. Visan
{"title":"Measurement and acquisition system with fiber optic data transmission","authors":"I. Lita, M. Jurian, I. B. Cioc, D. Visan","doi":"10.1109/SIITME.2009.5407357","DOIUrl":"https://doi.org/10.1109/SIITME.2009.5407357","url":null,"abstract":"The correct selection of the proper transmission method that is most convenient for a particular data acquisition and measurement system represents an important issue for any application. In this paper is presented a novel implementation approach that relies on the use of optical fiber connection for data transmission between a remote data acquisition board and the PC. The improved data acquisition platform is realized around the PIC 16F877 microcontroller and uses a set of optical transmitters and receivers that ensures the electro-optical conversion of the signals. The communication is bidirectional. The use of fiber optic link for communication with the remote data acquisition board offers the advantages of a very high transmission rate, very good galvanic insulation between the remote acquisition module and the processing computer and also total immunity against the electrical interferences and spurious signals that might affect the measurements. In the practical realized prototype it was used common commercially available fiber-optic components and for this reason the speed was little bit sacrificed in order to obtain a reduced cost of the system. But using optical transceivers and receivers with higher speed, the overall performances of the data acquisition system can be improved. Also, by minor changes the proposed system can be extended in order to acquire the signals from more then one channel","PeriodicalId":215102,"journal":{"name":"2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME)","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132015617","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Stencil deformation during stencil printing 模版印刷时的模版变形
2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) Pub Date : 2009-09-01 DOI: 10.1109/SIITME.2009.5407378
O. Krammer, L. Molnár, L. Jakab, C. Klein
{"title":"Stencil deformation during stencil printing","authors":"O. Krammer, L. Molnár, L. Jakab, C. Klein","doi":"10.1109/SIITME.2009.5407378","DOIUrl":"https://doi.org/10.1109/SIITME.2009.5407378","url":null,"abstract":"Uneven solder mask thickness or other artifacts on PCBs can keep the stencil away from the PCB during stencil printing, which cause large deposited solder paste volume, and can result in solder bridges after reflow soldering. In our experiment we have investigated the deformation properties of stencils. The load-strain curve of a 125 ¿m thick stainless steel stencil was measured on nine locations. By the deformation experiments, the FEM (Finite Element Method) model of the stencil was created. With FEM simulations, the minimum technological distances (distance between artifacts and solder pads) for a range of step heights (difference between artifact height and pad height) and for different stencil thicknesses were determined. With the adherence to this technological distance, the stencil can bend down to the pad, and the proper amount of solder paste can be deposited onto the pad.","PeriodicalId":215102,"journal":{"name":"2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132326579","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Echo cancelling using adaptive algorithms 采用自适应算法消除回声
2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) Pub Date : 2009-09-01 DOI: 10.1109/SIITME.2009.5407351
I. Homana, M. Topa, B. Kirei
{"title":"Echo cancelling using adaptive algorithms","authors":"I. Homana, M. Topa, B. Kirei","doi":"10.1109/SIITME.2009.5407351","DOIUrl":"https://doi.org/10.1109/SIITME.2009.5407351","url":null,"abstract":"In the paper, an echo canceller based on a system identification scheme with adaptive algorithms is presented. The algorithms consider FIR filters with the taps chosen to minimize an error signal derived from the system according to a stochastic gradient-based method. The following adaptive filters are discussed and simulated in Matlab: classical LMS and its variants: NLMS, VSLMS, VSNLMS and RLS. The echo was simulated by adding several delayed and attenuated replica to a vocal input. The comparison between the algorithms was made taking into account the mean-square error (MSE) and average attenuation (AV), as well as the required number of multiplications.","PeriodicalId":215102,"journal":{"name":"2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129001861","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 20
About the electrical resistivity of the La1-xAxMnO3 manganites in microwave range La1-xAxMnO3锰矿石在微波范围内的电阻率研究
2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) Pub Date : 2009-09-01 DOI: 10.1109/SIITME.2009.5407385
D. Ionescu, V. Cehan
