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NOMA as the Next-Generation Multiple Access in Nonterrestrial Networks
IF 23.2 1区 计算机科学
Proceedings of the IEEE Pub Date : 2024-11-27 DOI: 10.1109/JPROC.2024.3496775
Baha Eddine Youcef Belmekki;Mohamed-Slim Alouini
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引用次数: 0
IEEE Membership IEEE 会员
IF 23.2 1区 计算机科学
Proceedings of the IEEE Pub Date : 2024-11-08 DOI: 10.1109/JPROC.2024.3479437
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引用次数: 0
Future Special Issues/Special Sections of the Proceedings 论文集》未来的特刊/专栏
IF 23.2 1区 计算机科学
Proceedings of the IEEE Pub Date : 2024-11-08 DOI: 10.1109/JPROC.2024.3479435
{"title":"Future Special Issues/Special Sections of the Proceedings","authors":"","doi":"10.1109/JPROC.2024.3479435","DOIUrl":"https://doi.org/10.1109/JPROC.2024.3479435","url":null,"abstract":"","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 8","pages":"1091-1091"},"PeriodicalIF":23.2,"publicationDate":"2024-11-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10747811","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142595783","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Joint Source–Channel Coding: Fundamentals and Recent Progress in Practical Designs 源-信道联合编码:实用设计的基本原理和最新进展
IF 20.6 1区 计算机科学
Proceedings of the IEEE Pub Date : 2024-11-08 DOI: 10.1109/jproc.2024.3477331
Deniz Gündüz, Michèle A. Wigger, Tze-Yang Tung, Ping Zhang, Yong Xiao
{"title":"Joint Source–Channel Coding: Fundamentals and Recent Progress in Practical Designs","authors":"Deniz Gündüz, Michèle A. Wigger, Tze-Yang Tung, Ping Zhang, Yong Xiao","doi":"10.1109/jproc.2024.3477331","DOIUrl":"https://doi.org/10.1109/jproc.2024.3477331","url":null,"abstract":"","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"164 1","pages":""},"PeriodicalIF":20.6,"publicationDate":"2024-11-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142597370","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
TechRxiv TechRxiv
IF 23.2 1区 计算机科学
Proceedings of the IEEE Pub Date : 2024-11-08 DOI: 10.1109/JPROC.2024.3487389
{"title":"TechRxiv","authors":"","doi":"10.1109/JPROC.2024.3487389","DOIUrl":"https://doi.org/10.1109/JPROC.2024.3487389","url":null,"abstract":"","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 8","pages":"1092-1092"},"PeriodicalIF":23.2,"publicationDate":"2024-11-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10747810","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142595784","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Proceedings of the IEEE Publication Information 电气和电子工程师学会论文集》出版信息
IF 23.2 1区 计算机科学
Proceedings of the IEEE Pub Date : 2024-11-08 DOI: 10.1109/JPROC.2024.3479431
{"title":"Proceedings of the IEEE Publication Information","authors":"","doi":"10.1109/JPROC.2024.3479431","DOIUrl":"https://doi.org/10.1109/JPROC.2024.3479431","url":null,"abstract":"","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 8","pages":"C2-C2"},"PeriodicalIF":23.2,"publicationDate":"2024-11-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10747807","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142595902","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Proceedings of the IEEE: Stay Informed. Become Inspired. 电气和电子工程师学会论文集》:保持信息灵通。激发灵感。
IF 23.2 1区 计算机科学
Proceedings of the IEEE Pub Date : 2024-11-08 DOI: 10.1109/JPROC.2024.3479439
{"title":"Proceedings of the IEEE: Stay Informed. Become Inspired.","authors":"","doi":"10.1109/JPROC.2024.3479439","DOIUrl":"https://doi.org/10.1109/JPROC.2024.3479439","url":null,"abstract":"","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 8","pages":"C4-C4"},"PeriodicalIF":23.2,"publicationDate":"2024-11-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10747812","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142595827","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Additively Manufactured Electronic Components in Multimaterial 3-D and 4-D Printing 多材料三维和四维打印中的快速制造电子元件
IF 23.2 1区 计算机科学
Proceedings of the IEEE Pub Date : 2024-11-08 DOI: 10.1109/JPROC.2024.3484116
Yang Yang;Manos M. Tentzeris
{"title":"Additively Manufactured Electronic Components in Multimaterial 3-D and 4-D Printing","authors":"Yang Yang;Manos M. Tentzeris","doi":"10.1109/JPROC.2024.3484116","DOIUrl":"https://doi.org/10.1109/JPROC.2024.3484116","url":null,"abstract":"","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 8","pages":"950-953"},"PeriodicalIF":23.2,"publicationDate":"2024-11-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10747809","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142595841","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Room-Temperature Selective-Metallization Processes Applied to 3-D-Printed and Flexible Materials for Wireless Sensing 室温选择性金属化工艺应用于用于无线传感的三维打印和柔性材料
IF 23.2 1区 计算机科学
Proceedings of the IEEE Pub Date : 2024-11-05 DOI: 10.1109/JPROC.2024.3481315
Valentina Palazzi;Federico Alimenti;Leonardo Pierantozzi;Matteo Ribeca;Leonardo Balocchi;Luca Valentini;Silvia Bittolo Bon;Paolo Mezzanotte;Manos M. Tentzeris;Luca Roselli
{"title":"Room-Temperature Selective-Metallization Processes Applied to 3-D-Printed and Flexible Materials for Wireless Sensing","authors":"Valentina Palazzi;Federico Alimenti;Leonardo Pierantozzi;Matteo Ribeca;Leonardo Balocchi;Luca Valentini;Silvia Bittolo Bon;Paolo Mezzanotte;Manos M. Tentzeris;Luca Roselli","doi":"10.1109/JPROC.2024.3481315","DOIUrl":"10.1109/JPROC.2024.3481315","url":null,"abstract":"This article describes sensors and radio frequency (RF) components manufactured by applying selective-metallization processes (metal foil tape, liquid metal filling, electro and electroless plating, and surface embossing) to 3-D-printed and flexible dielectric substrates. All these technologies can be implemented at room temperature, thus enabling the adoption of unconventional materials and biopolymers with low glass transition temperatures. In this article, we also describe how the above technologies are used to manufacture wireless transponders for tracking and sensing applications. Several examples of RF components are reported, including antennas, beamforming networks, Doppler radars, and wireless passive transponders based on backscatter radio. Innovative circuit design approaches (such as the via-less approach) are presented and their impact on circuit manufacturing and recyclability is discussed.","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 8","pages":"1065-1090"},"PeriodicalIF":23.2,"publicationDate":"2024-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10742604","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142588725","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Wireless 6G Connectivity for Massive Number of Devices and Critical Services 为大量设备和关键服务提供无线 6G 连接
IF 20.6 1区 计算机科学
Proceedings of the IEEE Pub Date : 2024-11-05 DOI: 10.1109/jproc.2024.3484529
Anders E. Kalor, Giuseppe Durisi, Sinem Coleri, Stefan Parkvall, Wei Yu, Andreas Mueller, Petar Popovski
{"title":"Wireless 6G Connectivity for Massive Number of Devices and Critical Services","authors":"Anders E. Kalor, Giuseppe Durisi, Sinem Coleri, Stefan Parkvall, Wei Yu, Andreas Mueller, Petar Popovski","doi":"10.1109/jproc.2024.3484529","DOIUrl":"https://doi.org/10.1109/jproc.2024.3484529","url":null,"abstract":"","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"144 1","pages":""},"PeriodicalIF":20.6,"publicationDate":"2024-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142588546","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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