{"title":"Proceedings of the IEEE Publication Information","authors":"","doi":"10.1109/JPROC.2024.3477794","DOIUrl":"https://doi.org/10.1109/JPROC.2024.3477794","url":null,"abstract":"","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 7","pages":"C2-C2"},"PeriodicalIF":23.2,"publicationDate":"2024-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10738014","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142540432","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"IEEE Connects You to a Universe of Information","authors":"","doi":"10.1109/JPROC.2024.3481749","DOIUrl":"https://doi.org/10.1109/JPROC.2024.3481749","url":null,"abstract":"","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 7","pages":"947-947"},"PeriodicalIF":23.2,"publicationDate":"2024-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10738012","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142540435","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"IEEE Membership","authors":"","doi":"10.1109/JPROC.2024.3477798","DOIUrl":"https://doi.org/10.1109/JPROC.2024.3477798","url":null,"abstract":"","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 7","pages":"C3-C3"},"PeriodicalIF":23.2,"publicationDate":"2024-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10738011","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142540436","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Proceedings of the IEEE: Stay Informed. Become Inspired.","authors":"","doi":"10.1109/JPROC.2024.3477800","DOIUrl":"https://doi.org/10.1109/JPROC.2024.3477800","url":null,"abstract":"","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 7","pages":"C4-C4"},"PeriodicalIF":23.2,"publicationDate":"2024-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10738017","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142540437","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Yang Yang;Zhiwei Yin;Xuyi Zhu;Hani Al Jamal;Xiaojing Lv;Kexin Hu;Marvin Joshi;Nathan Wille;Mengze Li;Bing Zhang;Zhen Luo;Shlomo Magdassi;Manos Tentzeris
{"title":"A Review of Multimaterial Additively Manufactured Electronics and 4-D Printing/Origami Shape-Memory Devices: Design, Fabrication, and Implementation","authors":"Yang Yang;Zhiwei Yin;Xuyi Zhu;Hani Al Jamal;Xiaojing Lv;Kexin Hu;Marvin Joshi;Nathan Wille;Mengze Li;Bing Zhang;Zhen Luo;Shlomo Magdassi;Manos Tentzeris","doi":"10.1109/JPROC.2024.3471849","DOIUrl":"10.1109/JPROC.2024.3471849","url":null,"abstract":"Emerging additive manufacturing (AM) technologies, specifically additively manufactured electronics (AME), 4-D printing, and origami, are reshaping the design capabilities and functionalities of contemporary electronic devices. Cutting-edge 3-D/4-D printing technologies facilitate the prototyping and realization of complex electronic functions that are challenging to conventional methods. This article provides a comprehensive overview of the evolving techniques in AME, 4-D printing, and origami, employing multimaterials (conductive and dielectric materials) and shape-memory materials (SMMs) to fabricate functional electronic components and devices. Additionally, the overview delves into the state-of-the-art AME and 4-D-printed electronic components across diverse fields, including biomedical electronics, space engineering, and the advancements in the next-generation wireless communications and sensing.","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 8","pages":"954-999"},"PeriodicalIF":23.2,"publicationDate":"2024-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10733954","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142488360","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"3-D Printing and Gallium-Based Liquid Metal Technologies for Microwave and Millimeter-Wave Components","authors":"Hervé Aubert;Dominique Henry;Patrick Pons","doi":"10.1109/JPROC.2024.3459072","DOIUrl":"10.1109/JPROC.2024.3459072","url":null,"abstract":"This article presents an overview of 3-D-printed microwave and millimeter-wave components integrating gallium-based (Ga-based) liquid metal (LM). The LM is considered here as a fourth degree of freedom for the design of 3-D-printed antennas, filters, and wireless sensors. The 3-D printing combined with LM technology can be considered as a 4-D printing technology. It can benefit from the advantages offered by 3-D printing technologies (low cost and fast manufacturing) and LM at room temperature (flexibility and reconfigurability). To date, in microwave and millimeter-wave applications, 4-D printing technology is mainly used to achieve the metallization and/or reconfigurability and/or mechanical flexibility of high-frequency 3-D-printed components.","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 8","pages":"1051-1064"},"PeriodicalIF":23.2,"publicationDate":"2024-09-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142321588","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Get in the Conversation","authors":"","doi":"10.1109/JPROC.2024.3445523","DOIUrl":"10.1109/JPROC.2024.3445523","url":null,"abstract":"","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 6","pages":"612-612"},"PeriodicalIF":23.2,"publicationDate":"2024-08-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10654606","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142089918","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Proceedings of the IEEE: Stay Informed. Become Inspired.","authors":"","doi":"10.1109/JPROC.2024.3444515","DOIUrl":"10.1109/JPROC.2024.3444515","url":null,"abstract":"","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 6","pages":"C4-C4"},"PeriodicalIF":23.2,"publicationDate":"2024-08-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10654654","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142090358","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Proceedings of the IEEE Publication Information","authors":"","doi":"10.1109/JPROC.2024.3444447","DOIUrl":"10.1109/JPROC.2024.3444447","url":null,"abstract":"","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 6","pages":"C2-C2"},"PeriodicalIF":23.2,"publicationDate":"2024-08-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10654611","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142089917","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"TechRxiv","authors":"","doi":"10.1109/JPROC.2024.3445521","DOIUrl":"10.1109/JPROC.2024.3445521","url":null,"abstract":"","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 6","pages":"611-611"},"PeriodicalIF":23.2,"publicationDate":"2024-08-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10654659","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142090210","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}