{"title":"About the electrical resistivity of the La1-xAxMnO3 manganites in microwave range","authors":"D. Ionescu, V. Cehan","doi":"10.1109/SIITME.2009.5407385","DOIUrl":"https://doi.org/10.1109/SIITME.2009.5407385","url":null,"abstract":"A study of the electrical resistivity in microwave range for a class of perovskite manganites was performed in this paper. The work strategy was the structural simulation of the considered materials: La1-xAxMnO3 (A = Ca, Sr, Ba or A = Li, Na, K and Rb), with 0 ≤ x ≤ 0.4, respectively 0 ≤ x ≤ 1. Materials are characterized by colossal magnetoresistance and consequently present one or two peaks in the electrical resistivity versus temperature plots. Peaks are shifting slightly with the applied magnetic field intensity and also with frequency after an high-pass filter law. The frequency dependence of the material resistivity above TCurie illustrates the resistivity peaks and indicates the influence of the electromagnetic field variations on the electrical conduction mechanism inside the materials. The link between structure, field and properties was evidenced in this case, using the features and advantages of our simulation method.","PeriodicalId":215102,"journal":{"name":"2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121558704","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Inertial bridge with onboard signal processing 惯性桥与板载信号处理
2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) Pub Date : 2009-09-01 DOI: 10.1109/SIITME.2009.5407383
I. Hapenciuc, P. Svasta
{"title":"Inertial bridge with onboard signal processing","authors":"I. Hapenciuc, P. Svasta","doi":"10.1109/SIITME.2009.5407383","DOIUrl":"https://doi.org/10.1109/SIITME.2009.5407383","url":null,"abstract":"The developed module was designed to offer better accuracy of measurement than other similar products on the market. It is able to give information about the attitude and trajectory of the object to which is attached in the most difficult environments: an airplane in the cloud, a ship on the sea or a car in the middle of the desert. The accuracy is achieved using and ordinary 12bit SAR ADC from the MCU with special signal processing inside of the DSP, digital filtering and avoiding active circuits between the sensors and ADC. The main element will be the ADC and DSP able to give accuracy comparable with high performance external ADCs. This way the system is able to give accurate results so the trajectory can be reconstructed by integrating the speed or acceleration information. The developed module is able to give information from 10 sensors: 6 are from the triaxial accelerometer and three gyros needed to measure all moving degrees of freedom. Next to this are three magnetic sensors able to measure the earth magnetic field in 3D. And the tenth is an absolute pressure sensor for an electronic barometer","PeriodicalId":215102,"journal":{"name":"2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132357029","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Electronic module for controlling the energy in a Vapour Phase Soldering machine 控制气相焊锡机能量的电子模块
2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) Pub Date : 2009-09-01 DOI: 10.1109/SIITME.2009.5407340
I. Plotog, P. Svasta, B. Mihailescu, G. Vărzaru, I. Busu
{"title":"Electronic module for controlling the energy in a Vapour Phase Soldering machine","authors":"I. Plotog, P. Svasta, B. Mihailescu, G. Vărzaru, I. Busu","doi":"10.1109/SIITME.2009.5407340","DOIUrl":"https://doi.org/10.1109/SIITME.2009.5407340","url":null,"abstract":"As known, there are three parameters for controlling the thermal profile in Vapour Phase Soldering machine; the paper refers to one of them - the electric energy from the AC mains introduced in the system in order to bring the thermal agent to the boiling point and to obtain the appropriate vapours density. The idea was to control the power dissipated in the heating element, one power resistor, by controlling the state of a switch instead of switching more power resistors. For 100% power dissipation the switch will be always ON, while for a lower power the switch will be closed from time to time by a microcontroller. During switching AC mains noise is produced that is dependant of the AC sinus at the actual switching point. To bring noise at its lowest value the switching should occur at 0 volt amplitude. This happens when sinus is “zero crossing” which is accomplished by using a zero-cross power opto-triac. The feedback is closed by a current transformer and an analog-to-digital convertor, constituted by the built-in feature of the microcontroller. The whole algorithm of control resides in a master microcontroller supervising all three parameters, which communicates with the electronic modules on SPI bus.","PeriodicalId":215102,"journal":{"name":"2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133495798","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Virtual laboratory of materials for electronics 电子学材料虚拟实验室
2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) Pub Date : 2009-09-01 DOI: 10.1109/SIITME.2009.5407336
C. Farcas, N. Palaghita, D. Petreus, O. Pop
{"title":"Virtual laboratory of materials for electronics","authors":"C. Farcas, N. Palaghita, D. Petreus, O. Pop","doi":"10.1109/SIITME.2009.5407336","DOIUrl":"https://doi.org/10.1109/SIITME.2009.5407336","url":null,"abstract":"In this paper we present a website realized in HTML, CSS and PHP, based on Wordpress platform. This site is a useful support for materials for electronics course and can be found at http://materiale.utcluj.ro/. The virtual laboratory can be accessed in electronic format on the web or on a local computer. This site contains information about the course and laboratory. The students can find on line the courses and laboratories, auxiliary materials etc. For these, they need to create an account. There is also the possibility of online testing of the students.","PeriodicalId":215102,"journal":{"name":"2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133513163","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
On ultrasound transducers with EMFi material EMFi材料超声换能器的研究
2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) Pub Date : 2009-09-01 DOI: 10.1109/SIITME.2009.5407370
D. Aiordachioaie, R. Belea, L. Frangu, Marius Mazarel, S. Epure
{"title":"On ultrasound transducers with EMFi material","authors":"D. Aiordachioaie, R. Belea, L. Frangu, Marius Mazarel, S. Epure","doi":"10.1109/SIITME.2009.5407370","DOIUrl":"https://doi.org/10.1109/SIITME.2009.5407370","url":null,"abstract":"In autonomous vehicles, e.g. mobile robots, the sonar is frequently used for navigation. There are some drawbacks of the system, generated mainly from the small bandwidth of the ultrasonic transducers and from high absorption of ultrasounds in air. Currently, there are two research directions under development: (a) the use of sensors based on new materials as EMFi, with wide frequency range; (b) the use of arrays of sensors, in order to design the beam width and to build sonar images instead of single or multiple echoes processing. The present work presents some results from the first directions and the preparations for the second approach, i.e. array of sensors, from electronics point of view. The work is part of the ADBIOSONAR research project, [1].","PeriodicalId":215102,"journal":{"name":"2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133616297","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
SDR - Receiver Platform for development and research SDR -接收机开发和研究平台
2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) Pub Date : 2009-09-01 DOI: 10.1109/SIITME.2009.5407349
C. Tămaş, V. Vulpe
{"title":"SDR - Receiver Platform for development and research","authors":"C. Tămaş, V. Vulpe","doi":"10.1109/SIITME.2009.5407349","DOIUrl":"https://doi.org/10.1109/SIITME.2009.5407349","url":null,"abstract":"The SDR Receiver Platform is a development environment for study by students, for improvements or just for demonstrating this new concept for future communications channels (GSM, professional or amateurs communications, satellite or new digital concepts). The Receiver Platform was implemented using the SDR (Software Defined Radio) technology, presented as a platform for research and development. Actual receiver is intended to use the digital quadrature demodulation for narrow band FM broadcasts for 2METER band (145MHz designed for radio amateurs).With this new concept is easy to implement other operating modes: analog (Single Side Band, Amplitude Modulation, etc) and digital (Frequency Shift Keying, Phase Shift Keying, Quadrature Amplitude Modulation, etc.). With this platform is very easy to use other bands or modes of working just by modifying the software- firmware. It doesn't require major hardware changes, resulting a reliable and flexible system. Modular system is achieved both physically and functionally; adaptability to different situations is important for a cost efficient solution.","PeriodicalId":215102,"journal":{"name":"2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115217963","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Teaching electronics assembling, inspection and test technologies in Elect2EAT 讲授电子产品组装、检验和测试技术
2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME) Pub Date : 2009-09-01 DOI: 10.1109/SIITME.2009.5407403
R. Bátorfi, Z. Illyefalvi-Vitéz
{"title":"Teaching electronics assembling, inspection and test technologies in Elect2EAT","authors":"R. Bátorfi, Z. Illyefalvi-Vitéz","doi":"10.1109/SIITME.2009.5407403","DOIUrl":"https://doi.org/10.1109/SIITME.2009.5407403","url":null,"abstract":"In the Central-Eastern European region, electronics assembling technology is a very important field, because there are several assembling companies employing many people. With the Elect2EAT project, the partner countries - Romania, Slovakia and Hungary - intended to address the personnel working in this field. A public, multi-lingual e-learning material was developed for distance learning use to educate secondary school students, skilled and unskilled workers. For high quality production, quality management is an essential part of the production process. Inspection and test techniques are the tools for assure quality of the products. A whole chapter is dedicated to the test techniques like optical-, X-ray-, acoustic- and electron microscopy, in-circuit and functional testing. The theoretical basics of these methods are essential to be able to understand and use the equipment properly and highly efficiently in practice. These - mainly automatic - testing machines are represented in every assembling line, so every person will meet them who work in an assembling company.","PeriodicalId":215102,"journal":{"name":"2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME)","volume":"11 7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114201226","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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